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W9751G6NB-25 - Winbond

Description: 512Mb DDR2 SDRAM 800MHz VFBGA84

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PCB Footprints
W9751G6NB-25 - Winbond PCB footprint - BGA - BGA - Package Outline VFBGA84 Ball (8x12.5 mm2 , ball pitch: 0.8mm)
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3D Models
W9751G6NB-25 - Winbond  - 3D model - BGA - Package Outline VFBGA84 Ball (8x12.5 mm2 , ball pitch: 0.8mm)
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W9751G6NB-25 Details

  • Manufacturer Part Number:

    W9751G6NB-25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    VFBGA-84

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.28

  • Manufacturer:

    Winbond Electronics Corp

  • YTEOL:

    4

  • Access Mode:

    FOUR BANK PAGE BURST

  • Access Time-Max:

    0.4 ns

  • Additional Feature:

    AUTO/SELF REFRESH

  • Clock Frequency-Max (fCLK):

    400 MHz

  • I/O Type:

    COMMON

  • Interleaved Burst Length:

    4,8

  • JESD-30 Code:

    R-PBGA-B84

  • Length:

    12.5 mm

  • Memory Density:

    536870912 bit

  • Memory IC Type:

    DDR2 DRAM

  • Memory Width:

    16

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    84

  • Number of Words:

    33554432 words

  • Number of Words Code:

    32000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Organization:

    32MX16

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA84,9X15,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    1 mm

  • Self Refresh:

    YES

  • Sequential Burst Length:

    4,8

  • Standby Current-Max:

    0.008 A

  • Supply Current-Max:

    0.12 mA

  • Supply Voltage-Max (Vsup):

    1.9 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    8 mm

W9751G6NB-25 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the W9751G6NB-25 is -40°C to 85°C.
  • The power-up and power-down sequences for the W9751G6NB-25 should be handled according to the recommended power-up and power-down sequences outlined in the datasheet, which involves a specific sequence of voltage application and removal to ensure proper device operation.
  • The recommended PCB layout and routing for the W9751G6NB-25 involves following the guidelines outlined in the datasheet, which includes using a 4-layer PCB, placing decoupling capacitors near the device, and using a solid ground plane to minimize noise and ensure signal integrity.
  • To troubleshoot issues with the W9751G6NB-25, engineers can use tools such as logic analyzers and oscilloscopes to capture and analyze signals, and consult the datasheet and application notes for guidance on troubleshooting common issues.
  • The W9751G6NB-25 has built-in ESD protection, but engineers should still follow proper ESD handling procedures, such as using anti-static wrist straps and mats, to prevent damage to the device during handling and assembly.

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W9751G6NB-25 Overview

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