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XC6SLX16-2CSG324I - AMD

Description: FPGA - Field Programmable Gate Array XC6SLX16-2CSG324I

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XC6SLX16-2CSG324I Details

  • Manufacturer Part Number:

    XC6SLX16-2CSG324I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    15 X 15 MM, 0.80 MM PITCH, LEAD FREE, BGA-324

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    4

  • Clock Frequency-Max:

    667 MHz

  • Combinatorial Delay of a CLB-Max:

    0.26 ns

  • JESD-30 Code:

    S-PBGA-B324

  • JESD-609 Code:

    e1

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    1139

  • Number of Inputs:

    232

  • Number of Logic Cells:

    14579

  • Number of Outputs:

    232

  • Number of Terminals:

    324

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1139 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA324,18X18,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.5 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 40 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    15 mm

XC6SLX16-2CSG324I Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC6SLX16-2CSG324I is dependent on the specific design and implementation, but Xilinx recommends a maximum clock frequency of 350 MHz for most applications.
  • The XC6SLX16-2CSG324I has a built-in DDR3 memory controller that can be implemented using the Xilinx MIG (Memory Interface Generator) tool. The MIG tool provides a GUI-based interface to generate the necessary IP cores and constraints for the DDR3 memory interface.
  • The power consumption of the XC6SLX16-2CSG324I depends on the specific design and implementation. However, Xilinx provides a power estimator tool that can be used to estimate the power consumption based on the design requirements. Typically, the power consumption of the XC6SLX16-2CSG324I ranges from 1-5 watts.
  • The XC6SLX16-2CSG324I has a built-in PCIe endpoint block that can be used to implement a PCIe interface. Xilinx provides a PCIe IP core that can be used to implement a PCIe interface, and the Xilinx PCIe core can be configured to support different PCIe speeds and lane configurations.
  • The XC6SLX16-2CSG324I has a total of 240 user I/Os, which can be configured as inputs, outputs, or bidirectional signals.

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XC6SLX16-2CSG324I Overview

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Image Part Number Model
Part Image XC6SLX16-2CSG324C AMD Xilinx

Field Programmable Gate Array, 1139 CLBs, 667MHz, 14579-Cell, CMOS, PBGA324

Part Image XC6SLX16-2CSG324I AMD Xilinx

Field Programmable Gate Array, 1139 CLBs, 667MHz, 14579-Cell, CMOS, PBGA324

Part Image XC6SLX16-2CSG324C AMD

Field Programmable Gate Array, 1139 CLBs, 667MHz, 14579-Cell, CMOS, PBGA324