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XC6SLX25-2CSG324I - AMD

Description: XILINX - XC6SLX25-2CSG324I - FPGA, SPARTAN-6, 226 I/O, CSBGA-324

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XC6SLX25-2CSG324I - AMD PCB footprint - BGA - BGA - 324 Ball Chip-Scale BGA (CSG324) Package,
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XC6SLX25-2CSG324I - AMD  - 3D model - BGA - 324 Ball Chip-Scale BGA (CSG324) Package,
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XC6SLX25-2CSG324I Details

  • Manufacturer Part Number:

    XC6SLX25-2CSG324I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    15 X 15 MM, 0.80 MM PITCH, LEAD FREE, BGA-324

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    4

  • Clock Frequency-Max:

    667 MHz

  • Combinatorial Delay of a CLB-Max:

    0.26 ns

  • JESD-30 Code:

    S-PBGA-B324

  • JESD-609 Code:

    e1

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    1879

  • Number of Inputs:

    226

  • Number of Logic Cells:

    24051

  • Number of Outputs:

    226

  • Number of Terminals:

    324

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1879 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA324,18X18,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.5 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 40 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    15 mm

XC6SLX25-2CSG324I Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC6SLX25 is dependent on the specific design and implementation, but Xilinx recommends a maximum clock frequency of 350 MHz for most applications.
  • The XC6SLX25 has a built-in DDR3 memory controller, and Xilinx provides a DDR3 memory interface IP core that can be used to implement a DDR3 memory interface. The IP core is available in the Vivado Design Suite.
  • The power consumption of the XC6SLX25 depends on the specific design and implementation, but Xilinx provides power estimation tools in the Vivado Design Suite to help estimate power consumption. Typical power consumption for the XC6SLX25 is around 1-2 watts.
  • Yes, the XC6SLX25 is suitable for high-reliability applications, such as aerospace, defense, and industrial control systems. Xilinx provides a range of tools and resources to support high-reliability design, including fault-tolerant design flows and radiation-hardened devices.
  • Xilinx provides a range of security features and tools to help secure designs on the XC6SLX25, including bitstream encryption, secure boot, and secure key storage. Additionally, Xilinx recommends following best practices for secure design, such as using secure protocols and encrypting sensitive data.

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XC6SLX25-2CSG324I Overview

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Part Image XC6SLX25-2CSG324I AMD Xilinx

Field Programmable Gate Array, 1879 CLBs, 667MHz, 24051-Cell, CMOS, PBGA324