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XC6SLX45-2CSG484C - AMD

Description: XILINX - XC6SLX45-2CSG484C - FPGA, SPARTAN-6 LX, 43K, 484FGBGA

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XC6SLX45-2CSG484C - AMD PCB footprint - BGA - BGA - CSG484 - Wire-Bond Chip-Scale BGA (0.8 mm Pitch)
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XC6SLX45-2CSG484C - AMD  - 3D model - BGA - CSG484 - Wire-Bond Chip-Scale BGA (0.8 mm Pitch)
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XC6SLX45-2CSG484C Details

  • Manufacturer Part Number:

    XC6SLX45-2CSG484C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FBGA, BGA484,22X22,32

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    4

  • Clock Frequency-Max:

    667 MHz

  • Combinatorial Delay of a CLB-Max:

    0.26 ns

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    19 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    3411

  • Number of Inputs:

    310

  • Number of Logic Cells:

    43661

  • Number of Outputs:

    310

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    85 °C

  • Organization:

    3411 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA484,22X22,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.8 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 40 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    19 mm

XC6SLX45-2CSG484C Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC6SLX45-2CSG484C is 350 MHz, but it depends on the specific application and design implementation.
  • The XC6SLX45-2CSG484C has a built-in Memory Interface Generator (MIG) that supports DDR3 memory interfaces. You can use the MIG tool in Xilinx ISE or Vivado to generate the necessary IP cores and implement the DDR3 interface.
  • The power consumption of the XC6SLX45-2CSG484C depends on the specific design implementation, clock frequency, and operating conditions. However, according to the datasheet, the typical static power consumption is around 1.2W, and the dynamic power consumption can range from 2.5W to 10W or more, depending on the design.
  • Yes, the XC6SLX45-2CSG484C has built-in transceivers that support high-speed serial interfaces like PCIe, SATA, and others. You can use the FPGA's GTX transceivers to implement these interfaces, but you'll need to ensure that your design meets the specific protocol requirements and timing constraints.
  • You can use Xilinx's ChipScope Pro or Vivado Logic Analyzer to debug and test your design on the XC6SLX45-2CSG484C. These tools allow you to capture and analyze signals, set breakpoints, and perform other debugging tasks.

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XC6SLX45-2CSG484C Overview

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Image Part Number Model
Part Image XC6SLX45-2CSG484C AMD Xilinx

Field Programmable Gate Array, 3411 CLBs, 667MHz, 43661-Cell, CMOS, PBGA484

Part Image XC6SLX45-2CS484C AMD Xilinx

Field Programmable Gate Array, 667MHz, 43661-Cell, CMOS, PBGA484

Part Image XC6SLX45-2CS484I AMD Xilinx

Field Programmable Gate Array, 667MHz, 43661-Cell, CMOS, PBGA484

Part Image XC6SLX45-2CS484I AMD

Field Programmable Gate Array, 3411 CLBs, 667MHz, 43661-Cell, CMOS, PBGA484

Part Image XC6SLX45-2CS484C AMD

Field Programmable Gate Array, 3411 CLBs, 667MHz, 43661-Cell, CMOS, PBGA484

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