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- Part Number XC7K70T-2FBG676C
- Manufacturer AMD
- Pin Count 676
- Part Category Integrated Circuit
- Package Category BGA
- Footprint Name BGA - FBG676
- Released Date Mar 15, 2022
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
XC7K70T-2FBG676C Details
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Manufacturer Part Number:
XC7K70T-2FBG676C
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
BGA-676
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HTS Code:
8542.31.00.60
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Factory Lead Time:
16 Weeks
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Manufacturer:
AMD
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YTEOL:
14
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Clock Frequency-Max:
1286 MHz
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Combinatorial Delay of a CLB-Max:
0.25 ns
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JESD-30 Code:
S-PBGA-B676
XC7K70T-2FBG676C Frequently Asked Questions (FAQs)
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The maximum operating frequency of the XC7K70T-2FBG676C is dependent on the specific design and implementation, but Xilinx recommends a maximum clock frequency of 350 MHz for most applications.
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Xilinx provides a DDR3 memory interface IP core that can be used to implement a DDR3 memory interface on the XC7K70T-2FBG676C. The IP core is available in the Vivado Design Suite and can be customized to meet specific design requirements.
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The power consumption of the XC7K70T-2FBG676C depends on the specific design and implementation, as well as the operating frequency and voltage. Xilinx provides power estimation tools and documentation to help estimate power consumption for a given design.
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Yes, the XC7K70T-2FBG676C is suitable for high-reliability applications, such as aerospace, defense, and industrial control systems. Xilinx provides a range of resources and tools to support the development of high-reliability systems, including fault-tolerant design flows and radiation-hardened devices.
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Xilinx provides a range of security features and tools to help secure designs on the XC7K70T-2FBG676C, including bitstream encryption, secure boot, and anti-tamper features. Additionally, Xilinx recommends following best practices for secure design, such as using secure protocols and encrypting sensitive data.
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XC7K70T-2FBG676C Overview
Use the download button to access the XC7K70T-2FBG676C schematic symbol, PCB footprint, and 3D model.
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