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XCKU035-1SFVA784I - AMD

Description: IC FPGA 468 I/O 784FCBGA

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PCB Footprints
XCKU035-1SFVA784I - AMD PCB footprint - BGA - BGA - SFVA784
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3D Models
XCKU035-1SFVA784I - AMD  - 3D model - BGA - SFVA784
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XCKU035-1SFVA784I Details

  • Manufacturer Part Number:

    XCKU035-1SFVA784I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-784

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B784

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Number of CLBs:

    25391

  • Number of Inputs:

    520

  • Number of Logic Cells:

    444343

  • Number of Outputs:

    520

  • Number of Terminals:

    784

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    25391 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA784,28X28,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.52 mm

  • Supply Voltage-Max:

    0.979 V

  • Supply Voltage-Min:

    0.922 V

  • Supply Voltage-Nom:

    0.95 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

XCKU035-1SFVA784I Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCKU035-1SFVA784I is approximately 12W, depending on the operating frequency, voltage, and usage of the device.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, reduce clock frequencies, and use low-power modes when possible. Additionally, optimize your design to minimize switching activity and use the lowest possible voltage.
  • The maximum operating frequency of the XCKU035-1SFVA784I is 500 MHz, but this can vary depending on the specific implementation, clocking scheme, and operating conditions.
  • To ensure signal integrity, use the Xilinx Vivado Design Suite to analyze and optimize your design for signal integrity. This includes using the IP Integrator to create a robust clocking scheme, adding termination resistors, and using the Signal Integrity Wizard to analyze and fix signal integrity issues.
  • The recommended PCB layout and stackup for the XCKU035-1SFVA784I can be found in the Xilinx UG583 document, which provides guidelines for PCB design, layer stackup, and routing. It's essential to follow these guidelines to ensure signal integrity, power integrity, and thermal management.

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XCKU035-1SFVA784I Overview

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