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XCKU035-2FBVA676I - AMD

Description: FPGA - Field Programmable Gate Array XCKU035-2FBVA676I

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XCKU035-2FBVA676I - AMD PCB footprint - BGA - BGA - FBVA676
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XCKU035-2FBVA676I - AMD  - 3D model - BGA - FBVA676
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XCKU035-2FBVA676I Details

  • Manufacturer Part Number:

    XCKU035-2FBVA676I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-676

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B676

  • JESD-609 Code:

    e1

  • Length:

    27 mm

  • Number of CLBs:

    1700

  • Number of Inputs:

    520

  • Number of Logic Cells:

    444343

  • Number of Outputs:

    520

  • Number of Terminals:

    676

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1700 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA676,26X26,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.71 mm

  • Supply Voltage-Max:

    0.979 V

  • Supply Voltage-Min:

    0.922 V

  • Supply Voltage-Nom:

    0.95 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    27 mm

XCKU035-2FBVA676I Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCKU035-2FBVA676I is approximately 12W, but it can vary depending on the specific design, clock frequency, and operating conditions.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, reduce clock frequencies, and use low-power modes when possible. Additionally, consider using the AMD-provided power-optimized IP cores and following the Xilinx Power Management Guide.
  • The XCKU035-2FBVA676I has an industrial temperature range of -40°C to 100°C, making it suitable for a wide range of applications, including those in harsh environments.
  • Yes, the XCKU035-2FBVA676I is suitable for high-reliability applications, such as aerospace, defense, and medical devices, due to its rugged design, error correction capabilities, and compliance with various industry standards (e.g., DO-254, IEC 61508).
  • To ensure signal integrity, follow the Xilinx Signal Integrity Guide, use the Vivado Design Suite's signal integrity analysis tools, and consider using differential signaling, termination, and shielding to minimize noise and crosstalk.

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XCKU035-2FBVA676I Overview

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Part Image XCKU035-2FBVA676E AMD Xilinx

Field Programmable Gate Array, 1700 CLBs, 444343-Cell, PBGA676