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XCKU035-2FBVA900I - AMD

Description: IC FPGA 468 I/O 900FCBGA

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PCB Footprints
XCKU035-2FBVA900I - AMD PCB footprint - BGA - BGA - FBVA900 Bare-die Flip-Chip, Fine-Pitch BGA (XCKU035 and XCKU040)
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3D Models
XCKU035-2FBVA900I - AMD  - 3D model - BGA - FBVA900 Bare-die Flip-Chip, Fine-Pitch BGA (XCKU035 and XCKU040)
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XCKU035-2FBVA900I Details

  • Manufacturer Part Number:

    XCKU035-2FBVA900I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-900

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B900

  • JESD-609 Code:

    e1

  • Length:

    31 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    1700

  • Number of Inputs:

    520

  • Number of Logic Cells:

    444343

  • Number of Outputs:

    520

  • Number of Terminals:

    900

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1700 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA900,30X30,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.8 mm

  • Supply Voltage-Max:

    0.979 V

  • Supply Voltage-Min:

    0.922 V

  • Supply Voltage-Nom:

    0.95 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    31 mm

XCKU035-2FBVA900I Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCKU035-2FBVA900I is approximately 12W, but it can vary depending on the specific design, clock frequency, and operating conditions.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, reduce clock frequencies, and use low-power modes when possible. Additionally, consider using the AMD-provided power-optimized IP cores and following the Xilinx Power Management Guide.
  • The maximum operating temperature of the XCKU035-2FBVA900I is 100°C (industrial grade) or 125°C (extended temperature range). However, it's recommended to operate the device within the specified temperature range to ensure optimal performance and reliability.
  • To ensure signal integrity, follow the Xilinx Signal Integrity Guidelines, use the IBIS-AMI models, and perform signal integrity analysis using tools like the Xilinx Signal Integrity Wizard. Additionally, consider using differential signaling, and ensure proper termination and routing of high-speed signals.
  • The recommended PCB layout and stackup for the XCKU035-2FBVA900I can be found in the Xilinx PCB Design Guide. In general, use a 4-6 layer stackup, follow the Xilinx-provided PCB layout guidelines, and ensure proper decoupling, routing, and thermal management.

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XCKU035-2FBVA900I Overview

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