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XCKU085-3FLVA1517E - AMD

Description: IC FPGA 624 I/O 1517FCBGA

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XCKU085-3FLVA1517E - AMD - PCB symbol
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PCB Footprints
XCKU085-3FLVA1517E - AMD PCB footprint - BGA - BGA - FLVA1517
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XCKU085-3FLVA1517E - AMD - 3D model - BGA - FLVA1517
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XCKU085-3FLVA1517E Details

  • Manufacturer Part Number:

    XCKU085-3FLVA1517E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-1517

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B1517

  • JESD-609 Code:

    e1

  • Length:

    40 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    62190

  • Number of Inputs:

    676

  • Number of Logic Cells:

    1088325

  • Number of Outputs:

    676

  • Number of Terminals:

    1517

  • Operating Temperature-Max:

    100 °C

  • Organization:

    62190 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1517,39X39,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.09 mm

  • Supply Voltage-Max:

    1.03 V

  • Supply Voltage-Min:

    0.97 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    40 mm

XCKU085-3FLVA1517E Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCKU085-3FLVA1517E is approximately 12W, but it can vary depending on the design, clock frequency, and operating conditions.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, reduce clock frequencies, and use low-power modes. Additionally, consider using the AMD-provided power-optimized IP cores and implementing power-aware design techniques.
  • The maximum operating temperature of the XCKU085-3FLVA1517E is 100°C (industrial grade) or 125°C (extended temperature range). However, it's recommended to operate the device within the recommended temperature range of 0°C to 85°C for optimal performance and reliability.
  • To ensure signal integrity, follow the guidelines in the Xilinx PCB Design Guide, use controlled impedance routing, and implement signal termination and buffering as needed. Additionally, use the Xilinx Vivado Design Suite to analyze and optimize signal integrity.
  • The recommended PCB stackup for the XCKU085-3FLVA1517E is a 4-layer or 6-layer stackup with a minimum of 1 oz copper thickness. The stackup should include a solid ground plane, a power plane, and signal layers with controlled impedance routing.

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XCKU085-3FLVA1517E Overview

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XCKU085-3FLVA1517E Alternates

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Part Image XCKU085-3FLVA1517I AMD

Field Programmable Gate Array, 62190 CLBS, 1088325-Cell, PBGA1517
Part Image XCKU085-3FLVA1517I AMD Xilinx

Field Programmable Gate Array, 62190 CLBS, 1088325-Cell, PBGA1517