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XR17D152IM-F - MaxLinear, Inc.

Description: UART Interface IC UART

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XR17D152IM-F - MaxLinear, Inc. - PCB symbol
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PCB Footprints
XR17D152IM-F - MaxLinear, Inc. PCB footprint - Quad Flat Packages - Quad Flat Packages - TQFP100
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3D Models
XR17D152IM-F - MaxLinear, Inc. - 3D model - Quad Flat Packages - TQFP100
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XR17D152IM-F Details

  • Manufacturer Part Number:

    XR17D152IM-F

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    14 X 14 MM, 1 MM HEIGHT, GREEN, TQFP-100

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    MaxLinear Inc

  • YTEOL:

    0

  • Additional Feature:

    ALSO OPERATES AT 3.3 V SUPPLY AT 33MHZ

  • Address Bus Width:

    32

  • Boundary Scan:

    NO

  • Bus Compatibility:

    PCI

  • Clock Frequency-Max:

    50 MHz

  • Communication Protocol:

    ASYNC, BIT

  • Data Encoding/Decoding Method:

    NRZ

  • Data Transfer Rate-Max:

    0.78125 MBps

  • External Data Bus Width:

    32

  • JESD-30 Code:

    S-PQFP-G100

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Low Power Mode:

    YES

  • Number of Serial I/Os:

    2

  • Number of Terminals:

    100

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFQFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

XR17D152IM-F Frequently Asked Questions (FAQs)

  • For optimal performance, it's recommended to follow a 4-layer PCB stack-up with a solid ground plane, and to use thermal vias to dissipate heat. A heat sink or thermal pad can also be used to improve thermal management.
  • To ensure signal integrity and minimize EMI, use a differential pair for clock and data signals, keep signal traces short and away from noise sources, and use shielding or guard traces to reduce radiation. Also, follow the recommended layout guidelines in the datasheet.
  • The XR17D152IM-F requires a specific power sequencing and reset timing to ensure proper operation. Refer to the datasheet for the recommended power-up and reset timing diagrams, and ensure that your design meets these requirements.
  • For troubleshooting and debugging, use a logic analyzer or oscilloscope to capture signal waveforms, and verify that the device is receiving the correct clock and data signals. Also, check the device's status registers and error flags to identify potential issues.
  • The recommended settings for the device's internal registers and configuration can be found in the datasheet or application notes. It's essential to follow these recommendations to ensure optimal performance and prevent device malfunction.

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XR17D152IM-F Overview

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