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IHLP2020CZER1R5M51
Vishay
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1 | IHLP® Automotive Inductors, High Temperature (180 °C) Series | Inductors Precision Moulded | IHLP2020CZER1R5M51 |
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IHLP3232CZER1R5M01
Vishay
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1 | • Shielded construction• Excellent DC/DC energy storage up to 5 MHz.Filter inductor applications up to SRF (see“Standard Electrical Specifications” table)• Operating temperature up to 125 °C• Lowest DCR/μH, in this package size• Handles high transient current spikes withoutsaturatio | Inductors Precision Moulded | IHLP3232CZER1R5M01 |
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HPCR0402-R-1R20FT
Venkel
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1 | High Power CR,0402,1/8W,1.2R,±1% | Resistor Chip | HPCR0402-R-1R20FT |
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R1RW0416DGE-2PI#B1
Renesas Electronics
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1 | The R1RW0416DI is a 4-Mbit High-Speed static RAM organized 256-kword × 16-bit. It has realized High-Speed access time by employing CMOS process (6-transistor memory cell) and High-Speed circuit designing technology. It is most appropriate for the application which requires High-Speed, high density memory and wide bit width configuration, such as cache and buffer memory in system. The R1RW0416DI is packaged in 400-mil 44-pin SOJ and 400-mil 44-pin plastic TSOPII for high density surface mounting. | Other | R1RW0416DGE-2PI#B1 |
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R1RP0416DSB-2LR#D1
Renesas Electronics
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1 | The R1RP0416D Series is a 4-Mbit High-Speed static RAM organized 256-k word × 16-bit. It has realized High-Speed access time by employing CMOS process (6-transistor memory cell) and High-Speed circuit designing technology. It is most appropriate for the application which requires High-Speed, high density memory and wide bit width configuration, such as cache and buffer memory in system. It is packaged in 400-mil 44-pin plastic SOJ and 400-mil 44-pin plastic TSOPII. | Small Outline Packages | R1RP0416DSB-2LR#D1 |
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R1RW0416DSB-2SR#D1
Renesas Electronics
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0 | The R1RW0416D is a 4-Mbit High-Speed static RAM organized 256-kword × 16-bit. It has realized High-Speed access time by employing CMOS process (6-transistor memory cell) and High-Speed circuit designing technology. It is most appropriate for the application which requires High-Speed, high density memory and wide bit width configuration, such as cache and buffer memory in system. Especially, LVersion and S-Version are low power consumption and it is the best for the battery backup system. The package prepare | Small Outline Packages | R1RW0416DSB-2SR#D1 |
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FP1107R1-R15-R
Eaton
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1 | 150 nH Unshielded Drum Core, Wirewound Inductor 55 A 0.29mOhm Nonstandard | Other | FP1107R1-R15-R |
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R1RP0416DSB-2PI#D0
Renesas Electronics
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1 | The R1RP0416DI Series is a 4-Mbit High-Speed static RAM organized 256-k word × 16-bit. It has realized High-Speed access time by employing CMOS process (6-transistor memory cell) and High-Speed circuit designing technology. It is most appropriate for the application which requires High-Speed, high density memory and wide bit width configuration, such as cache and buffer memory in system. It is packaged in 400-mil 44-pin plastic SOJ and 400-mil 44-pin plastic TSOPII. | Small Outline Packages | R1RP0416DSB-2PI#D0 |
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R1RW0408DGE-2PI#B1
Renesas Electronics
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1 | The R1RW0408DI is a 4-Mbit High-Speed static RAM organized 512-kword × 8-bit. It has realized High-Speed access time by employing CMOS process (6-transistor memory cell) and High-Speed circuit designing technology. It is most appropriate for the application which requires High-Speed, high density memory and wide bit width configuration, such as cache and buffer memory in system. The R1RW0408DI is packaged in 400-mil 36-pin SOJ for high density surface mounting. | Other | R1RW0408DGE-2PI#B1 |
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CRG0805-R-1R13FT
Venkel
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1 | RoHS 6/6 Green CR,0805,1/8W,1.13R,±1% | Other | CRG0805-R-1R13FT |
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HPCR0402-R-1R58FT
Venkel
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1 | High Power CR,0402,1/8W,1.58R,±1% | Resistor Chip | HPCR0402-R-1R58FT |
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R1RW0416DSB-2PI#D0
Renesas Electronics
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1 | The R1RW0416DI is a 4-Mbit High-Speed static RAM organized 256-kword × 16-bit. It has realized High-Speed access time by employing CMOS process (6-transistor memory cell) and High-Speed circuit designing technology. It is most appropriate for the application which requires High-Speed, high density memory and wide bit width configuration, such as cache and buffer memory in system. The R1RW0416DI is packaged in 400-mil 44-pin SOJ and 400-mil 44-pin plastic TSOPII for high density surface mounting. | Small Outline Packages | R1RW0416DSB-2PI#D0 |
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CRG0805-R-1R15FT
Venkel
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1 | RoHS 6/6 Green CR,0805,1/8W,1.15R,±1% | Other | CRG0805-R-1R15FT |
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HPCR0402-R-1R60FT
Venkel
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1 | High Power CR,0402,1/8W,1.6R,±1% | Resistor Chip | HPCR0402-R-1R60FT |
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HPCR0402-R-1R33FT
Venkel
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1 | High Power CR,0402,1/8W,1.33R,±1% | Resistor Chip | HPCR0402-R-1R33FT |
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HPCR0402-R-1R37FT
Venkel
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1 | High Power CR,0402,1/8W,1.37R,±1% | Resistor Chip | HPCR0402-R-1R37FT |
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IHLP2525CZER1R0M06
Vishay
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1 | Inductor Power Shielded Wirewound 1uH 20% 100KHz Powdered Iron 11A 0.00884Ohm DCR 2525 T/R | Inductors Precision Moulded | IHLP2525CZER1R0M06 |
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CRG0805-R-1R37FT
Venkel
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1 | RoHS 6/6 Green CR,0805,1/8W,1.37R,±1% | Other | CRG0805-R-1R37FT |
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HPCR0402-R-1R02FT
Venkel
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1 | High Power CR,0402,1/8W,1.02R,±1% | Resistor Chip | HPCR0402-R-1R02FT |
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IHLE2020CDER1R5M51
Vishay
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1 | IHLE? High Current Inductor With E-Field Shield 1.5 µH 7.9 A 19.8mOhm Max | Other | IHLE2020CDER1R5M51 |
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TLC2272AMDRG4
Texas Instruments
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1 | Advanced LinCMOS™ rail-to-rail dual precision operational amplifier with wide temperature r | Small Outline Packages | TLC2272AMDRG4 |
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JE2835AWT-R-U50GA0000-N0000001
CREE LED
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1 | Mid-Power LEDs - White White 5000 K 90-CRI, 2835 Size, R Class | Other | JE2835AWT-R-U50GA0000-N0000001 |
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39512-1005
Molex
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1 | Pluggable Terminal Blocks 3.81MM EURO HEADER R O HEADER RA BLK 5CKT | Other | 39512-1005 |
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RC422-200-221-4100
Molex
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1 | Rectangular MIL Spec Connectors CONNECTOR, R SERIES Current Rating:t3 A Insulation Resistance:5 GOhms,Voltage Rating:t250 V | Other | RC422-200-221-4100 |
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AWRL1432BBAAMFRQ1
Texas Instruments
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1 | RF Transceiver Single-chip low-powe r 76GHz to 81GHz au , -40°C ~ 125°C | BGA | AWRL1432BBAAMFRQ1 |
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