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50830 Model Download Search Results

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Image Part Number D.S Description Package Category Prices / Stock Model Action
Image Part Number D.S Description Package Category Prices / Stock Model Action
Part Image Part Image
50830 Amphenol Communications Solutions
1 Board Connector, Receptacle, 50830 0 Build or Request
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50830 TE's AMP
1 0.24mm2, COPPER ALLOY, NICKEL FINISH, RING TERMINAL, ROHS COMPLIANT 50830 0 Build or Request
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50830 TE Connectivity
1 Body Features: Product Weight 4.536 G | Configuration Features: Number of Holes 1 | Contact Features: Terminal Orientation Straight | Terminal Plating Material Nickel | Barrel Type Closed | Dimensions: Stud Diameter 3.68 MM | Compatible Insulation Diameter (Max) .082 INCH | Compatible Insulation Diameter (Max) 2.08 MM | Wire Size 26 – 24 AWG | Tongue Thickness .5 MM | Wire Size .12 – .24 MMSQ | Stud Diameter .145 INCH | Product Length 18.8 MM | Compatible Insulation Diameter Range .032 – .082 INCH | T 50830 1 Download Model
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50830 HELUKABEL
1 Wire And Cable, 1 Conductor(s), 00AWG, 1000V, Flexible Cord And Fixture Wire, 50830 0 Build or Request
Part Image Part Image 1 Headers & Wire Housings 2.0 WtB Plg Hsg Assy Plg Hsg Assy RA 8Ckt Other 55935-0830 1 Download Model
Part Image Part Image
350830-1 TE Connectivity
1 Configuration Features: Number of Positions 15 | PCB Mount Orientation Vertical | Number of Power Positions 15 | Number of Rows 3 | Contact Features: Contact Current Rating (Max) 19 AMP | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Layout Matrix | Contact Current Rating (Max) 12 AMP | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Underplating Material Thickness 1.27 MICM | Contact Mating Area Plating Mat Other 350830-1 1 Download Model
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5083050 RS Pro
1 RS Pro 64 Way 2.54mm Pitch, Type B Class C1, 2 Row a/b, Right Angle DIN 41612 Connector, Plug, Solder Other 5083050 1 Download Model
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TPS650830ZCGT Texas Instruments
1 Power Management Specialised - PMIC Prog Wide Input Volt Pwr Mngt IC BGA TPS650830ZCGT 1 Download Model
Part Image Part Image
6450830-1 TE Connectivity
This part was updated within the past 30 days.
Set alerts for model updates on the part download page.
1 Configuration Features: PCB Mount Orientation Right Angle | Number of Signal Positions 8 | Number of Positions 12 | Number of Power Positions 4 | Number of Rows 4 | Contact Features: Contact Mating Area Plating Material Thickness 3 MICIN | Contact Retention Within Housing Without | Contact Underplating Material Nickel | Contact Type Pin | Contact Type Blade | Power Contact Base Material Tin | Contact Current Rating (Max) 50 AMP | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | PCB Co Other 6450830-1 1 Download Model
Part Image Part Image 1 CLIK-MATE1.5 SRVT SMT AU0.38 ETP 8P NAT Other 213225-0830 1 Download Model
Part Image Part Image
TPS650830ZAJT Texas Instruments
1 Programmable Mid-Input Voltage Range Power Management IC (PMIC) for Skylake Processors BGA TPS650830ZAJT 1 Download Model
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2-6450830-8 TE Connectivity
1 Configuration Features: Number of Signal Positions 20 | Number of Rows 4 | PCB Mount Orientation Right Angle | Number of Positions 24 | Number of Power Positions 4 | Contact Features: Contact Underplating Material Thickness 50 MICIN | Contact Mating Area Plating Material Thickness 3 MICIN | Contact Underplating Material Thickness 2.87 MICM | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Type Blade | Contact Underplating Material Nickel | Contact Type Pin | Power Contact Bas Other 2-6450830-8 1 Download Model
Part Image Part Image
6450830-1 TE Connectivity
This part was updated within the past 30 days.
Set alerts for model updates on the part download page.
1 Configuration Features: PCB Mount Orientation Right Angle | Number of Signal Positions 8 | Number of Positions 12 | Number of Power Positions 4 | Number of Rows 4 | Contact Features: Contact Mating Area Plating Material Thickness 3 MICIN | Contact Retention Within Housing Without | Contact Underplating Material Nickel | Contact Type Pin | Contact Type Blade | Power Contact Base Material Tin | Contact Current Rating (Max) 50 AMP | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | PCB Co Other 6450830-1 1 Download Model
Part Image Part Image 1 Crystals 25.000MHZ 8pF 10ppm -20C +70C Other ECS-250-8-30B-CKM 1 Download Model
Part Image Part Image
2-6450830-8 TE Connectivity
1 Configuration Features: Number of Signal Positions 20 | Number of Rows 4 | PCB Mount Orientation Right Angle | Number of Positions 24 | Number of Power Positions 4 | Contact Features: Contact Underplating Material Thickness 50 MICIN | Contact Mating Area Plating Material Thickness 3 MICIN | Contact Underplating Material Thickness 2.87 MICM | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Type Blade | Contact Underplating Material Nickel | Contact Type Pin | Power Contact Bas Other 2-6450830-8 1 Download Model
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TPS650830ZAJR Texas Instruments
1 Power Management Specialised - PMIC Program Wide Input V Powr Managt IC(PMIC) BGA TPS650830ZAJR 1 Download Model
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6450830-2 TE Connectivity
1 Configuration Features: PCB Mount Orientation Right Angle | Number of Signal Positions 24 | Number of Positions 33 | Number of Power Positions 9 | Number of Rows 4 | Mating & Unmating Configuration Sequencing | Contact Features: Contact Type Pin | Contact Type Blade | Contact Retention Within Housing Without | Contact Current Rating (Max) 50 AMP | Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | PCB Contact Termination Area Plating Material Tin | Other 6450830-2 1 Download Model
Part Image Part Image 1 1.50mm Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Single Row, Surface Mount, Vertical, 8 Circuits Other 2132250830 1 Download Model
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6450830-2 TE Connectivity
1 Configuration Features: PCB Mount Orientation Right Angle | Number of Signal Positions 24 | Number of Positions 33 | Number of Power Positions 9 | Number of Rows 4 | Mating & Unmating Configuration Sequencing | Contact Features: Contact Type Pin | Contact Type Blade | Contact Retention Within Housing Without | Contact Current Rating (Max) 50 AMP | Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | PCB Contact Termination Area Plating Material Tin | Other 6450830-2 1 Download Model
Part Image Part Image 1 2.00mm Pitch, Micro-Lock Plus PCB Header, Single Row, Vertical, Surface Mount, 0.38µm Gold Plating, Positive Lock, with Pick-and-Place Tape, 8 Circuits, Low-Halogen, Low-Halogen, Natural (White) Other 5055750830 1 Download Model
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50830-5102E Amphenol Communications Solutions
1 Board Connector, 306 Contact(s), 3 Row(s), Female, Right Angle, Solder Terminal, Receptacle, 50830-5102E 0 Build or Request
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50830-572E Amphenol FCi
1 Board Connector, 216 Contact(s), 3 Row(s), Female, Right Angle, Solder Terminal, Receptacle 50830-572E 0 Build or Request
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50830-190F Amphenol Communications Solutions
1 Board Connector, 270 Contact(s), 3 Row(s), Female, Right Angle, Solder Terminal, Receptacle, 50830-190F 0 Build or Request
Part Image Part Image
50830-190F Amphenol FCi
1 Board Connector, 270 Contact(s), 3 Row(s), Female, Right Angle, Solder Terminal, Receptacle 50830-190F 0 Build or Request
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50830-5387E Amphenol Communications Solutions
1 Board Connector, 387 Contact(s), 3 Row(s), Female, Right Angle, 0.1 inch Pitch, Solder Terminal, Guide Slot, Black Insulator, Plug, 50830-5387E 0 Build or Request
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