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ISL8016IR15Z
Renesas Electronics
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1 | The ISL8016 is a high efficiency, monolithic, synchronous step-down DC/DC converter that can deliver up to 6A continuous output current from a 2. 7V to 5. 5V input supply. The output voltage is adjustable from 0. 6V to VIN. With an adjustable current limit, reverse current protection, pre-bias start and over temperature protection the ISL8016 offers a highly robust power solution. It uses current control architecture to deliver fast transient response and excellent loop stability. The ISL8016 integrates a p | Quad Flat No-Lead | ISL8016IR15Z |
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6-103672-5
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Positions 16 | PCB Mount Orientation Right Angle | Number of Rows 1 | Contact Features: Contact Mating Area Length .23 INCH | Contact Base Material Brass | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 100 MICIN | Mating Square Post Dimension .64 MM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | P | Other | 6-103672-5 |
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932S200BFLF
Renesas Electronics
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1 | The IDT932S200 is a dual CPU clock generator for serverworks HE-T, HE-SL-T, LE-T chipsets for P III type processors in a Dual-CPU system. Single ended CPU clocks provide faster than 1.5V/ns transition times by parallel connection of 2 CPU pins to each processor. Spread Spectrum may be enabled by driving the SPREAD# pin active. Spread spectrum typically reduces system EMI by 8dB to 10dB. This simplifies EMI qualification without resorting to board design iterations or costly shielding. The IDT932S200 employs | Small Outline Packages | 932S200BFLF |
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R7FA2E2A33CNJ#UA1
Renesas Electronics
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1 | The RA2E2 Group is RA Family’s entry line single-chip microcontroller based on the 48-MHz Arm® Cortex®-M23 core with Renesas' innovative on-chip peripheral functions. RA2E2 Group offers ultra-low power operation and high speed serial communication with smallest package options of 20-pin and 24-pin QFN and 16-pin wafer-level CSP package, satisfying the needs of cost-sensitive and space-constrained applications. These RA2E2 Group microcontrollers enable extremely cost-effective designs for IoT sensor nodes, p | Quad Flat No-Lead | R7FA2E2A33CNJ#UA1 |
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R7FA2E2A73CNJ#UA1
Renesas Electronics
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1 | The RA2E2 Group is RA Family’s entry line single-chip microcontroller based on the 48-MHz Arm® Cortex®-M23 core with Renesas' innovative on-chip peripheral functions. RA2E2 Group offers ultra-low power operation and high speed serial communication with smallest package options of 20-pin and 24-pin QFN and 16-pin wafer-level CSP package, satisfying the needs of cost-sensitive and space-constrained applications. These RA2E2 Group microcontrollers enable extremely cost-effective designs for IoT sensor nodes, p | Quad Flat No-Lead | R7FA2E2A73CNJ#UA1 |
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1830350
Phoenix Contact
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1 | PCB header, nominal cross section: 1.5 mm?, color: green, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Tin, type of contact: Male connector, Number of potentials: 24, Number of rows: 2, Number of positions per row: 12, number of connections: 24, product range: MCDV 1,5/..-GF, pitch: 3.81 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.4 mm, Stecksystem: MINI COMBICON, Locking: Screw locking, type of packaging: packed in cardboard, In combination with MCV p | Other | 1830350 |
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ISL28413FBZ
Renesas Electronics
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1 | The ISL28113, ISL28213 and ISL28413 are single, dual and quad channel general purpose micropower, rail-to-rail input and output operational amplifiers with supply voltage range of 1. 8V to 5. 5V. Key features are a low supply current of 130µA maximum per channel at room temperature, a low bias current and a wide input voltage range, which enables the ISL28x13 devices to be excellent general purpose operational amplifiers for a wide range of applications. The ISL28113 is available in the SC70-5 and SOT23-5 p | Small Outline Packages | ISL28413FBZ |
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841N254BKILFT
Renesas Electronics
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1 | The 841N254I is a 4-output clock synthesizer designed for S-RIO 1.3 and 2.0 reference clock applications. The device generates four copies of a selectable 250MHz, 156.25MHz, 125MHz or 100MHz clock signal with excellent phase jitter performance. The four outputs are organized in two banks of two LVDS and two HCSL outputs. The device uses Renesas' fourth generation FemtoClock™ NG technology for an optimum of high clock frequency and low phase noise performance, combined with a low power consumption and high p | Quad Flat No-Lead | 841N254BKILFT |
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ISL6327IRZ
Renesas Electronics
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1 | The ISL6327 controls microprocessor core voltage regulation by driving up to 6 synchronous-rectified buck channels in parallel. Multiphase buck converter architecture uses interleaved timing to multiply channel ripple frequency and reduce input and output ripple currents. Lower ripple results in fewer components, lower component cost, reduced power dissipation, and smaller implementation area. Microprocessor loads can generate load transients with extremely fast edge rates. The ISL6327 utilizes Intersil's p | Quad Flat No-Lead | ISL6327IRZ |
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ISL6327CRZ
Renesas Electronics
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1 | The ISL6327 controls microprocessor core voltage regulation by driving up to 6 synchronous-rectified buck channels in parallel. Multiphase buck converter architecture uses interleaved timing to multiply channel ripple frequency and reduce input and output ripple currents. Lower ripple results in fewer components, lower component cost, reduced power dissipation, and smaller implementation area. Microprocessor loads can generate load transients with extremely fast edge rates. The ISL6327 utilizes Intersil's p | Quad Flat No-Lead | ISL6327CRZ |
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5-103908-2
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Positions 3 | Number of Rows 1 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Length 5.84 MM | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 100 – 200 MICIN | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Thickness .381 MICM | Contact Current Rating (Max) 3 AMP | PCB Contact Termination Area P | Header, Shrouded - Straight PTH Box | 5-103908-2 |
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1980514
Phoenix Contact
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1 | PCB headers, nominal cross section: 2.5 mm², color: gray, nominal current: 20 A, rated voltage (III/2): 630 V, contact surface: Tin, contact connection type: Pin, number of rows: 1, number of positions: 5, product range: ST 2,5-PCBV/..-G, pitch: 5.2 mm, mounting: Wave soldering, pin layout: Zigzag pinning W, solder pin [P]: 3.6 mm, number of solder pins per potential: 1, locking clip: - without locking clip, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: p | Other | 1980514 |
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1980530
Phoenix Contact
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1 | PCB headers, nominal cross section: 2.5 mm², color: gray, nominal current: 20 A, rated voltage (III/2): 630 V, contact surface: Tin, contact connection type: Pin, number of rows: 1, number of positions: 7, product range: ST 2,5-PCBV/..-G, pitch: 5.2 mm, mounting: Wave soldering, pin layout: Zigzag pinning W, solder pin [P]: 3.6 mm, number of solder pins per potential: 1, locking clip: - without locking clip, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: p | Other | 1980530 |
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C0805N332K1XPC7189
KEMET
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1 | SMD Mil PRF55681, Ceramic, 3300 pF, 10%, 100 VDC, 125°C, -55°C, BX, P (0.1%/1000 Hrs), 0805, 2mm, 1.25mm, 1.3mm, 0.5mm, 2500, 78 Weeks | Capacitor Chip Non-polarised | C0805N332K1XPC7189 |
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SK400603xM3L
Fischer Elektronik GmbH & Co. KG
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1 | Profile heatsinks and liquid coolers>Extruded heatsinks for PCB mounting 33 x 10 mm, for transistor-design TO 218, TO 220, TO 247, TO 3 P | Other | SK400603xM3L |
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SQJ500AEP-T1_BE3
Vishay
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1 | MOSFET N and P CH 40V (D-S) | Other | SQJ500AEP-T1_BE3 |
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BSO200P03S H
Infineon
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1 | MOSFET P-Ch -30V -9.1A DSO-8 OptiMOS P | Small Outline Packages | BSO200P03S H |
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MAX6801UR29D3+T
Analog Devices
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1 | Supervisory Circuits 3-Pin, Low-Power P Reset Circuits | SOT23 (3-Pin) | MAX6801UR29D3+T |
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STM32F429ZGY6TR
STMicroelectronics
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1 | WLCSP 143 BALLS DIE 419 P 0.4M | BGA | STM32F429ZGY6TR |
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SQ3419EV-T1_GE3
Vishay
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1 | MOSFET P Ch -40Vds 20Vgs AEC-Q101 Qualified | SOT23 (6-Pin) | SQ3419EV-T1_GE3 |
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SSM3J351R,LXHF
Toshiba
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1 | MOSFET P Channel -60V -3.5A AECQ MOSFET | Other | SSM3J351R,LXHF |
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CPF0603B10R7E
TE Connectivity
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1 | Configuration Features: Number of Resistors 1 | Dimensions: Product Width .8 MM | Product Height .45 MM | Product Length .061 INCH | Product Width .031 INCH | Product Height .018 INCH | Product Length 1.55 MM | Electrical Characteristics: Operating Voltage 50 V | Power Rating .063 WATT | Resistance Value 10.7 OHM | Resistance Class Up to 1kΩ | Passive Component Tolerance .1 PCT | Packaging Features: Packaging Method Reel | Product Type Features: Resistor Type Precision Resistor | Element Type Thin Film | P | Resistor Chip | CPF0603B10R7E |
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292175-4
TE Connectivity
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1 | Body Features: Primary Product Color Natural | Configuration Features: Number of Rows 1 | Number of Positions 4 | PCB Mount Orientation Vertical | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Length 4.5 MM | Contact Shape & Form Round | Mating Pin Diameter .024 INCH | Contact Base Material Brass | PCB Contact Termination Area Plating Material Thickness 39.37 – 78.73 MICIN | Contact Mating Area Plating Material Tin | Contact Layout Inline | Contact Mating Area P | Other | 292175-4 |
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3-794636-2
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Power Positions 2 | PCB Mount Orientation Vertical | Number of Positions 2 | Contact Features: Contact Type Pin | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | P | Other | 3-794636-2 |
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2108832-1
TE Connectivity
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1 | Body Features: Product Weight .00071 OZ | Product Weight .02 G | Configuration Features: Band Type Single Band | Antenna Type Chip | Port Configuration Single Port | Mounting Location Internal/Embedded | Dimensions: Product Width 1.5 MM | Product Width .06 INCH | Product Length .119 INCH | Product Height 1.2 MM | Product Height .048 INCH | Product Length 3 MM | Electrical Characteristics: Antenna Operation Passive | VSWR (Max) <2.8:1 | Impedance 50 OHM | Industry Standards: Primary Application Bluetooth | P | Other | 2108832-1 |
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