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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	LTC6103HMS8#PBF Analog Devices	1	SP Amp Current Sense Amp Dual 60V Automotive 8-Pin MSOP Tube	Small Outline Packages	LTC6103HMS8#PBF	3D model available Symbol and footprint available 3	1 Download Model
	LTC6404CUD-1#PBF Analog Devices	1	SP Amp DIFF AMP Single R-R O/P 5.25V Automotive 16-Pin QFN EP Tube	Quad Flat No-Lead	LTC6404CUD-1#PBF	3D model available Symbol and footprint available 3	1 Download Model
	SSM2142SZ-REEL Analog Devices	1	SP Amp Line Driver Amp Single ±18V 16-Pin SOIC W T/R	Small Outline Packages	SSM2142SZ-REEL	3D model available Symbol and footprint available 3	1 Download Model
	R9A06G1502GNK Renesas Electronics This part was updated within the past 30 days. Set alerts for model updates on the part download page.	1	The R9A06G150 RISC-V MCU ASSP is specifically optimized for voice and sound triggered human machine interfaces. Alongside ecosystem partners, this provides a complete, production-ready keyword spotting and recognition system solution. With 100 MHz performance, 256/128/16 KB of Flash/RAM/DataFlash memory, advanced digital and analog microphone input and playback interfaces, small package, and memory expansion options, the R9A06G150 provides the foundation for a turnkey voice HMI solution including Renesas sp	Quad Flat No-Lead	R9A06G1502GNK	3D model available Symbol and footprint available 3	1 Download Model

	INA332AIDGKT Texas Instruments	1	SP Instr Amp Single R-R O/P 5.5V Texas Instruments INA332AIDGKT Instrumentation Amplifier, 8mV Offset, CMMR 60dB, 3 V, 5 V, 8-Pin MSOP, R-RO	Small Outline Packages	INA332AIDGKT	3D model available Symbol and footprint available 3	1 Download Model
	R5F211A4DSP#U0 Renesas Electronics	1	The R8C/1A Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded-HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high sp	Small Outline Packages	R5F211A4DSP#U0	3D model available Symbol and footprint available 3	1 Download Model
	ICL3221EFVZ-T7A Renesas Electronics	1	The ICL3221EM and ICL3221EF devices are 3. 3V powered RS-232 transmitters/receivers that meet ElA/TIA-232 and V. 28/V. 24 specifications. Additionally, they provide ±15kV ESD protection (IEC61000-4-2 Air Gap and Human Body Model) on transmitter outputs and receiver inputs (RS-232 pins). Efficient on-chip charge pumps, coupled with manual and automatic powerdown functions, reduce the standby supply current to a 1µA trickle. Small footprint packaging, and the use of small, low value capacitors ensure board sp	Small Outline Packages	ICL3221EFVZ-T7A	3D model available Symbol and footprint available 3	1 Download Model
	R5F211A2SP#U0 Renesas Electronics	1	The R8C/1A Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded-HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high sp	Small Outline Packages	R5F211A2SP#U0	3D model available Symbol and footprint available 3	1 Download Model
	MFR-25SFTF523K4 YAGEO	1	METAL General RoHS compliant Pro d uct sp ecification – S ept e m b er 28, 2 021 V.1 A SHEET FILM RESISTORS General Purpose MFR Series ±0.5%, ±1%, ±2%, ±5% 1/6W to 3W RoHS compliant & Halogen Free	Resistors, Axial Diameter Horizontal Mounting	MFR-25SFTF523K4	3D model available Symbol and footprint available 3	1 Download Model
	R5F211A4SP#U0 Renesas Electronics	1	The R8C/1A Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded-HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high sp	Small Outline Packages	R5F211A4SP#U0	3D model available Symbol and footprint available 3	1 Download Model
	R5F21194DSP#U0 Renesas Electronics	1	The R8C/19 Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded-HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high sp	Small Outline Packages	R5F21194DSP#U0	3D model available Symbol and footprint available 3	1 Download Model
	INA126EA/250 Texas Instruments	1	SP Amp INSTR Amp Single 18V/36V 8-Pin INA126EA/250, Instrumentation Amplifier, 0.5mV Offset, 74dB CMRR, 12 V, 15 V, 18 V, 24 V, 28 V, 3 V, 5 V, 9 V, 8-Pin	Small Outline Packages	INA126EA/250	3D model available Symbol and footprint available 3	1 Download Model
	R5F21191SP#U0 Renesas Electronics	1	The R8C/19 Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded-HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high sp	Small Outline Packages	R5F21191SP#U0	3D model available Symbol and footprint available 3	1 Download Model
	R5F21194SP#U0 Renesas Electronics	1	The R8C/19 Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded-HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high sp	Small Outline Packages	R5F21194SP#U0	3D model available Symbol and footprint available 3	1 Download Model
	DPL12SV2424A25K2 TE Connectivity	1	Body Features: Shaft Style Knurled \| Shaft Style Flatted \| Product Orientation Vertical \| Configuration Features: Adjustment Location Top \| Adjustment Method Spindle \| Number of Pulses 24 \| Number of Detents 24 \| Dimensions: Passive Component Dimensions 14.5 x 12.4 x 7 MM \| Electrical Characteristics: Passive Component Switch Current Rating .01 AMP \| Operation/Application: Operating Speed (Max) 60 RPM \| Product Type Features: Passive Component Option Includes Switch \| Rotary Encoder Switch Type Push Push SP	Other	DPL12SV2424A25K2	3D model available Symbol and footprint available 3	1 Download Model

	R5F21194NP#U0 Renesas Electronics	1	The R8C/19 Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded-HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high sp	Quad Flat No-Lead	R5F21194NP#U0	3D model available Symbol and footprint available 3	1 Download Model
	R5F21192SP#W4 Renesas Electronics	1	The R8C/19 Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded-HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high sp	Small Outline Packages	R5F21192SP#W4	3D model available Symbol and footprint available 3	1 Download Model
	ICL3221EMVZ-T Renesas Electronics	1	The ICL3221EM and ICL3221EF devices are 3. 3V powered RS-232 transmitters/receivers that meet ElA/TIA-232 and V. 28/V. 24 specifications. Additionally, they provide ±15kV ESD protection (IEC61000-4-2 Air Gap and Human Body Model) on transmitter outputs and receiver inputs (RS-232 pins). Efficient on-chip charge pumps, coupled with manual and automatic powerdown functions, reduce the standby supply current to a 1µA trickle. Small footprint packaging, and the use of small, low value capacitors ensure board sp	Small Outline Packages	ICL3221EMVZ-T	3D model available Symbol and footprint available 3	1 Download Model
	ISLA112P25MREP Renesas Electronics This part was updated within the past 30 days. Set alerts for model updates on the part download page.	1	The ISLA112P25MREP is a low-power 12-bit, 250MSPS analog-to-digital converter. Designed with Renesas' proprietary FemtoCharge™ technology on a standard CMOS process. A serial peripheral interface (SPI) port allows for extensive configurability, as well as fine control of various parameters such as gain and offset. Digital output data is presented in selectable LVDS or CMOS formats. The ISLA112P25MREP is available in a 72 Ld QFN package with an exposed paddle. Operating from a 1. 8V supply, performance is sp	Quad Flat No-Lead	ISLA112P25MREP	3D model available Symbol and footprint available 3	1 Download Model
	RNG90-SSVDA-T Microchip This part was updated within the past 30 days. Set alerts for model updates on the part download page.	1	• Internal High-Quality NIST SP 800-90A/B/C Random Number Generator (RNG)\r\n• FIPS Compliant Health Tests and Self-Tests for Entropy\r\n• Designed for FIPS140-3 NIST CMVP Entropy Source Validation (ESV) Compliance\r\n• Unique 72-Bit Serial Number\r\n• 400 kHz Fast-Mode I2C Interface\r\n• 130 nA Nominal Sleep Current\r\n• VCC Operating Range: 1.65 to 5.5V\r\n• Extended Industrial Temperature Range: -40℃ to +105℃\r\n• ESD >4 kV Human Body Model (HBM)\r\n• Extensive Security Measures:\r\n– Active shield to protect against invasi	Small Outline Packages	RNG90-SSVDA-T	3D model available Symbol and footprint available 3	1 Download Model
	R5F211A1SP#U0 Renesas Electronics	1	The R8C/1A Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded-HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high sp	Small Outline Packages	R5F211A1SP#U0	3D model available Symbol and footprint available 3	1 Download Model
	ICL3221EFVZ-T Renesas Electronics	1	The ICL3221EM and ICL3221EF devices are 3. 3V powered RS-232 transmitters/receivers that meet ElA/TIA-232 and V. 28/V. 24 specifications. Additionally, they provide ±15kV ESD protection (IEC61000-4-2 Air Gap and Human Body Model) on transmitter outputs and receiver inputs (RS-232 pins). Efficient on-chip charge pumps, coupled with manual and automatic powerdown functions, reduce the standby supply current to a 1µA trickle. Small footprint packaging, and the use of small, low value capacitors ensure board sp	Small Outline Packages	ICL3221EFVZ-T	3D model available Symbol and footprint available 3	1 Download Model
	5650868-5 TE Connectivity	1	Body Features: Primary Product Color Gray \| Configuration Features: PCB Mount Orientation Right Angle \| Number of Columns 16 \| Rows Loaded A, B, C \| Number of Rows 3 \| Number of Positions 48 \| Number of Signal Positions 48 \| Contact Features: Contact Mating Area Plating Material Gold Flash over Palladium Nickel \| PCB Contact Termination Area Plating Material Tin \| Contact Underplating Material Nickel \| Contact Base Material Copper Alloy \| Contact Mating Area Plating Material Gold \| Dimensions: Row-to-Row Sp	Other	5650868-5	3D model available Symbol and footprint available 3	1 Download Model
	R9A06G1502GNH Renesas Electronics This part was updated within the past 30 days. Set alerts for model updates on the part download page.	1	The R9A06G150 RISC-V MCU ASSP is specifically optimized for voice and sound triggered human machine interfaces. Alongside ecosystem partners, this provides a complete, production-ready keyword spotting and recognition system solution. With 100 MHz performance, 256/128/16 KB of Flash/RAM/DataFlash memory, advanced digital and analog microphone input and playback interfaces, small package, and memory expansion options, the R9A06G150 provides the foundation for a turnkey voice HMI solution including Renesas sp	Quad Flat No-Lead	R9A06G1502GNH	3D model available Symbol and footprint available 3	1 Download Model
	R9A06G1502GNE Renesas Electronics This part was updated within the past 30 days. Set alerts for model updates on the part download page.	1	The R9A06G150 RISC-V MCU ASSP is specifically optimized for voice and sound triggered human machine interfaces. Alongside ecosystem partners, this provides a complete, production-ready keyword spotting and recognition system solution. With 100 MHz performance, 256/128/16 KB of Flash/RAM/DataFlash memory, advanced digital and analog microphone input and playback interfaces, small package, and memory expansion options, the R9A06G150 provides the foundation for a turnkey voice HMI solution including Renesas sp	Quad Flat No-Lead	R9A06G1502GNE	3D model available Symbol and footprint available 3	1 Download Model
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