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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	R5F21206KFP#U1 Renesas Electronics	1	The R8C/20 Group is supported only for customers who have already adopted these products.These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/1B Group has on-chip d	Quad Flat Packages	R5F21206KFP#U1	3D model not available Symbol and footprint available 2	1 Download Model
	ISL8280MFRZ Renesas Electronics	1	The ISL8280M is a PMBus enabled DC/DC single channel step-down power supply featuring the proprietary Renesas R4™ Technology. The module supports a wide 4. 5V to 16. 5V input voltage range and a wide 0. 5V to 5V output range capable of delivering up to 10A of continuous current. The ISL8280M achieves up to 95% conversion efficiency and is optimized for high power density. Integrated LDOs provide module bias voltage allowing for single supply operation. The ISL8280M includes a SMBus/PMBus/I2C interface for d	Other	ISL8280MFRZ	3D model available Symbol and footprint available 3	1 Download Model
	1963450 Phoenix Contact	1	PCB header, nominal cross section: 0.5 mm?, color: black, nominal current: 4 A, rated voltage (III/2): 160 V, contact surface: Tin, type of contact: Male connector, Number of potentials: 5, Number of rows: 1, Number of positions per row: 5, number of connections: 5, product range: MC 0,5/..-G-THT, pitch: 2.5 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 3.8 mm, Stecksystem: MICRO COMBICON - FK-MC 0,5, Locking: without, type of packaging: packed in cardboard, User information and d	Other	1963450	3D model available Symbol and footprint available 3	1 Download Model
	ISL8282MFRZ Renesas Electronics	1	The ISL8282M is a PMBus enabled DC/DC single channel step-down power supply featuring the proprietary Renesas R4™ Technology. The module supports a wide 4. 5V to 16. 5V input voltage range and a wide 0. 5V to 5V output range capable of delivering up to 15A of continuous current. The ISL8282M achieves up to 95% conversion efficiency and is optimized for high power density. Integrated LDOs provide module bias voltage allowing for single supply operation. The ISL8282M includes a SMBus/PMBus/I2C interface for d	Other	ISL8282MFRZ	3D model available Symbol and footprint available 3	1 Download Model

	MPC9448ACR2 Renesas Electronics	1	The MPC9448 is specifically designed to distribute LVCMOS compatible clock signals up to a frequency of 350 MHz. Each output provides a precise copy of the input signal with a near zero skew. The outputs buffers support driving of 50Ω terminated transmission lines on the incident edge. Each output is capable of driving either one parallel terminated or two series terminated transmission lines. Two selectable, independent clock inputs are available, providing support of LVCMOS and differential LVPECL clock d	Quad Flat Packages	MPC9448ACR2	3D model available Symbol and footprint available 3	1 Download Model
	SMLJ11A-TP MCC	1	For Surface Mount Application in Order to Optimize Board Space\r\n• Built-in Strain Relief\r\n• Glass Passivated Junction\r\n• For Bidirectional Devices Add “C” To The Suffix of\r\nThe Part Number: i.e.SMLJ5.0CA for 5% Tolerance\r\n• Excellent Clamping Capability\r\n• Repetition Rate(duty cycle):0.5%\r\n• Fast Response Time: Typical Less Than 1ps From 0V to BV Min\r\n• Typical ID Less than 1μA Above 10V\r\n• ESD Protected up to 16KV (HBM)\r\n• High Temperature Soldering: 260°C/10 Seconds at Terminals\r\n• Halogen Free. “Green” D	Diodes Moulded	SMLJ11A-TP	3D model available Symbol and footprint available 3	1 Download Model
	SMLJ10CA-TP MCC	1	For Surface Mount Application in Order to Optimize Board Space\r\n• Built-in Strain Relief\r\n• Glass Passivated Junction\r\n• For Bidirectional Devices Add “C” To The Suffix of\r\nThe Part Number: i.e.SMLJ5.0CA for 5% Tolerance\r\n• Excellent Clamping Capability\r\n• Repetition Rate(duty cycle):0.5%\r\n• Fast Response Time: Typical Less Than 1ps From 0V to BV Min\r\n• Typical ID Less than 1μA Above 10V\r\n• ESD Protected up to 16KV (HBM)\r\n• High Temperature Soldering: 260°C/10 Seconds at Terminals\r\n• Halogen Free. “Green” D	Diodes Moulded Non Polarised	SMLJ10CA-TP	3D model available Symbol and footprint available 3	1 Download Model
	W631GU6MB11A Winbond This part was updated within the past 30 days. Set alerts for model updates on the part download page.	1	 Power Supply: 1.35V (typ.), VDD, VDDQ = 1.283V to 1.45V\r\n Backward compatible to VDD, VDDQ = 1.5V ± 0.075V\r\n Double Data Rate architecture: two data transfers per clock cycle\r\n Eight internal banks for concurrent operation\r\n 8 bit prefetch architecture\r\n CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14\r\n Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF)\r\n Programmable read burst ordering: interleaved or nibble sequential\r\n Bi-directional, d	BGA	W631GU6MB11A	3D model available Symbol and footprint available 3	1 Download Model
	5352033-1 TE Connectivity	1	Body Features: Primary Product Color Gray \| Configuration Features: Number of Rows 7 \| Rows Loaded B \| Rows Loaded A \| Number of Signal Positions 95 \| Rows Loaded F \| Number of Columns 19 \| Rows Loaded E \| Number of Positions 133 \| PCB Mount Orientation Vertical \| Rows Loaded D \| Backplane Architecture Mezzanine \| Rows Loaded C \| Rows Loaded Z \| Contact Features: Contact Base Material Phosphor Bronze \| Contact Current Rating (Max) 1.5 AMP \| Contact Underplating Material Nickel \| Feedthrough Post Length 3.7	Other	5352033-1	3D model available Symbol and footprint available 3	1 Download Model
	352171-1 TE Connectivity	1	Body Features: Primary Product Color Gray \| Configuration Features: Rows Loaded D \| Number of Signal Positions 95 \| PCB Mount Orientation Right Angle \| Backplane Architecture Mezzanine \| Number of Columns 19 \| Number of Positions 95 \| Rows Loaded C \| Rows Loaded E \| Rows Loaded A \| Number of Rows 5 \| Rows Loaded B \| Contact Features: Feedthrough Post Length 3.3 MM \| Contact Mating Area Plating Material Gold \| Contact Mating Area Plating Material Thickness .76 MICM \| PCB Contact Termination Area Plating Mate	Other	352171-1	3D model available Symbol and footprint available 3	1 Download Model
	EL5167IWZ-T7 Renesas Electronics	1	The EL5166 and EL5167 amplifiers are of the current feedback variety and exhibit a very high bandwidth of 1.4GHz at AV = +1 and 800MHz at AV = +2. This makes these amplifiers ideal for today's High-Speed video and monitor applications, as well as a number of RF and IF frequency designs. With a supply current of just 8. 5mA and the ability to run from a single supply voltage from 5V to 12V, these amplifiers offer very high performance for little power consumption. The EL5166 also incorporates an enable and d	SOT23 (5-Pin)	EL5167IWZ-T7	3D model available Symbol and footprint available 3	1 Download Model
	5352068-1 TE Connectivity	1	Body Features: Primary Product Color Gray \| Configuration Features: Backplane Architecture Mezzanine \| Number of Signal Positions 110 \| Mating & Unmating Configuration Make First / Break Last \| Rows Loaded A \| Number of Rows 5 \| PCB Mount Orientation Right Angle \| Rows Loaded D \| Rows Loaded B \| Number of Columns 22 \| Number of Positions 110 \| Rows Loaded C \| Rows Loaded E \| Contact Features: Contact Current Rating (Max) 1.5 AMP \| Contact Base Material Phosphor Bronze \| Contact Mating Area Plating Material	Other	5352068-1	3D model available Symbol and footprint available 3	1 Download Model
	SN74LS378D Texas Instruments	1	SOIC D	Small Outline Packages	SN74LS378D	3D model available Symbol and footprint available 3	1 Download Model
	MDM-25PCBR-A174-F222 ITT CANNON	1	Micro D Metal Shell	Other	MDM-25PCBR-A174-F222	3D model available Symbol and footprint available 3	1 Download Model
	IDT74FCT16374ATPV Renesas Electronics	1	16b 3state D flip-flop,DT74FCT16374ATPV	Small Outline Packages	IDT74FCT16374ATPV	3D model available Symbol and footprint available 3	1 Download Model

	SN74ABT841ADBRE4 Texas Instruments	1	Latches 10bit Bus D	Small Outline Packages	SN74ABT841ADBRE4	3D model available Symbol and footprint available 3	1 Download Model
	T494D476K020AS KEMET	1	CAP D CASE 47UF 20V	Other	T494D476K020AS	3D model available Symbol and footprint available 3	1 Download Model
	SN74LVC2G04DCK3 Texas Instruments	1	DUAL BUFFER/DRIVER WITH OPEN D	SOT23 (6-Pin)	SN74LVC2G04DCK3	3D model available Symbol and footprint available 3	1 Download Model
	MWDM2L-15SCBRR3-.125 Glenair	1	D-Sub Micro-D Connectors MICRO D	Other	MWDM2L-15SCBRR3-.125	3D model not available Symbol and footprint available 2	1 Download Model
	SN74HC174N Texas Instruments	1	Hex D flip-flop w/reset,SN74HC174N DIP16	Dual-In-Line Packages	SN74HC174N	3D model available Symbol and footprint available 3	1 Download Model
	SN74S174N Texas Instruments	1	HEX/QUADRUPLE D TYPE FLIP-FLOPS	Other	SN74S174N	3D model available Symbol and footprint available 3	1 Download Model
	CD54HC174F Texas Instruments	1	D FLIP-FLOP, HC/UH SERIES, 6-BIT	Ceramic Dual-In-Line Packages	CD54HC174F	3D model available Symbol and footprint available 3	1 Download Model
	MAX98400AETX+T Analog Devices	1	Stereo, High-Power, Class D Amplifier	Quad Flat No-Lead	MAX98400AETX+T	3D model available Symbol and footprint available 3	1 Download Model
	178-025-613R491 NorComp	1	STACKED D SUB CONN, PLUG/PLUG, 25POS; Product Range:178 Series; Upper D Sub Shell Size:DB; Upper D Sub Gender:Plug; No. of Contacts Upper D Sub:25Contacts; Lower D Sub Shell Size:DB; Lower D Sub Gender:Plug; Contact Material:Brass RoHS Compliant: Yes	Other	178-025-613R491	3D model not available Symbol and footprint available 2	1 Download Model
	83614-9014 Molex	1	Molex Micro D Series D-sub Connector,	Other	83614-9014	3D model available Symbol and footprint available 3	1 Download Model
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