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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	929647-07-36-I 3M	1	Headers & Wire Housings 36P STRT 1 ROW GOLD	Header, Vertical	929647-07-36-I	3D model available Symbol and footprint available 3	1 Download Model
	TPS3707-33DGN Texas Instruments	1	Texas Instruments TPS3707-33DGN, Dual Processor Supervisor 2.5/3/3.3/5 V, Reset Input, 8-Pin MSOP	Small Outline Packages	TPS3707-33DGN	3D model available Symbol and footprint available 3	1 Download Model
	TDA7073AT/N4,112 NXP	1	Gate Drivers DRIVER DUAL BTL PWR	Small Outline Packages	TDA7073AT/N4,112	3D model available Symbol and footprint available 3	1 Download Model
	C317C224K5N5TA91707301 KEMET	1	GoldMax 300 Auto X8L HT150C, Ceramic, 0.22 uF, 10%, 50 VDC, 125 VDC, 150°C, -55°C, X8L, GoldMax, Automotive Grade, 2.5 % , 4.55 GOhms, 3.81mm, 5.08mm, 2.54mm, Lead Spacing = 5.08mm, 16mm, 0.51mm, 2500	Other	C317C224K5N5TA91707301	3D model available Symbol and footprint available 3	1 Download Model

	1070733 Phoenix Contact	1	PCB header, color: black, contact surface: Tin, Number of positions per row: 5, product range: CCVA 2,5/..-G, pitch: 5.08 mm, pin layout: Linear pinning, solder pin [P]: 1.4 mm, type of packaging: packed in cardboard	Other	1070733	3D model available Symbol and footprint available 3	1 Download Model
	1707311 Phoenix Contact	1	PCB header, nominal cross section: 1.5 mm?, color: black, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Tin, type of contact: Male connector, Number of potentials: 12, Number of rows: 1, Number of positions per row: 12, number of connections: 12, product range: MCV 1,5/..-GF-THR, pitch: 3.81 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 1.4 mm, Stecksystem: MINI COMBICON, Locking: Screw locking, type of packaging: packed in cardboard, User information and de	Other	1707311	3D model available Symbol and footprint available 3	1 Download Model
	7447707331 Würth Elektronik	1	Fixed Inductors WE-PD 330uH 1.08A DCR=410mOhms AECQ200	Other	7447707331	3D model available Symbol and footprint available 3	1 Download Model
	TPS3707-30D Texas Instruments	1	Processor Supervisory Circuit With Power-Fail	Small Outline Packages	TPS3707-30D	3D model available Symbol and footprint available 3	1 Download Model
	0522070733 Molex	1	FFC & FPC Connectors 1.00MM REC 07P RA SMT TOP	Other	0522070733	3D model not available Symbol and footprint available 2	1 Download Model
	34707-3060 Molex	1	Automotive Connectors STAC64 VHDR 3BAY 46CKT 20B-16C-10A	Other	34707-3060	3D model available Symbol and footprint available 3	1 Download Model
	SLA7073MPRT SANKEN ELECTRIC CO.	1	IC MOTOR DRIVER PAR 23SLA	Other	SLA7073MPRT	3D model available Symbol and footprint available 3	1 Download Model
	C320C473J2G5TA91707301 KEMET	1	GoldMax 300 Auto C0G, Ceramic, 0.047 uF, 5%, 200 VDC, C0G, GoldMax, Automotive Grade, Lead Spacing = 2.54mm	Other	C320C473J2G5TA91707301	3D model available Symbol and footprint available 3	1 Download Model
	1070735 Phoenix Contact	1	PCB header, color: black, contact surface: Tin, Number of positions per row: 5, product range: CCVA 2,5/..-G, pitch: 5.08 mm, pin layout: Linear pinning, solder pin [P]: 1.4 mm, type of packaging: 56 mm wide tape	Other	1070735	3D model available Symbol and footprint available 3	1 Download Model
	1707357 Phoenix Contact	1	PCB terminal block, nominal current: 12 A, rated voltage (III/2): 200 V, nominal cross section: 1 mm?, Number of potentials: 1, Number of rows: 1, Number of positions per row: 1, product range: ZFKDS(A) 1-V, pitch: 3.81 mm, connection method: Spring-cage connection, mounting: Wave soldering, conductor/PCB connection direction: 90 ?, color: green, Pin layout: Linear pinning, Solder pin [P]: 3.5 mm, type of packaging: packed in cardboard. End terminal block for terminating custom-grouped blocks.	Other	1707357	3D model available Symbol and footprint available 3	1 Download Model
	885012207073 Würth Elektronik	1	Multilayer Ceramic Chip Capacitor WCAP-CSGP Series 0805 150000pF X7R0805154K025DFCT10000	Capacitor Chip Non-polarised	885012207073	3D model available Symbol and footprint available 3	1 Download Model

	1367073-1 TE Connectivity	1	Configuration Features: Number of Positions 20 \| Contact Features: Contact Mating Area Plating Material Thickness .38 MICM \| Contact Mating Area Plating Material Thickness 15 MICIN \| Contact Mating Area Plating Material Gold \| Contact Current Rating (Max) .5 AMP \| Electrical Characteristics: Data Rate (Max) 4 GBS \| Housing Features: Centerline (Pitch) .031 INCH \| Centerline (Pitch) .8 MM \| Industry Standards: UL Flammability Rating UL 94V-0 \| Operation/Application: Circuit Application Signal \| Pluggable I/O	Other	1367073-1	3D model available Symbol and footprint available 3	1 Download Model
	TPS3707-30DGNR Texas Instruments	1	Processor Supervisor 1.25V/2.63V 2.5V/3V/3.3V/5V 8-Pin HVSSOP EP T/R	Small Outline Packages	TPS3707-30DGNR	3D model available Symbol and footprint available 3	1 Download Model
	TPS3707-33D Texas Instruments	1	Texas Instruments TPS3707-33D, Dual Processor Supervisor 2.5/3/3.3/5 V, Reset Input, 8-Pin SOIC	Small Outline Packages	TPS3707-33D	3D model available Symbol and footprint available 3	1 Download Model
	1367073-1 TE Connectivity	1	Configuration Features: Number of Positions 20 \| Contact Features: Contact Mating Area Plating Material Thickness .38 MICM \| Contact Mating Area Plating Material Thickness 15 MICIN \| Contact Mating Area Plating Material Gold \| Contact Current Rating (Max) .5 AMP \| Electrical Characteristics: Data Rate (Max) 4 GBS \| Housing Features: Centerline (Pitch) .031 INCH \| Centerline (Pitch) .8 MM \| Industry Standards: UL Flammability Rating UL 94V-0 \| Operation/Application: Circuit Application Signal \| Pluggable I/O	Other	1367073-1	3D model available Symbol and footprint available 3	1 Download Model
	C330C104J2H5TA91707301 KEMET	1	KEMET 100nF Multilayer Ceramic Capacitor MLCC 200V dc ±5% , Through Hole C330C104J2H5TA91707301	Other	C330C104J2H5TA91707301	3D model available Symbol and footprint available 3	1 Download Model
	535170730 Molex	1	2.50mm Pitch, Mini-Lock PCB Header, Single Row, Vertical, Through Hole, Matte Tin Plating, Positive Lock, 2 Circuits, Tray, 3.50mm PC Tail Length, Natural	Other	535170730	3D model available Symbol and footprint available 3	1 Download Model
	C315C153J1H5TA91707301 KEMET	1	GoldMax 300 Auto X8R HT150C, Ceramic, 0.015 uF, 5%, 100 VDC, 250 VDC, 150°C, -55°C, X8R, GoldMax, Automotive Grade, 2.5 % , 66.67 GOhms, 3.81mm, 3.14mm, 2.54mm, Lead Spacing = 2.54mm, 16mm, 0.51mm, 2500	Other	C315C153J1H5TA91707301	3D model available Symbol and footprint available 3	1 Download Model
	1707331 Phoenix Contact	1	PCB terminal block, nominal current: 24 A, rated voltage (III/2): 400 V, nominal cross section: 2.5 mm?, Number of potentials: 9, Number of rows: 1, Number of positions per row: 9, product range: MKDS 3, pitch: 5.08 mm, connection method: Screw connection with tension sleeve, mounting: Wave soldering, conductor/PCB connection direction: 0 ?, color: green, Pin layout: Linear pinning, Solder pin [P]: 5 mm, type of packaging: packed in cardboard. The article can be aligned to create different nos. of positions	Other	1707331	3D model available Symbol and footprint available 3	1 Download Model
	C320C105K5N5TA91707301 KEMET	1	GoldMax 300 Auto X8L HT150C, Ceramic, 1 uF, 10%, 50 VDC, 125 VDC, 150°C, -55°C, X8L, GoldMax, Automotive Grade, 2.5 % , 1 GOhms, 5.08mm, 5.84mm, 3.18mm, Lead Spacing = 2.54mm, 16mm, 0.51mm, 2500	Other	C320C105K5N5TA91707301	3D model available Symbol and footprint available 3	1 Download Model
	C322C105K5R5TA91707301 KEMET	1	GoldMax 300 Auto X7R, Ceramic, 1 uF, 10%, 50 VDC, 125 VDC, 125°C, -55°C, X7R, GoldMax, Automotive Grade, 2.5 % , 100 MOhms, 5.08mm, 6.6mm, 3.18mm, Lead Spacing = 5.08mm, 16mm, 0.51mm, 2500, 80	Other	C322C105K5R5TA91707301	3D model available Symbol and footprint available 3	1 Download Model
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