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2176230-2
TE Connectivity
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1 | Res Thick Film 2512 1 Ohm 5% 3W ±400ppm/°C Pad SMD T/R | Resistor Chip | 2176230-2 |
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ADV7623BSTZ-P-RL
Analog Devices
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1 | Display Interface IC Require HDMI license see product comment | Quad Flat Packages | ADV7623BSTZ-P-RL |
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MAXM17623AMB+
Analog Devices
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1 | Switching Voltage Regulators 2.9V-to-5V Input, 1A , 0.8V-to-1.5V output DC-DC Converter Module | Other | MAXM17623AMB+ |
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15-007623
Amphenol
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1 | D-Sub High Density Connectors 26P F HD R/A WTR RES SOLID BODY BRKT INS/CLIP | Other | 15-007623 |
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DBT30R-7.62-3PBK-P
DORABO
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1 | 1x3P 2-Side 1.5 7.62mm 1 3 17.5A -40℃~+105℃ Black 14~22 Right-Angle Pin Through Hole,Right Angle,P=7.62mm Barrier Blocks ROHS | Other | DBT30R-7.62-3PBK-P |
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236-762/332-000
Wago
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1 | Stackable PCB terminal block; 2.5 mm²; Pin spacing 10/10.16 mm; 1-pole; CAGE CLAMP®; commoning option | Other | 236-762/332-000 |
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MAX17623ATA+
Analog Devices
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1 | Buck Switching Regulator IC Positive Adjustable 0.8V 1 Output 1A 8-WFDFN Exposed Pad | Small Outline No-lead | MAX17623ATA+ |
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UPD48576236F1-E24-DW1-A
Renesas Electronics
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1 | The µPD48576209F1 is a 67, 108, 864-word by 9 bit, the µPD48576218F1 is a 33, 554, 432 word by 18 bit and the µPD48576236F1 is a 16, 777, 216 word by 36 bit synchronous double data rate Low Latency RAM fabricated with advanced CMOS technology using one-transistor memory cell. The µPD48576209F1, µPD48576218F1 and µPD48576236F1 integrate unique synchronous peripheral circuitry and a burst counter. All input registers controlled by an input clock pair (CK and CK#) are latched on the positive edge of CK and CK# | BGA | UPD48576236F1-E24-DW1-A |
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MAX17623ATA+T
Analog Devices
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1 | Buck Switching Regulator IC Positive Adjustable 0.8V 1 Output 1A 8-WFDFN Exposed Pad | Small Outline No-lead | MAX17623ATA+T |
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R7F7017623AFP-C#AA1
Renesas Electronics
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1 | The RH850/F1KM-S2 is one group of single-chip microcontrollers in the RH850/F1x series which is designed for automotive electrical body applications.While it achieves low power consumption, the internal flash memory is 2MB and the package covers from 100 to 176 pins. Also, a CAN FD interface has been added and the CPU operating frequency operates up to 240MHz. | Quad Flat Packages | R7F7017623AFP-C#AA1 |
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74479776233
Würth Elektronik
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1 | Power Multilayer Inductor WE-PMI | Other | 74479776233 |
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ADV7623BSTZ-P
Analog Devices
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1 | Analog Devices ADV7623BSTZ-P, Line Transceiver, IEC 60958, 1.8 V, 3.3 V, 144-Pin ST-144 | Quad Flat Packages | ADV7623BSTZ-P |
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AD7623ACPZ
Analog Devices
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1 | Analog Devices AD7623ACPZ, 16 bit Serial ADC, Differential Input, 48-Pin LFCSP VQ | Quad Flat No-Lead | AD7623ACPZ |
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RC422-076-231-42FT
Molex
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1 | Rectangular MIL Spec Connectors Board to Board .075" 4Row/19COL Fem Thrd | Other | RC422-076-231-42FT |
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SI7623DN-T1-GE3
Vishay
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1 | MOSFET -20V Vds 12V Vgs PowerPAK 1212-8 | Other | SI7623DN-T1-GE3 |
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1-776230-1
TE Connectivity
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1 | Header Vertical 35 way Pin AmpSeal | Other | 1-776230-1 |
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KF2EDGRM-7.62-3P
CIXI KEFA ELECTRONICS
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1 | 400V 15A 12 Bend -40℃~+105℃ 1 7.62mm Green Board Edge/Receptacle-Close P=7.62mm Pluggable System Terminal Block ROHS | Other | KF2EDGRM-7.62-3P |
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1762376
Phoenix Contact
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1 | MDSTB 2,5/ 3-G1-5,08 - PCB headers, nominal cross section: 2.5 mm2, color: green, nominal current: 10 A, rated voltage (III/2): 320 V, contact surface: Sn, contact connection type: Pin, number of potentials: 6, number of rows: 2, number of positions: 3, number of connections: 6, product range: MDSTB 2,5/..-G1, pitch: 5.08 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.3 mm, number of solder pins per potential: 1, plug-in system: COMBICON MSTB 2,5, Pin connector patter | Other | 1762376 |
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AD7623ASTZ
Analog Devices
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1 | 16 Bit Analog to Digital Converter 1 Input 1 SAR 48-LQFP (7x7) | Quad Flat Packages | AD7623ASTZ |
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5-87623-4
TE Connectivity
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1 | Contact Features: Contact Current Rating (Max) 3 AMP | PCB Contact Termination Area Plating Material Finish Matte | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Length 7.06 MM | Contact Type Pin | Contact Mating Area Length .278 INCH | Mating Square Post Dimension .025 INCH | Contact Base Material Phosphor Bronze | PCB Contact Termination Area Plating Material Thickness 100 – 200 MICIN | Contact Mating Area Plating Material Gold | Mating Square Post Dimension .64 MM | Contact Sh | Other | 5-87623-4 |
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744762318A
Würth Elektronik
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1 | WE-RFI SMT Ferrite Inductor Size 1008; L = 1.8 µH ; Qmin = 20; RDCmax = 2.2 Ω | Other | 744762318A |
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744762339A
Würth Elektronik
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1 | WE-RFI SMT Ferrite Inductor Size 1008; L = 3.9 µH ; Qmin = 20; RDCmax = 4 Ω | Other | 744762339A |
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1-776231-6
TE Connectivity
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1 | Connector Header Panel Mount, Through Hole 35 position 0.157" (4.00mm) | Other | 1-776231-6 |
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UPD48576236F1-E18-DW1-A
Renesas Electronics
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1 | The µPD48576209F1 is a 67, 108, 864-word by 9 bit, the µPD48576218F1 is a 33, 554, 432 word by 18 bit and the µPD48576236F1 is a 16, 777, 216 word by 36 bit synchronous double data rate Low Latency RAM fabricated with advanced CMOS technology using one-transistor memory cell. The µPD48576209F1, µPD48576218F1 and µPD48576236F1 integrate unique synchronous peripheral circuitry and a burst counter. All input registers controlled by an input clock pair (CK and CK#) are latched on the positive edge of CK and CK# | BGA | UPD48576236F1-E18-DW1-A |
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776231-5
TE Connectivity
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1 | Body Features: Connector & Keying Code 5 | Primary Product Color Blue | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 3 | Number of Positions 35 | Contact Features: Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 8 AMP | Contact Type Pin | Housing Features: Centerline (Pitch) .157 INCH | Centerline (Pitch) 4 MM | Industry Standards: UL Flammability Rating UL 94V-0 | Mechanical Attachment: PCB Mount Alignment With | Mating Alignment With | PCB Mount Retention | Other | 776231-5 |
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