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B82422A3829K108
TDK
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1 | SMD / SMT Inductors (Coils), L=0.0082μH, 3.2mm x 2.5mm [EIA 1210] | Inductors Precision Moulded | B82422A3829K108 |
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TSW-138-29-F-Q
SAMTEC
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1 | POST HEADER,THROUGH-HOLE | Other | TSW-138-29-F-Q |
2
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LTC3829IFE#PBF
Analog Devices
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1 | Switching Voltage Regulators 3-Phase, Synchronous Regulators with Diffamp | Small Outline Packages | LTC3829IFE#PBF |
3
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UPD70F3829GB-GAH-AX
Renesas Electronics
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1 | RENESAS - UPD70F3829GB-GAH-AX - MCU, 32BIT, V850ES, 50MHZ, LQFP-64 | Quad Flat Packages | UPD70F3829GB-GAH-AX |
3
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5962-3829415MXA
Renesas Electronics
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1 | The 5962-38294 (7164 SRAM) is organized as 8K x 8 and offers a reduced power standby mode. The low-power version also offers a battery backup data retention capability at power supply levels as low as 2V. All inputs and outputs are TTL-compatible and operation is from a single 5V supply, simplifying system designs. Fully static asynchronous circuitry is used, requiring no clocks or refreshing for operation. | Ceramic Dual-In-Line Packages | 5962-3829415MXA |
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5962-3829406MXA
Renesas Electronics
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1 | The 5962-38294 (7164 SRAM) is organized as 8K x 8 and offers a reduced power standby mode. The low-power version also offers a battery backup data retention capability at power supply levels as low as 2V. All inputs and outputs are TTL-compatible and operation is from a single 5V supply, simplifying system designs. Fully static asynchronous circuitry is used, requiring no clocks or refreshing for operation. | Ceramic Dual-In-Line Packages | 5962-3829406MXA |
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5962-3829415MZA
Renesas Electronics
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1 | The 5962-38294 (7164 SRAM) is organized as 8K x 8 and offers a reduced power standby mode. The low-power version also offers a battery backup data retention capability at power supply levels as low as 2V. All inputs and outputs are TTL-compatible and operation is from a single 5V supply, simplifying system designs. Fully static asynchronous circuitry is used, requiring no clocks or refreshing for operation. | Ceramic Dual-In-Line Packages | 5962-3829415MZA |
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TSW-138-29-L-S
SAMTEC
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1 | 38 Position, Single Row, Classic PCB Header Strips, 0.100" pitch | Other | TSW-138-29-L-S |
2
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923829
ERNI
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1 | 55-pin, right angle, pressfit | Other | 923829 |
3
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5962-3829412MZA
Renesas Electronics
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1 | The 5962-38294 (7164 SRAM) is organized as 8K x 8 and offers a reduced power standby mode. The low-power version also offers a battery backup data retention capability at power supply levels as low as 2V. All inputs and outputs are TTL-compatible and operation is from a single 5V supply, simplifying system designs. Fully static asynchronous circuitry is used, requiring no clocks or refreshing for operation. | Ceramic Dual-In-Line Packages | 5962-3829412MZA |
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5962-3829411MZA
Renesas Electronics
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1 | The 5962-38294 (7164 SRAM) is organized as 8K x 8 and offers a reduced power standby mode. The low-power version also offers a battery backup data retention capability at power supply levels as low as 2V. All inputs and outputs are TTL-compatible and operation is from a single 5V supply, simplifying system designs. Fully static asynchronous circuitry is used, requiring no clocks or refreshing for operation. | Ceramic Dual-In-Line Packages | 5962-3829411MZA |
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TSW-138-29-S-Q
SAMTEC
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1 | POST HEADER,THROUGH-HOLE | Other | TSW-138-29-S-Q |
2
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B82498F3829K
TDK
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0 | SMT inductors 8.2nH ±10% | Other | B82498F3829K |
3
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923829-E
TE Connectivity
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1 | Hard Metric Connectors ERMET C Male INV 66 L1 - 3,50 A--F V--V 207 | Other | 923829-E |
3
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B82496C3829Z000
TDK
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1 | SMD / SMT Inductors (Coils), L=0.0082μH, 1.6mm x 0.8mm [EIA 0603] | Inductors Chip | B82496C3829Z000 |
3
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TSW-138-29-FM-S
SAMTEC
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1 | 38 Position, Single Row, Classic PCB Header Strips, 0.100" pitch | Other | TSW-138-29-FM-S |
2
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B82422A3829K100
TDK
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1 | EPCOS Type 1210 Wire-wound SMD Inductor with a Ceramic Core, 8.2 nH ±10% Wire-Wound 800mA Idc Q:20 | Inductors Precision Moulded | B82422A3829K100 |
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5962-3829410MXA
Renesas Electronics
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1 | The 5962-38294 (7164 SRAM) is organized as 8K x 8 and offers a reduced power standby mode. The low-power version also offers a battery backup data retention capability at power supply levels as low as 2V. All inputs and outputs are TTL-compatible and operation is from a single 5V supply, simplifying system designs. Fully static asynchronous circuitry is used, requiring no clocks or refreshing for operation. | Ceramic Dual-In-Line Packages | 5962-3829410MXA |
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5962-3829406MZA
Renesas Electronics
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1 | The 5962-38294 (7164 SRAM) is organized as 8K x 8 and offers a reduced power standby mode. The low-power version also offers a battery backup data retention capability at power supply levels as low as 2V. All inputs and outputs are TTL-compatible and operation is from a single 5V supply, simplifying system designs. Fully static asynchronous circuitry is used, requiring no clocks or refreshing for operation. | Ceramic Dual-In-Line Packages | 5962-3829406MZA |
2
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TSW-138-29-LM-S
SAMTEC
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1 | 38 Position, Single Row, Classic PCB Header Strips, 0.100" pitch | Other | TSW-138-29-LM-S |
2
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5962-3829414MZA
Renesas Electronics
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1 | The 5962-38294 (7164 SRAM) is organized as 8K x 8 and offers a reduced power standby mode. The low-power version also offers a battery backup data retention capability at power supply levels as low as 2V. All inputs and outputs are TTL-compatible and operation is from a single 5V supply, simplifying system designs. Fully static asynchronous circuitry is used, requiring no clocks or refreshing for operation. | Ceramic Dual-In-Line Packages | 5962-3829414MZA |
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B82422A3829J108
TDK
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1 | SMD / SMT Inductors (Coils), L=0.0082μH, 3.2mm x 2.5mm [EIA 1210] | Inductors Precision Moulded | B82422A3829J108 |
3
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TSW-138-29-L-Q
SAMTEC
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1 | POST HEADER,THROUGH-HOLE | Other | TSW-138-29-L-Q |
2
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3-829868-3
TE Connectivity
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1 | Body Features: Primary Product Color Gray | Configuration Features: PCB Mount Orientation Right Angle | Number of Insulation Displacement Slots 3 | Card Entry Style Side | Number of Positions 3 | Connector Contact Load Condition Fully Loaded | Compatible With Wire & Cable Type Discrete Wire | Number of Rows 1 | Contact Features: Contact Base Material Copper Tin Alloy | Contact Retention Within Housing With | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 5 – 12 M | 3-829868-3 |
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3-829492-6
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: PCB Mount Orientation Vertical | Board-to-Board Configuration Parallel | Number of Positions 108 | Connector Contact Load Condition Fully Loaded | Number of Rows 3 | Contact Features: Contact Mating Area Plating Material Thickness 31.5 MICIN | Contact Underplating Material Nickel | Contact Base Material Brass | Contact Current Rating (Max) 5 AMP | Contact Shape & Form Square | Mating Square Post Dimension .025 INCH | Contact Mating Area Pl | 3-829492-6 |
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