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LCMXO2280C-3BN256I
Lattice Semiconductor
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1 | LATTICE SEMICONDUCTOR - LCMXO2280C-3BN256I - PLD, 2280 LUTS, MACHXO, 256CABGA | BGA | LCMXO2280C-3BN256I |
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10164228-0241A1RLF
Amphenol
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1 | 24 Position Connector Header, Outer Shroud Contacts Surface Mount Gold | Other | 10164228-0241A1RLF |
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LCMXO2280C-3FTN256CFJ2
Lattice Semiconductor
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1 | LCMXO2280C-3FTN256CFJ2 | BGA | LCMXO2280C-3FTN256CFJ2 |
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232280681622
Yageo Group
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1 | c | Resistor Chip | 232280681622 |
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LCMXO2280C-3TN144I
Lattice Semiconductor
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1 | FPGA - Field Programmable Gate Array 2280 LUTs 113 IO 1.8 /2.5/3.3V -3 Spd I | Quad Flat Packages | LCMXO2280C-3TN144I |
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HCJ22-805SK
Halo Electronics
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1 | Conn RJ-45 Stacked RCP 8POS/8POS/8POS/8POS 1.27mm Solder RA Thru-Hole 32 Terminal 4 Port - Trays | Other | HCJ22-805SK |
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22-28-0200
Molex
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1 | Molex KK 254 42227, 2.54mm Pitch, 20 Way, 1 Row PCB Header, Through Hole | Header, Vertical | 22-28-0200 |
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LCMXO2280C-4MN132I
Lattice Semiconductor
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1 | CPLD MachXO Family 1140 Macro Cells 1.8V/2.5V/3.3V 132-Pin CSBGA Tray | BGA | LCMXO2280C-4MN132I |
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AGM2222-802ME
COILCRAFT
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1 | Power Inductor, shielded, powdered iron, 20% tol, TH, RoHS, halogen-free | Other | AGM2222-802ME |
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SIT9121AI-2C2-33E122.800000
SiTime
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1 | 1 MHz − 220 MHz High Performance Differential Oscillator, 5 x 3.2mm Package | Other | SIT9121AI-2C2-33E122.800000 |
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46114-2280
Molex
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1 | Heavy Duty Power Connectors LPH VERT. ASSY NO GU NO GUIDES 2PX36S CKT | Other | 46114-2280 |
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BUK9K22-80EX
Nexperia
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1 | NEXPERIA - BUK9K22-80EX - Dual MOSFET, N Channel, 80 V, 21 A, 0.0157 ohm, SOT-1205, Surface Mount | Other | BUK9K22-80EX |
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3-643228-0
TE Connectivity
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1 | Configuration Features: Number of Positions 3 | Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Power Positions 3 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Multiple Contact Types Without | Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating M | Other | 3-643228-0 |
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ST02-280F1-5103
Shindengen Electric Manufacturing Co., Ltd.
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1 | ・TVS・Peak pulse power:200W・Small SMD・Available for automotive use・Pb free terminal・RoHS:Yes | Other | ST02-280F1-5103 |
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2132280930
Molex
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1 | 1.50mm Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Dual Row, Surface Mount, Right-Angle, 9 Circuits, Natural | Other | 2132280930 |
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2132280631
Molex
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1 | 1.50mm Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Dual Row, Surface Mount, Right-Angle, 6 Circuits, Natural | Other | 2132280631 |
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2132280711
Molex
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1 | 1.50mm Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Dual Row, Surface Mount, Right-Angle, 7 Circuits, Natural | Other | 2132280711 |
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2132280911
Molex
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1 | 1.50mm Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Dual Row, Surface Mount, Right-Angle, 9 Circuits, Natural | Other | 2132280911 |
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SIT5146AI-FD-33N0A12.228000
SiTime
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1 | Endura™ Series Super-TCXO, 5.0 mm x 3.2 mm Package | Other | SIT5146AI-FD-33N0A12.228000 |
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SCT2280KEC
ROHM Semiconductor
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1 | ROHM SCT2280KEC N-channel MOSFET Transistor, 14 A, 1200 V, 3-Pin TO-247 | Transistor Outline, Vertical | SCT2280KEC |
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AP22804BSN-7
Diodes Incorporated
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1 | DIODES INC. - AP22804BSN-7 - PWR LOAD SWITCH, 3A, HIGH-SIDE, UDFN6 | Other | AP22804BSN-7 |
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213228-0830
Molex
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1 | CLIK-MATE1.5 DRRA SMT AU0.38 ETP 8P NAT | Other | 213228-0830 |
3
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XR22800IL32-F
EXAR
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1 | USB Interface IC Hi-Speed USB 10/100 Ethernet Bridge | Quad Flat No-Lead | XR22800IL32-F |
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LCMXO2280C-5MN132C
Lattice Semiconductor
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1 | FPGA - Field Programmable Gate Array 2280 LUTs 101 IO 1.8 /2.5/3.3V -5 Spd | BGA | LCMXO2280C-5MN132C |
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ASSR-1228-002E
Avago Technologies
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1 | 0.2 A PCB Mount MOSFET Solid State Relay, 1.6 V | Dual-In-Line Packages | ASSR-1228-002E |
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