236-7 Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	2367196-6 TE Connectivity	1	PCB Mount Header, Right Angle, Wire-to-Board, 6 Position, 1 mm [.039 in] Centerline, Fully Shrouded, Tin, Surface Mount, Signal, Black	Other	2367196-6	3D model available Symbol and footprint available 3	1 Download Model
	TLP2367(V4-TPL,E Toshiba	1	High Speed Optocouplers Hi Spd Logic Output photocoupler; 5-pin SO6; RoHS;	Other	TLP2367(V4-TPL,E	3D model not available Symbol and footprint available 2	1 Download Model
	2367196-5 TE Connectivity	1	PCB Mount Header, Right Angle, Wire-to-Board, 5 Position, 1 mm [.039 in] Centerline, Fully Shrouded, Tin, Surface Mount, Signal, Black, Tape & Reel	Other	2367196-5	3D model available Symbol and footprint available 3	1 Download Model
	1822367 Phoenix Contact	1	PCB terminal block, nominal current: 13.5 A, rated voltage (III/2): 160 V, nominal cross section: 1.5 mm?, Number of potentials: 7, Number of rows: 1, Number of positions per row: 7, product range: SPT 1,5/..-V-THR, pitch: 3.5 mm, connection method: Push-in spring connection, mounting: THR soldering, conductor/PCB connection direction: 90 ?, color: black, Pin layout: Linear double pinning, Solder pin [P]: 2.6 mm, type of packaging: packed in cardboard	Other	1822367	3D model available Symbol and footprint available 3	1 Download Model

	2367196-3 TE Connectivity	1	Body Features: Primary Product Color Black \| Configuration Features: PCB Mount Orientation Right Angle \| Number of Rows 1 \| Number of Positions 3 \| Contact Features: Contact Mating Area Plating Material Thickness 50 MICIN \| Contact Current Rating (Max) 2 AMP \| Contact Mating Area Plating Material Finish Matte \| Contact Mating Area Plating Material Tin \| Contact Mating Area Plating Material Thickness 1.27 MICM \| Contact Type Pin \| Electrical Characteristics: Operating Voltage 50 VAC \| Housing Features: Housi	Other	2367196-3	3D model available Symbol and footprint available 3	1 Download Model
	723676L12PF8 Renesas Electronics	1	The 723676 is a 8K x 36 x 2 Triple Bus sync FIFO memory has two independent dual-port SRAM FIFOs on board each chip that can buffer data between a bidirectional 36-bit bus and two unidirectional 18-bit buses. FIFO data can be read and written using either 18-bit or 9-bit formats with a choice of Big- or Little-Endian configurations. Communication between each port may bypass the FIFOs via two mailbox registers. This device can operate in the IDT Standard mode or the first word fall through mode.	Quad Flat Packages	723676L12PF8	3D model available Symbol and footprint available 3	1 Download Model
	723672L12PF Renesas Electronics	1	The 723672 is a Bidirectional SyncFIFO (clocked) memory. Two independent 8,192 x 36 dual-port SRAM FIFOs on board each chip buffer data in opposite directions. Communication between each port may bypass the FIFOs via two 36-bit mailbox registers. The clocks for each port are independent of one another and can be asynchronous or coincident. The enables for each port are arranged to provide a simple bidirectional interface between microprocessors and/or buses with synchronous control.	Quad Flat Packages	723672L12PF	3D model available Symbol and footprint available 3	1 Download Model
	2367197-8 TE Connectivity	1	Body Features: Primary Product Color Black \| Configuration Features: Number of Rows 1 \| Number of Positions 8 \| PCB Mount Orientation Vertical \| Contact Features: Contact Mating Area Plating Material Thickness 1.27 MICM \| Contact Current Rating (Max) 2 AMP \| Contact Mating Area Plating Material Finish Matte \| Contact Type Pin \| Contact Mating Area Plating Material Thickness 50 MICIN \| Contact Mating Area Plating Material Tin \| Electrical Characteristics: Operating Voltage 50 VAC \| Housing Features: Centerli	Other	2367197-8	3D model available Symbol and footprint available 3	1 Download Model
	2367197-6 TE Connectivity	1	1.0mm WTB Side Vertical Type With Latch,Connector Header Surface Mount 6 position 0.039" (1.00mm)	Other	2367197-6	3D model available Symbol and footprint available 3	1 Download Model
	LTC2367CMS-16#PBF Analog Devices	1	Analog to Digital Converters - ADC 16-Bit, 500ksps, Pseudo-Differential Unipolar SAR ADC with 94.7dB SNR	Small Outline Packages	LTC2367CMS-16#PBF	3D model available Symbol and footprint available 3	1 Download Model
	SI2367DS-T1-GE3 Vishay	1	Vishay SI2367DS-T1-GE3 P-channel MOSFET Transistor, 2.2 A, -20 V, 3-Pin TO-236	SOT23 (3-Pin)	SI2367DS-T1-GE3	3D model available Symbol and footprint available 3	1 Download Model
	1622367-1 TE Connectivity	1	TE Connectivity LR1 Series Through Hole Thin Film Resistor 1MΩ ±1% 0.6W ±50ppm/°C	Resistors, Axial Diameter Horizontal Mounting	1622367-1	3D model available Symbol and footprint available 3	1 Download Model
	2367197-4 TE Connectivity	1	1.0mm WTB Side Vertical Type With Latch	Other	2367197-4	3D model available Symbol and footprint available 3	1 Download Model
	2367196-8 TE Connectivity	1	Body Features: Primary Product Color Black \| Configuration Features: PCB Mount Orientation Right Angle \| Number of Rows 1 \| Number of Positions 8 \| Contact Features: Contact Mating Area Plating Material Thickness 1.27 MICM \| Contact Current Rating (Max) 2 AMP \| Contact Type Pin \| Contact Mating Area Plating Material Finish Matte \| Contact Mating Area Plating Material Tin \| Contact Mating Area Plating Material Thickness 50 MICIN \| Electrical Characteristics: Operating Voltage 50 VAC \| Housing Features: Cente	Other	2367196-8	3D model available Symbol and footprint available 3	1 Download Model
	723673L12PF8 Renesas Electronics	1	The 723673 is a 8K x 36 unidirectional Sync FIFO memory which supports clock frequencies up to 83 MHz and has read access times as fast as 8ns. The clocks for each port are independent of one another and can be asynchronous or coincident. The enables for each port are arranged to provide a simple bidirectional interface between microprocessors and/or buses with synchronous control. Communication between each port may bypass the FIFO via two mailbox registers. This device can operate in the IDT Standard mode	Quad Flat Packages	723673L12PF8	3D model available Symbol and footprint available 3	1 Download Model

	723672L12PF8 Renesas Electronics	1	The 723672 is a Bidirectional SyncFIFO (clocked) memory. Two independent 8,192 x 36 dual-port SRAM FIFOs on board each chip buffer data in opposite directions. Communication between each port may bypass the FIFOs via two 36-bit mailbox registers. The clocks for each port are independent of one another and can be asynchronous or coincident. The enables for each port are arranged to provide a simple bidirectional interface between microprocessors and/or buses with synchronous control.	Quad Flat Packages	723672L12PF8	3D model available Symbol and footprint available 3	1 Download Model
	723672L15PF Renesas Electronics	1	The 723672 is a Bidirectional SyncFIFO (clocked) memory. Two independent 8,192 x 36 dual-port SRAM FIFOs on board each chip buffer data in opposite directions. Communication between each port may bypass the FIFOs via two 36-bit mailbox registers. The clocks for each port are independent of one another and can be asynchronous or coincident. The enables for each port are arranged to provide a simple bidirectional interface between microprocessors and/or buses with synchronous control.	Quad Flat Packages	723672L15PF	3D model available Symbol and footprint available 3	1 Download Model
	DF2367VF33V Renesas Electronics	1	The H8S/2368 Group is supported only for customers who have already adopted these products. The RX651 Group is recommended for new designs.	Quad Flat Packages	DF2367VF33V	3D model available Symbol and footprint available 3	1 Download Model
	1-2367197-0 TE Connectivity	1	1.0mm WTB Side Vertical Type With Latch	Other	1-2367197-0	3D model available Symbol and footprint available 3	1 Download Model
	1-2367196-0 TE Connectivity	1	1.0mm WTB RIGHT ANGLE TYPE WITH LATCH	Other	1-2367196-0	3D model available Symbol and footprint available 3	1 Download Model
	723676L12PF Renesas Electronics	1	The 723676 is a 8K x 36 x 2 Triple Bus sync FIFO memory has two independent dual-port SRAM FIFOs on board each chip that can buffer data between a bidirectional 36-bit bus and two unidirectional 18-bit buses. FIFO data can be read and written using either 18-bit or 9-bit formats with a choice of Big- or Little-Endian configurations. Communication between each port may bypass the FIFOs via two mailbox registers. This device can operate in the IDT Standard mode or the first word fall through mode.	Quad Flat Packages	723676L12PF	3D model available Symbol and footprint available 3	1 Download Model
	723673L12PF Renesas Electronics	1	The 723673 is a 8K x 36 unidirectional Sync FIFO memory which supports clock frequencies up to 83 MHz and has read access times as fast as 8ns. The clocks for each port are independent of one another and can be asynchronous or coincident. The enables for each port are arranged to provide a simple bidirectional interface between microprocessors and/or buses with synchronous control. Communication between each port may bypass the FIFO via two mailbox registers. This device can operate in the IDT Standard mode	Quad Flat Packages	723673L12PF	3D model available Symbol and footprint available 3	1 Download Model
	723676L15PF Renesas Electronics	1	The 723676 is a 8K x 36 x 2 Triple Bus sync FIFO memory has two independent dual-port SRAM FIFOs on board each chip that can buffer data between a bidirectional 36-bit bus and two unidirectional 18-bit buses. FIFO data can be read and written using either 18-bit or 9-bit formats with a choice of Big- or Little-Endian configurations. Communication between each port may bypass the FIFOs via two mailbox registers. This device can operate in the IDT Standard mode or the first word fall through mode.	Quad Flat Packages	723676L15PF	3D model available Symbol and footprint available 3	1 Download Model
	1823670 Phoenix Contact	1	PCB terminal block, nominal current: 13.5 A, rated voltage (III/2): 160 V, nominal cross section: 1.5 mm?, Number of potentials: 6, Number of rows: 1, Number of positions per row: 6, product range: SPT 1,5/..-H-THR, pitch: 3.5 mm, connection method: Push-in spring connection, mounting: THR soldering, conductor/PCB connection direction: 0 ?, color: black, Pin layout: Linear double pinning, Solder pin [P]: 2 mm, type of packaging: 44 mm wide tape	Other	1823670	3D model available Symbol and footprint available 3	1 Download Model
	723672L15PF8 Renesas Electronics	1	The 723672 is a Bidirectional SyncFIFO (clocked) memory. Two independent 8,192 x 36 dual-port SRAM FIFOs on board each chip buffer data in opposite directions. Communication between each port may bypass the FIFOs via two 36-bit mailbox registers. The clocks for each port are independent of one another and can be asynchronous or coincident. The enables for each port are arranged to provide a simple bidirectional interface between microprocessors and/or buses with synchronous control.	Quad Flat Packages	723672L15PF8	3D model available Symbol and footprint available 3	1 Download Model
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