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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	1586037-2 TE Connectivity	1	Configuration Features: Number of Power Positions 2 \| Number of Positions 2 \| PCB Mount Orientation Vertical \| Number of Rows 2 \| Contact Features: Contact Mating Area Plating Material Thickness 2.03 â€“ 5.08 MICM \| Contact Layout Inline \| Contact Type Pin \| Contact Current Rating (Max) 9 AMP \| PCB Contact Termination Area Plating Material Tin \| Contact Mating Area Plating Material Thickness 80 â€“ 200 MICIN \| Contact Retention Within Housing Without \| Contact Mating Area Plating Material Tin \| Dimensions:	Header, Shrouded - Straight PTH Box	1586037-2	3D model available Symbol and footprint available 3	1 Download Model
	1825860 Phoenix Contact	1	ICV 2,5/19-GF-5,08 - PCB headers, nominal cross section: 2.5 mm², color: green, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Sn, contact connection type: Socket, number of potentials: 19, number of rows: 1, number of positions: 19, number of connections: 19, product range: ICV 2,5/..-GF, pitch: 5.08 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.6 mm, number of solder pins per potential: 2, plug-in system: COMBICON MSTB 2,5, Pin connector patt	Other	1825860	3D model available Symbol and footprint available 3	1 Download Model
	MAX5860DUXH+ Analog Devices	1	Scalable High-Density Downstream Cable QAM Modulator	BGA	MAX5860DUXH+	3D model available Symbol and footprint available 3	1 Download Model
	NVB5860NLT4G onsemi	1	Obsolete - Power MOSFET 60V 220A 3 mOhm Single N-Channel D2PAK	Other	NVB5860NLT4G	3D model not available Symbol and footprint available 2	1 Download Model

	45586-0006 Molex	1	Mini-Fit Jr. Header, Dual Row, Right-Angle, Third Generation Polarization Type for PCIe Applications, 8 Circuits, UL 94V-0, 0.76µm Select Gold (Au) Plating, Black	Other	45586-0006	3D model available Symbol and footprint available 3	1 Download Model
	SGM58601AXTQK28G/TR SGMICRO	1	Ultra-Low Noise, 24-Bit Analog-to-Digital Converters -40℃ to +125℃	Quad Flat No-Lead	SGM58601AXTQK28G/TR	3D model available Symbol and footprint available 3	1 Download Model
	2-1586038-4 TE Connectivity	1	PCB Mount Header, Vertical, Wire-to-Board, 24 Position, 4.2 mm [.165 in] Centerline, Fully Shrouded, Tin, Through Hole - Solder, Power, Natural, Tray	Other	2-1586038-4	3D model available Symbol and footprint available 3	1 Download Model
	1586042-4 TE Connectivity	1	Configuration Features: Number of Rows 2 \| PCB Mount Orientation Right Angle \| Number of Power Positions 4 \| Number of Positions 4 \| Contact Features: PCB Contact Termination Area Plating Material Tin \| Contact Type Pin \| Contact Retention Within Housing Without \| Contact Mating Area Plating Material Thickness 2.03 MICM \| Contact Layout Inline \| Contact Mating Area Plating Material Thickness 80 MICIN \| Contact Layout Square Grid \| Contact Layout Matrix \| Contact Mating Area Plating Material Tin \| Contact Cu	Header, Shrouded - Right Angle PTH Box	1586042-4	3D model available Symbol and footprint available 3	1 Download Model
	1358600000 Weidmüller	1	PCB connector (board connection), 160 V, 13.4 A, Pitch in mm: 3.50, Number of poles: 16, THT/THR solder connection, Tape	Other	1358600000	3D model available Symbol and footprint available 3	1 Download Model
	SL17SMD05860Z Fischer Elektronik GmbH & Co. KG This part was updated within the past 30 days. Set alerts for model updates on the part download page.	1	Dual Row, Male, Pitch 2.54 x 2.54mm, SMT, 60 Position	Other	SL17SMD05860Z	3D model available Symbol and footprint available 3	1 Download Model
	2-1586042-4 TE Connectivity	1	Configuration Features: PCB Mount Orientation Right Angle \| Number of Positions 24 \| Number of Power Positions 24 \| Number of Rows 2 \| Contact Features: Contact Layout Matrix \| Contact Current Rating (Max) 9 AMP \| Contact Layout Inline \| Contact Type Pin \| Contact Retention Within Housing Without \| PCB Contact Termination Area Plating Material Tin \| Contact Mating Area Plating Material Thickness 2.03 MICM \| Contact Mating Area Plating Material Thickness 80 MICIN \| Contact Mating Area Plating Material Tin \|	Other	2-1586042-4	3D model available Symbol and footprint available 3	1 Download Model
	HI5860IBZ-T Renesas Electronics	1	The HI5860 is a 12-bit, 130MSPS (Mega Samples Per Second), High-Speed, low power, D/A converter which is implemented in an advanced CMOS process. Operating from a single +3V to +5V supply, the converter provides 20mA of full scale output current and includes edge-triggered CMOS input data latches. Low glitch energy and excellent frequency domain performance are achieved using a segmented current source architecture. This device complements the HI5x60 and HI5x28 family of High-Speed converters, which include	Small Outline Packages	HI5860IBZ-T	3D model available Symbol and footprint available 3	1 Download Model
	45586-0005 Molex	1	Mini-Fit Jr. Header, Dual Row, Right-Angle, Third Generation Polarization Type for PCIe Applications, 8 Circuits, UL 94V-0, 0.76µm Select Gold (Au) Plating, Black	Other	45586-0005	3D model available Symbol and footprint available 3	1 Download Model
	225860 TE Connectivity	1	M8, SMT, Power Element SMD Female Thread M8	Other	225860	3D model available Symbol and footprint available 3	1 Download Model
	SL28SMDTHR05860G Fischer Elektronik GmbH & Co. KG This part was updated within the past 30 days. Set alerts for model updates on the part download page.	1	male header 2.54 x 2.54 mm 60 contacts CuSn-alloy gold-plated ≤5 mΩ 3 A 250 V AC 2000 V UL 94 V-0 >107 Ω·m	Other	SL28SMDTHR05860G	3D model available Symbol and footprint available 3	1 Download Model

	1586076-1 TE Connectivity	1	Configuration Features: Number of Positions 4 \| PCB Mount Orientation Vertical \| Number of Power Positions 4 \| Number of Rows 1 \| Contact Features: Contact Type Pin \| PCB Contact Termination Area Plating Material Pre-Tin \| Contact Current Rating (Max) 12 AMP \| Contact Mating Area Plating Material Thickness 3.81 â€“ 5.08 MICM \| Contact Mating Area Plating Material Tin \| Contact Layout Inline \| Contact Retention Within Housing Without \| Contact Base Material Phosphor Bronze \| Contact Mating Area Plating Mater	Other	1586076-1	3D model available Symbol and footprint available 3	1 Download Model
	58603SL001 Alpha Wire	1	Wire And Cable		58603SL001	3D model not available Symbol and footprint not available 0	0 Build or Request
	58600132903-000 Spectrum Control	1	Feed Through Capacitor, 1 Function(s), 50V		58600132903-000	3D model not available Symbol and footprint not available 0	0 Build or Request
	5860-1CC Amphenol Cable & Interconnect Technologies	1	RF SMA Connector		5860-1CC	3D model not available Symbol and footprint not available 0	0 Build or Request
	58600138907-000 Spectrum Control	1	Feed Through Capacitor, 1 Function(s), 100V		58600138907-000	3D model not available Symbol and footprint not available 0	0 Build or Request
	58600138903-000 Spectrum Control	1	Feed Through Capacitor, 1 Function(s), 400V		58600138903-000	3D model not available Symbol and footprint not available 0	0 Build or Request
	58601-321 Amphenol FCi	1	IC Socket, PZA321, 321 Contact(s)		58601-321	3D model not available Symbol and footprint not available 0	0 Build or Request
	5860-3CCSF Amphenol Cable & Interconnect Technologies	1	RF SMA Connector		5860-3CCSF	3D model not available Symbol and footprint not available 0	0 Build or Request
	58600138902-000 Spectrum Control	1	Feed Through Capacitor, 1 Function(s), 400V		58600138902-000	3D model not available Symbol and footprint not available 0	0 Build or Request
	58600133903-000 Spectrum Control	1	Feed Through Capacitor, 1 Function(s), 50V		58600133903-000	3D model not available Symbol and footprint not available 0	0 Build or Request
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