2-134 Model Download Search Results
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TS21-34-035-BK-160-SMT-TR
CUI Devices
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0 | 3.4 x 3.4 mm, 0.35 mm Actuator Height, 160 gf, Surface Mount, SPST, Black Illuminated, Tactile Switch | Other | TS21-34-035-BK-160-SMT-TR |
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SPC21348
Multicomp Pro
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1 | MULTICOMP PRO SPC21348Phone Audio Connector, Jack, 3.5 mm, Silver Plated Contacts, Plastic Body | Other | SPC21348 |
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TMS5702134DPGEQQ1
Texas Instruments
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1 | ARM Microcontrollers - MCU 16/32 Bit RISC Flash MCU, Arm Cortex-R4F 144-LQFP -40 to 125 | Quad Flat Packages | TMS5702134DPGEQQ1 |
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2121340004
Molex
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1 | Pico-EZmate Plus PCB Header, 1.00mm Pitch, Single Row, Gold (Au) Plating, 4 Circuits | Other | 2121340004 |
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R5F21346XJFP#U0
Renesas Electronics
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1 | 16-bit Microcontrollers - MCU R8C34X 32+4+2.5K -40~85C CAN AU 48LQFP | Quad Flat Packages | R5F21346XJFP#U0 |
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212134-0006
Molex
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1 | CONN, HEADER, 6POS, 1ROW, 1MM | Other | 212134-0006 |
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OPA2134PAG4
Texas Instruments
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1 | Audio Amplifiers SoundPlus(TM) Hi-Perf Aud Oper Amp | Dual-In-Line Packages | OPA2134PAG4 |
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TPS62134BRGTT
Texas Instruments
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1 | 17-V Input, Step-down Converter with Low Power Mode Input for Intel SkyLake Platform | Quad Flat No-Lead | TPS62134BRGTT |
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OPA2134UA
Texas Instruments
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1 | SoundPlus™ Audio Operational Amplifier with Low Distortion, Low Noise and Precision | Small Outline Packages | OPA2134UA |
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1 | MCU 16-bit/32-bit ARM7TDMI-S RISC 128KB Flash 3.3V 64-Pin LQFP T/R | Quad Flat Packages | LPC2134FBD64/01,11 |
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MAL213450229E3
Vishay
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1 | VISHAY - MAL213450229E3 - CAP, 22µF, 35V, 20%, THROUGH HOLE | Capacitor, Polarized Radial Diameter | MAL213450229E3 |
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MMUN2134LT1G
onsemi
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1 | Bipolar Transistors - Pre-Biased 100mA 50V BRT PNP | SOT23 (3-Pin) | MMUN2134LT1G |
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OPA2134UA/2K5
Texas Instruments
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1 | Audio Amplifiers SoundPlus Hi-Perf Aud Oper Amp | Small Outline Packages | OPA2134UA/2K5 |
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HD64F2134TF20-V
Renesas Electronics
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1 | 16/32bit H8S/2000 Microcontroller, 20MHz, 128 kB Flash, 80-Pin TQFP | Quad Flat Packages | HD64F2134TF20-V |
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DMT2-134-4.8L
COILCRAFT
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1 | Fixed Inductors DMT1 Power Chokes Toroidal Output | Other | DMT2-134-4.8L |
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TPS62134DRGTR
Texas Instruments
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1 | 17-V Input, Step-down Converter with Low Power Mode Input for Intel SkyLake Platform | Quad Flat No-Lead | TPS62134DRGTR |
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MD2134K7-G
Microchip
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1 | RF Front End HI-SPEED ULTRASOUND BEAMFORMING DRIVER | Quad Flat No-Lead | MD2134K7-G |
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R5F2134CKDFP#V0
Renesas Electronics
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1 | The R8C/34K Group is supported only for the customers who have already adopted these products. For new adoption, please consider other products such as RL78/G1C Group.The R8C/34E Group, R8C/34F Group, R8C/34G Group, and R8C/34H Group of single-chip MCUs incorporate the R8C/Tiny Series CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed | Quad Flat Packages | R5F2134CKDFP#V0 |
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R5F21348KDFP#V0
Renesas Electronics
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1 | The R8C/34K Group is supported only for the customers who have already adopted these products. For new adoption, please consider other products such as RL78/G1C Group.The R8C/34E Group, R8C/34F Group, R8C/34G Group, and R8C/34H Group of single-chip MCUs incorporate the R8C/Tiny Series CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed | Quad Flat Packages | R5F21348KDFP#V0 |
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TFCR1210-4W-E-2134DT
Venkel
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1 | Thin Film CR,1210,1/4W,?25PPM,2.13M,?0.5% | Other | TFCR1210-4W-E-2134DT |
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2134536-2
TE Connectivity
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1 | Body Features: Shell Plating Material Tin over Nickel | Shell Plating Finish Matte | Offset 0 MM | Connector Profile Micro | Configuration Features: Number of Ports 1 | Number of Positions 5 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 1.8 AMP | Contact Mating Area Plating Material Thickness 29.52 MICIN | Dimensions: PCB Thickness (Recommended) .031 – .039 INCH | PCB Thickness (Recommended) .8 – 1. | Other | 2134536-2 |
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2134441-2
TE Connectivity
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1 | Body Features: Offset .88 MM | Shell Plating Material Tin over Nickel | Shell Plating Finish Matte | Connector Profile Micro | Configuration Features: Number of Positions 5 | Number of Ports 1 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Current Rating (Max) 1.8 AMP | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 29.52 MICIN | Dimensions: PCB Thickness (Recommended) .8 – 1. MM | PCB Thickness (Recommended) .031 – .039 | Other | 2134441-2 |
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TFCR1210-4W-E-2134DT-1K
Venkel
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1 | Thin Film CR,1210,1/4W,?25PPM,2.13M,?0.5% | Other | TFCR1210-4W-E-2134DT-1K |
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TFCR1210-4W-C-2134DT
Venkel
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1 | Thin Film CR,1210,1/4W,?50PPM,2.13M,?0.5% | Other | TFCR1210-4W-C-2134DT |
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TFCR1210-4W-E-2134CT-1K
Venkel
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1 | Thin Film CR,1210,1/4W,?25PPM,2.13M,?0.25% | Other | TFCR1210-4W-E-2134CT-1K |
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![Part Image](["https://componentsearchengine.com/Thumbnails/1/TS21-34-035-BK-160-SMT-TR.jpg",null,null])
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