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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action |
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7-5530843-7
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Signal Positions 0 | Number of Power Positions 6 | Keying & Polarized Position Locations 0 | Number of Positions 6 | Number of Dual Positions 3 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material Finish Matte | Contact Mating Area Plating Material Gold | PCB Contact Ter | Other | 7-5530843-7 |
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EL5308IUZ-T13
Renesas Electronics
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1 | The EL5108 and EL5308 are fixed gain amplifiers with a bandwidth of 450MHz. This makes these amplifiers ideal for today's High-Speed video and monitor applications. They feature internal gain-setting resistors and can be configured in a gain of +1, -1 or +2. The same bandwidth is seen in both gain-of-1 and gain-of-2 applications. The EL5108 and EL5308 also incorporate an enable and disable function to reduce the supply current to 25µA typical per amplifier. Allowing the CE pin to float or applying a low log | Small Outline Packages | EL5308IUZ-T13 |
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B41607A5308M008
TDK
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1 | Large Size Capacitors | Capacitor, Polarized Radial Diameter | B41607A5308M008 |
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665308124022
Würth Elektronik
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1 | WR-WTB Wire-to-Board Connectors 1.00 mm SMT Male Vertical Shrouded Header, 8 pins - Tape & Reel with Cap | Other | 665308124022 |
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2-5530843-0
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Power Positions 80 | Number of Positions 80 | Keying & Polarized Position Locations 0 | PCB Mount Orientation Vertical | Number of Signal Positions 0 | Number of Dual Positions 40 | Contact Features: Contact Type Socket | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 3 AMP | Contact Mating Area Plating Material Gold | Contact Underplating Material Nickel | Contact Base Material Phosphor Bronze | | Other | 2-5530843-0 |
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1-353082-2
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 3 Position, 10.16 mm [.399 in] Centerline, Fully Shrouded, Gold (Au), Dynamic 5000 Series | Other | 1-353082-2 |
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59453-081110EDHLF
Amphenol
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1 | 0.50mm Flex Connectors, FPC/FFC Side Entry ZIF Connector, Surface Mount, 8 Positions, Bottom Contact, 0.50mm (0.020in) Pitch. | Other | 59453-081110EDHLF |
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'HV5308PG-B-G-M919
Microchip
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1 | 'HV5308PG-B-G-M919 | Quad Flat Packages | 'HV5308PG-B-G-M919 |
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LP3470IM5-3.08
Texas Instruments
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1 | Processor Supervisor 3.08V 1 Active Low/Open Drain 5-Pin SOT-23 T/R | SOT23 (5-Pin) | LP3470IM5-3.08 |
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BQ25308RTER
Texas Instruments
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1 | Battery Management Standalone, 1-cell 17V 3A battery charger with dead-battery charge inhibit feature | Quad Flat No-Lead | BQ25308RTER |
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AD5308BRUZ-REEL
Analog Devices
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1 | Digital to Analog Converters - DAC OCTAL 8 BIT SPI MICROPWR IC | Small Outline Packages | AD5308BRUZ-REEL |
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AD5308ARUZ
Analog Devices
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1 | DAC,AD5308A 8bit 6us octal SPI TSSOP Analog Devices AD5308ARUZ, 8-channel 8 bit Serial DAC, 167ksps, 16-Pin TSSOP | Small Outline Packages | AD5308ARUZ |
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A625308AM-70SUF
AMIC Technology
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1 | Power Supply Range: 4.5V to 5.5VAccess times: 70 ns A625308A-S series: Operating: 35mA (max.) Standby: 10μA (max.) A625308A-SI/SU series: Operating: 35mA (max.) Standby: 15μA (max.)Extended operating temperature range: 0°C to 70°C for -S series, -25°C to 85°C for -SI series, -40°C to 85°C forSU series | Small Outline Packages | A625308AM-70SUF |
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LM3722IM5-3.08/NOPB
Texas Instruments
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1 | Texas Instruments LM3722IM5-3.08/NOPB, Processor Supervisor 2.5 V, 3.3 V, 5 V, Reset Input, 5-Pin SOT-23 | SOT23 (5-Pin) | LM3722IM5-3.08/NOPB |
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59453-082110EDHLF
Amphenol
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1 | FFC & FPC Connectors 0.50mm Flex Connectors, FPC/FFC Side Entry ZIF Connector, Surface Mount, 8 Positions, Top Contact, 0.50mm (0.020in) Pitch. | Other | 59453-082110EDHLF |
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PSS-420153-08
Hirosugi-Keiki
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1 | PBT4830 Pin Header / PSS-16 Pin (Square Pin), 2.54 mm Pitch, Straight (2 Rows) (PSS-420153-08) | Other | PSS-420153-08 |
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MSP430F5308IRGZR
Texas Instruments
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1 | MCU 16-bit MSP430 RISC 16KB Flash 2.5V/3.3V 48-Pin VQFN EP T/R | Quad Flat No-Lead | MSP430F5308IRGZR |
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MIC5308YMT-TR
Microchip
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1 | Input voltage range: 1.6V to 5.5VGuaranteed 150mA over temperatureUltra Low dropout voltage of 45mV at 150mAHigh PSRR, up to 90dB @ 1kHzOutput Voltage range: 0.8V to 2.0V• Very low ground current - 23µA under full loadBias supply voltage range: 2.5V to 5.5VStable with 1µF ceramic output capacitor150mA maximum output current at 1.6V input voltage• Very fast transient response - ideal for digital loadsThermal shutdown and current limit protection • Tiny 6-pin 1.6mm x 1.6mm Thin MLF® packag | Small Outline No-lead | MIC5308YMT-TR |
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MSP430F5308IZXH
Texas Instruments
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1 | MSP430 CPUXV2 series Microcontroller IC 16-Bit 25MHz 16KB (16K x 8) FLASH 80-NFBGA (5x5) | BGA | MSP430F5308IZXH |
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22-05-3081
Molex
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1 | Headers & Wire Housings R/A PCB HDR 8P TIN FRICTION LOCK | Header, Shrouded - Right Angle PTH Box | 22-05-3081 |
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414-53080-51
ept
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1 | 80 pins, unmated stacking height: 9.05 mm, for board-to-board distances from 10.8 to 15.4 mm, SMT, pitch 1.27 mm, Performance level 1, Parallel, Perpendicular, SMT, High Density, Rugged | Other | 414-53080-51 |
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413-53080-51
ept
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1 | 80 pins, unmated stacking height: 3.25 mm, for board-to-board distances from 9.5 to 18.4 mm, SMT, pitch 1.27 mm, Performance level 1, Parallel, Perpendicular, SMT, Cable-to-Board, High Density, Rugged | Other | 413-53080-51 |
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B41690A5308Q001
TDK
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1 | Axial-lead/Soldering Star Capacitors, 3000?F/25VDC, 18mm dia x 25mm length | Capacitors, Polarized Axial Diameter Horizontal Mounting | B41690A5308Q001 |
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8-5530843-8
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: PCB Mount Orientation Vertical | Number of Power Positions 40 | Number of Dual Positions 20 | Number of Positions 40 | Number of Signal Positions 0 | Contact Features: Contact Current Rating (Max) 3 AMP | Contact Base Material Phosphor Bronze | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating M | Other | 8-5530843-8 |
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406-53080-51
ept
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1 | 80 pins, unmated stacking height: 7.85 mm, SMT, 0.8 mm pitch, Performance level 1, Parallel, SMT, High Density, High Speed, Rugged | Other | 406-53080-51 |
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