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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	FDS8817NZ onsemi This part was updated within the past 30 days. Set alerts for model updates on the part download page.	1	Max rDS(on) = 7 m at VGS = 10 V, ID = 15 A\r\n• Max rDS(on) = 10 m at VGS = 4.5 V, ID = 12.6 A\r\n• HBM ESD Protection Level of 3.8 kV Typical*\r\n• High Performance Trench Technology for Extremely Low rDS(on)\r\n• High Power and Current Handling Capability\r\n• These Devices are Pb−Free and are RoHS Compliant	Small Outline Packages	FDS8817NZ	3D model available Symbol and footprint available 3	1 Download Model
	MAX96716F Analog Devices	1	● Full-Duplex Capability over a Single Coax or STP\r\nCable\r\n• 3Gbps Forward-Link Rate\r\n• 187.5Mbps Reverse-Link Rate\r\n● Dual Four-Lane D-PHY or Dual Two-Lane C-PHY\r\nMIPI CSI-2 v1.3 Output Ports\r\n• Aggregation and Replication Functions\r\n• Support for 16 Virtual Channels\r\n• Supports RAW8/10/12/14/16/20, RGB565/666/888,\r\nYUV422 8-/10-Bit, User-Defined and Generic LongPacket Data Types\r\n● Advanced MIPI D-PHY v1.2 Transmitters\r\n• 80Mbps to 2.5Gbps per Lane\r\n• Polarity Flip and Data-Lane Reassignment\r\n● Advanced M	Quad Flat No-Lead	MAX96716F	3D model available Symbol and footprint available 3	1 Download Model
	LTC2637HDE-LMI12TRPBF Analog Devices	0	Octal I2C VOUT DACs with 10ppm/°C Reference	Other	LTC2637HDE-LMI12TRPBF	3D model available Symbol and footprint available 3	1 Download Model
	LTC2637CDE-LMX10PBF Analog Devices	0	Octal I2C VOUT DACs with 10ppm/°C Reference	Other	LTC2637CDE-LMX10PBF	3D model available Symbol and footprint available 3	1 Download Model

	LTC2637IDE-LMI10TRPBF Analog Devices	0	Octal I2C VOUT DACs with 10ppm/°C Reference	Other	LTC2637IDE-LMI10TRPBF	3D model available Symbol and footprint available 3	1 Download Model
	LTC2637CDE-LMX8TRPBF Analog Devices	0	Octal I2C VOUT DACs with 10ppm/°C Reference	Other	LTC2637CDE-LMX8TRPBF	3D model available Symbol and footprint available 3	1 Download Model
	LTC2637CDE-LMX12TRPBF Analog Devices	0	Octal I2C VOUT DACs with 10ppm/°C Reference	Other	LTC2637CDE-LMX12TRPBF	3D model available Symbol and footprint available 3	1 Download Model
	LTC2637IDE-LMX12TRPBF Analog Devices	0	Octal I2C VOUT DACs with 10ppm/°C Reference	Other	LTC2637IDE-LMX12TRPBF	3D model available Symbol and footprint available 3	1 Download Model
	LTC2637IDE-LMX10PBF Analog Devices	0	I2C VOUT DACs with 10ppm/°C Reference	Other	LTC2637IDE-LMX10PBF	3D model available Symbol and footprint available 3	1 Download Model
	LTC2637IDE-LMX8PBF Analog Devices	0	I2C VOUT DACs with 10ppm/°C Reference	Other	LTC2637IDE-LMX8PBF	3D model available Symbol and footprint available 3	1 Download Model
	LTC2637HDE-LMI8TRPBF Analog Devices	0	Octal I2C VOUT DACs with 10ppm/°C Reference	Other	LTC2637HDE-LMI8TRPBF	3D model available Symbol and footprint available 3	1 Download Model
	T4144035041-000 TE Connectivity	1	Body Features: Shell Plating Material Nickel \| Circular Connector Insulation Material Type Polyamide GF \| Shell Base Material Brass \| Configuration Features: Number of Signal Positions 4 \| Number of Positions 4 \| Number of Power Positions 0 \| Contact Features: Circular Connector Contact Type Pin \| Reverse Gender Yes \| Housing Features: Circular Connector Shell Size 12 \| Industry Standards: UL Flammability Rating UL 94HB \| Mechanical Attachment: Polarization Code A \| Mating Alignment Type Keyed \| Connector M	Other	T4144035041-000	3D model available Symbol and footprint available 3	1 Download Model
	DA9215-XXUP6 Renesas Electronics	1	The DA9215 is a synchronous dual step-down converter supplying the processors core and GPU rail in smartphones, tablets, Ultrabooks, and other handheld applications requiring high currents. The DA9215 is also suitable for powering FPGAs.The input voltage range of 2.8V to 5.5V makes it suitable for the use of single-cell Lithium-ion battery applications and standard 5V supply or USB power supplies. DA9215 delivers 15A and 5A output current, suitable for the highest performing application processors such as m	BGA	DA9215-XXUP6	3D model available Symbol and footprint available 3	1 Download Model
	ISL89401ABZ Renesas Electronics	1	ISL89400, ISL89401 The ISL89400, ISL89401 are 100V, high frequency, half-bridge N-Channel power MOSFET driver ICs. They are based on the popular HIP2100, HIP2101 half-bridge drivers, but offer several performance improvements. The ISL89400 has additional input hysteresis for superior operation in noisy environments and the inputs of the ISL89401 (like those of the ISL89400) can now safely swing to the VDD supply rail. Finally, both parts are available in a very compact 9 Ld DFN package and an 8 Ld SOIC to m	Small Outline Packages	ISL89401ABZ	3D model available Symbol and footprint available 3	1 Download Model
	R5F10MPGDFB#70 Renesas Electronics	1	RL78/I1B microcontrollers adapt various electricity meter metrologies for different regulations by country and realize efficient power measurement by the combination of low active current 96uA/MHz, standby current 0.66uA (Halt mode with 32kHz oscillator and RTC backup on), 24-bit ΔΣA/D converter, phase adjustment circuits and high pass filter. CPU clock frequency can be minimized, taking advantage of the efficient power measurement features, which include the low power ΔΣ A/D converter 0.53mA/ch. RL78/I1B m	Quad Flat Packages	R5F10MPGDFB#70	3D model available Symbol and footprint available 3	1 Download Model

	R5F212H1SNSP#W4 Renesas Electronics	1	The R8C/2H Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/2G Group of single-chip MCUs incorporates the R8C/Tiny Series CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating m	Small Outline Packages	R5F212H1SNSP#W4	3D model available Symbol and footprint available 3	1 Download Model
	3-794638-8 TE Connectivity	1	Configuration Features: Number of Rows 2 \| PCB Mount Orientation Vertical \| Number of Positions 8 \| Number of Power Positions 8 \| Contact Features: Multiple Contact Types Without \| PCB Contact Termination Area Plating Material Thickness 2.54 MICM \| Contact Retention Within Housing Without \| PCB Contact Termination Area Plating Material Thickness 100 MICIN \| Contact Mating Area Plating Material Thickness 30 MICIN \| Contact Type Pin \| Contact Current Rating (Max) 5 AMP \| PCB Contact Termination Area Plating M	Other	3-794638-8	3D model available Symbol and footprint available 3	1 Download Model
	T4145515051-001 TE Connectivity	1	Body Features: Shell Base Material Brass \| Shell Plating Material Nickel \| Circular Connector Insulation Material Type Polyamide GF \| Configuration Features: Number of Power Positions 0 \| Number of Positions 5 \| Number of Signal Positions 5 \| Contact Features: Reverse Gender No \| Circular Connector Contact Type Socket \| Housing Features: Circular Connector Shell Size 12 \| Industry Standards: UL Flammability Rating UL 94HB \| Mechanical Attachment: Polarization Code D \| Connector Mounting Type Panel Mount \| M	Other	T4145515051-001	3D model available Symbol and footprint available 3	1 Download Model
	ISL8105AIRZ-T Renesas Electronics	1	The ISL8105, ISL8105A is a simple single-phase PWM controller for a synchronous buck converter. It operates from +5V or +12V bias supply voltage. With integrated linear regulator, boot diode, and N-Channel MOSFET gate drivers, the ISL8105, ISL8105A reduces external component count and board space requirements. These make the IC suitable for a wide range of applications. Utilizing voltage-mode control, the output voltage can be precisely regulated to as low as 0. 6V. The 0. 6V internal reference features a m	Small Outline No-lead	ISL8105AIRZ-T	3D model available Symbol and footprint available 3	1 Download Model
	282826-3 TE Connectivity	1	Body Features: Primary Product Color Green \| Product Orientation Vertical \| Configuration Features: Number of Rows 1 \| Number of Positions 3 \| Stacking Configuration Side Stackable \| Contact Features: Contact Base Material Copper Alloy \| Contact Mating Area Plating Material Tin \| Contact Current Rating (Max) 15 AMP \| Dimensions: Wire Size 30 â€“ 12 AWG \| Wire Size .05 â€“ 3 MMSQ \| Electrical Characteristics: Operating Voltage 600 VAC \| Housing Features: Centerline (Pitch) .394 INCH \| Centerline (Pitch) 10 M	Other	282826-3	3D model available Symbol and footprint available 3	1 Download Model
	STM32F303VDT6TR STMicroelectronics This part was updated within the past 30 days. Set alerts for model updates on the part download page.	1	• Core: ARM® Cortex®-M4 32-bit CPU with\r\n72 MHz FPU, single-cycle multiplication and\r\nHW division, 90 DMIPS (from CCM), DSP\r\ninstruction and MPU (memory protection unit)\r\n• Operating conditions:\r\n– VDD, VDDA voltage range: 2.0 V to 3.6 V\r\n• Memories\r\n– Up to 512 Kbytes of Flash memory\r\n– 64 Kbytes of SRAM, with HW parity check\r\nimplemented on the first 32 Kbytes.\r\n– Routine booster: 16 Kbytes of SRAM on\r\ninstruction and data bus, with HW parity\r\ncheck (CCM)\r\n– Flexible memory controller (FSMC) for\r\nstatic m	Quad Flat Packages	STM32F303VDT6TR	3D model available Symbol and footprint available 3	1 Download Model
	2-1761608-6 TE Connectivity	1	Body Features: Primary Product Color Blue \| Connector Profile Low \| Daisy Chain With \| Configuration Features: Number of Rows 2 \| PCB Mount Orientation Vertical \| Number of Positions 16 \| Contact Features: Contact Underplating Material Nickel \| PCB Contact Termination Area Plating Material Tin \| Contact Current Rating (Max) 1 AMP \| Contact Base Material Phosphor Bronze \| PCB Contact Termination Area Plating Material Thickness 100 MICIN \| Contact Type Pin \| Contact Mating Area Plating Material Thickness 30 M	Header, Shrouded - Straight PTH Box	2-1761608-6	3D model available Symbol and footprint available 3	1 Download Model
	796636-4 TE Connectivity	1	Body Features: Product Orientation Vertical \| Primary Product Color Green \| Configuration Features: Number of Rows 1 \| Number of Positions 4 \| Stacking Configuration Side Stackable \| Contact Features: Contact Current Rating (Max) 15 AMP \| Contact Mating Area Plating Material Tin \| Contact Base Material Copper Magnesium \| Dimensions: Wire Size .05 â€“ 3 MMSQ \| Wire Size 30 â€“ 12 AWG \| Electrical Characteristics: Operating Voltage 300 VAC \| Housing Features: Housing Material PA 66 \| Centerline (Pitch) 5.08 M	Header, Shrouded - Straight PTH Box	796636-4	3D model available Symbol and footprint available 3	1 Download Model
	2311763-3 TE Connectivity	1	Body Features: Connector Profile Standard \| Primary Product Color Black \| Configuration Features: Number of Rows 3 \| PCB Mount Orientation Right Angle \| Number of Positions 15 \| Contact Features: Contact Shape & Form Round \| Contact Current Rating (Max) 3 AMP \| Dimensions: Row-to-Row Spacing .077 INCH \| Row-to-Row Spacing 1.98 MM \| Housing Features: Housing Material PBT GF \| Centerline (Pitch) .09 INCH \| Centerline (Pitch) 2.29 MM \| Mechanical Attachment: Mating Retention Type Threaded Inserts, 4-40 UNC \| M	Other	2311763-3	3D model available Symbol and footprint available 3	1 Download Model
	826955-2 TE Connectivity	1	Body Features: Primary Product Color Green \| Configuration Features: Number of Positions 4 \| Connector Contact Load Condition Fully Loaded \| Board-to-Board Configuration Perpendicular \| PCB Mount Orientation Right Angle \| Number of Rows 2 \| Contact Features: Contact Underplating Material Nickel \| Contact Mating Area Plating Material Thickness 3 MICM \| Contact Mating Area Plating Material Tin \| Mating Square Post Dimension .025 INCH \| PCB Contact Termination Area Plating Material Thickness 2 MICM \| Contact M	Other	826955-2	3D model available Symbol and footprint available 3	1 Download Model
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