2309- Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	TLP2309(E(T Toshiba	1	Toshiba TLP2309(E(T DC Input IC Output Optocoupler, Surface Mount, 5-Pin SO-6	Small Outline Packages	TLP2309(E(T	3D model available Symbol and footprint available 3	1 Download Model
	SQ2309CES-T1_GE3 Vishay	1	MOSFET Automotive P-Channel 60 V (D-S) 175C MOSFET SOT-23 , 370 mohm a. 10V, 500 mohm a. 4.5V	SOT23 (3-Pin)	SQ2309CES-T1_GE3	3D model available Symbol and footprint available 3	1 Download Model
	2309NZ-1HPGGI Renesas Electronics	1	The IDT2309NZ is a low-cost buffer designed to distribute high-speed clocks in mobile PC systems and desktop PC systems with SDRAM support. This part has nine outputs, eight of which can be used to drive two DIMMs or four SO-DIMMs, and the remaining can be used for external feedback to a PLL. The IDT2309NZ operates at 3.3V and outputs can run up to 133.33MHz The IDT2309NZ is designed for low EMI and power optimization. It has multiple VDD and VSS pins for noise optimization and consumes less than 32mA at 66	Small Outline Packages	2309NZ-1HPGGI	3D model available Symbol and footprint available 3	1 Download Model
	TSW-123-09-SS-S SAMTEC	1	23 Position, Single Row, Classic PCB Header Strips, 0.100" pitch	Other	TSW-123-09-SS-S	3D model not available Symbol and footprint available 2	1 Download Model

	TSW-123-09-L-D SAMTEC	1	46 Position, Classic PCB Header Strips, 0.100" pitch	Other	TSW-123-09-L-D	3D model not available Symbol and footprint available 2	1 Download Model
	TSW-123-09-L-S SAMTEC	1	23 Position, Single Row, Classic PCB Header Strips, 0.100" pitch	Other	TSW-123-09-L-S	3D model not available Symbol and footprint available 2	1 Download Model
	TSW-123-09-TM-D SAMTEC	1	46 Position, Classic PCB Header Strips, 0.100" pitch	Other	TSW-123-09-TM-D	3D model not available Symbol and footprint available 2	1 Download Model
	2309NZ-1HDCG Renesas Electronics	1	The IDT2309NZ is a low-cost buffer designed to distribute high-speed clocks in mobile PC systems and desktop PC systems with SDRAM support. This part has nine outputs, eight of which can be used to drive two DIMMs or four SO-DIMMs, and the remaining can be used for external feedback to a PLL. The IDT2309NZ operates at 3.3V and outputs can run up to 133.33MHz The IDT2309NZ is designed for low EMI and power optimization. It has multiple VDD and VSS pins for noise optimization and consumes less than 32mA at 66	Small Outline Packages	2309NZ-1HDCG	3D model available Symbol and footprint available 3	1 Download Model
	ERF8-023-09.0-STL-DV-TR SAMTEC	1	46 Position, 0.80 mm Edge Rate® Rugged High Speed Socket	Other	ERF8-023-09.0-STL-DV-TR	3D model not available Symbol and footprint available 2	1 Download Model
	ERF8-023-09.0-STL-DV SAMTEC	1	46 Position, 0.80 mm Edge Rate® Rugged High Speed Socket	Other	ERF8-023-09.0-STL-DV	3D model not available Symbol and footprint available 2	1 Download Model
	TSW-123-09-LM-D SAMTEC	1	46 Position, Classic PCB Header Strips, 0.100" pitch	Other	TSW-123-09-LM-D	3D model not available Symbol and footprint available 2	1 Download Model
	223090 ERNI	1	200-pin, vertical, pressfit	Other	223090	3D model available Symbol and footprint available 3	1 Download Model
	2309NZ-1HDCGI8 Renesas Electronics	1	The IDT2309NZ is a low-cost buffer designed to distribute high-speed clocks in mobile PC systems and desktop PC systems with SDRAM support. This part has nine outputs, eight of which can be used to drive two DIMMs or four SO-DIMMs, and the remaining can be used for external feedback to a PLL. The IDT2309NZ operates at 3.3V and outputs can run up to 133.33MHz The IDT2309NZ is designed for low EMI and power optimization. It has multiple VDD and VSS pins for noise optimization and consumes less than 32mA at 66	Small Outline Packages	2309NZ-1HDCGI8	3D model available Symbol and footprint available 3	1 Download Model
	2309413-1 TE Connectivity	1	Body Features: Module Key Type Offset Left \| Ejector Location Both Ends \| Retention Post Location Both Ends \| Ejector Type Locking \| Retention Post Material Stainless Steel \| Latch Material High Temperature Thermoplastic \| Connector Profile High \| Configuration Features: Number of Keys 1 \| Number of Rows 2 \| Number of Positions 260 \| Module Orientation Right Angle \| Contact Features: Contact Underplating Material Nickel \| Contact Mating Area Plating Material Gold Flash \| Contact Base Material Copper Alloy \|	Other	2309413-1	3D model available Symbol and footprint available 3	1 Download Model
	2309A-1HPGG8 Renesas Electronics	1	The 2309A is a high-speed phase-lock loop (PLL) clock buffer, designed to address high-speed clock distribution applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 133MHz. The 2309A is a 16-pin version of the 2305A. The 2309A accepts one reference input, and drives two banks of four low skew clocks. The -1H version of this device operates up to 133MHz frequency and has higher drive than the -1 device. All parts ha	Small Outline Packages	2309A-1HPGG8	3D model available Symbol and footprint available 3	1 Download Model

	2309407-1 TE Connectivity	1	Body Features: Retention Post Material Stainless Steel \| Retention Post Location Both Ends \| Ejector Type Locking \| Latch Material High Temperature Thermoplastic \| Module Key Type Offset Left \| Ejector Location Both Ends \| Connector Profile Low \| Configuration Features: Number of Rows 2 \| Number of Positions 260 \| Module Orientation Right Angle \| Number of Keys 1 \| Contact Features: Contact Current Rating (Max) .5 AMP \| Contact Mating Area Plating Material Gold Flash \| PCB Contact Termination Area Plating M	Other	2309407-1	3D model available Symbol and footprint available 3	1 Download Model
	2309B-1HPGGI Renesas Electronics	1	The IDT2309B is a high-speed phase-lock loop (PLL) clock buffer, designed to address high-speed clock distribution applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 133MHz. The IDT2309B is a 16-pin version of the IDT2305B. The IDT2309B accepts one reference input, and drives two banks of four low skew clocks. The -1H version of this device operates at up to 133MHz frequency and has higher drive than the -1 devic	Small Outline Packages	2309B-1HPGGI	3D model available Symbol and footprint available 3	1 Download Model
	2309A-1HPGGI Renesas Electronics	1	The 2309A is a high-speed phase-lock loop (PLL) clock buffer, designed to address high-speed clock distribution applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 133MHz. The 2309A is a 16-pin version of the 2305A. The 2309A accepts one reference input, and drives two banks of four low skew clocks. The -1H version of this device operates up to 133MHz frequency and has higher drive than the -1 device. All parts ha	Small Outline Packages	2309A-1HPGGI	3D model available Symbol and footprint available 3	1 Download Model
	TSW-123-09-T-D SAMTEC	1	46 Position, Classic PCB Header Strips, 0.100" pitch	Other	TSW-123-09-T-D	3D model not available Symbol and footprint available 2	1 Download Model
	2309B-1HDCGI8 Renesas Electronics	1	The IDT2309B is a high-speed phase-lock loop (PLL) clock buffer, designed to address high-speed clock distribution applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 133MHz. The IDT2309B is a 16-pin version of the IDT2305B. The IDT2309B accepts one reference input, and drives two banks of four low skew clocks. The -1H version of this device operates at up to 133MHz frequency and has higher drive than the -1 devic	Small Outline Packages	2309B-1HDCGI8	3D model available Symbol and footprint available 3	1 Download Model
	V23092A1024A302 TE Connectivity	1	Body Features: Product Weight .2116 OZ \| Insulation Special Features Tracking Index of Relay Base PTI250 \| Product Weight 6 G \| Contact Features: Contact Current Rating (Max) 6 AMP \| Contact Material AgSnO2 \| Contact Current Class 16 AMP \| Contact Plating Material Gold \| Contact Arrangement 1 Form A (NO) \| Contact Number of Poles 1 \| Dimensions: Product Length 1.1 INCH \| Product Height 15 MM \| Width Class (Mechanical) 0 â€“ 6 MM \| Product Height .59 INCH \| Length Class (Mechanical) 25 â€“ 30 MM \| Product Wi	Other	V23092A1024A302	3D model available Symbol and footprint available 3	1 Download Model
	ERF8-023-09.0-S-DV-L-K-TR SAMTEC	1	46 Position, 0.80 mm Edge Rate® Rugged High Speed Socket	Other	ERF8-023-09.0-S-DV-L-K-TR	3D model not available Symbol and footprint available 2	1 Download Model
	2309NZ-1HPGGI8 Renesas Electronics	1	The IDT2309NZ is a low-cost buffer designed to distribute high-speed clocks in mobile PC systems and desktop PC systems with SDRAM support. This part has nine outputs, eight of which can be used to drive two DIMMs or four SO-DIMMs, and the remaining can be used for external feedback to a PLL. The IDT2309NZ operates at 3.3V and outputs can run up to 133.33MHz The IDT2309NZ is designed for low EMI and power optimization. It has multiple VDD and VSS pins for noise optimization and consumes less than 32mA at 66	Small Outline Packages	2309NZ-1HPGGI8	3D model available Symbol and footprint available 3	1 Download Model
	V23092-A1024-A302 TE Connectivity	1	General Purpose Relays SPST-NO 1 N/O 24vdc	Other	V23092-A1024-A302	3D model available Symbol and footprint available 3	1 Download Model
	744230900 Würth Elektronik	1	SMD Common Mode Noise Suppressor WE-CNSW	Other	744230900	3D model available Symbol and footprint available 3	1 Download Model
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