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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action |
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NTCDS3KG203HC3NT
TDK
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1 | NTC Elements, Nominal Resistance=20.00k? at 25?, Glass encapsulated Axial lead, Ammo Pack Taping | Other | NTCDS3KG203HC3NT |
3
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CDSOD323-T12C-Q
Bourns
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1 | DIO TVS VWM 12V 350W BIDIR SOD323,-55 to +150 °C | Small Outline Diode | CDSOD323-T12C-Q |
2
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NTCDS3HG222HC3NB
TDK
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1 | NTC Elements, Nominal Resistance=2.186k? at 25?, Glass encapsulated Axial lead | Other | NTCDS3HG222HC3NB |
3
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NCV4276CDSADJR4G
onsemi
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1 | Thermal Overload; Output Current up to 400 mA; Fault Protections:; 3.3 V, 5.0 V, and Adjustable Voltage Version (from 2.5 V to 20 V) ±2% Output Voltage; Inhibit Input; +45 V Peak Transient Voltage; 500 mV (max) Dropout Voltage (5.0 V Output); AEC-Q100 Qualified; -42 V Reverse Voltage; Short Circuit | Other | NCV4276CDSADJR4G |
2
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NTCDS4AG502HC4NB
TDK
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1 | NTC Elements, Nominal Resistance=5.000k? at 25?, Glass encapsulated Axial lead | Other | NTCDS4AG502HC4NB |
3
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KC2016Z33.3333C15XXK
Kyocera AVX
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1 | CLOCK OSCILLATOR,2.0X1.6X0.8MM S | Other | KC2016Z33.3333C15XXK |
3
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NTCDS3HG103HC4NT
TDK
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1 | NTC Elements, Nominal Resistance=10.00k? at 25?, Glass encapsulated Axial lead, Ammo Pack Taping | Other | NTCDS3HG103HC4NT |
3
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NTCDS4AG503HC4NT
TDK
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1 | NTC Elements, Nominal Resistance=50.00k? at 25?, Glass encapsulated Axial lead, Ammo Pack Taping | Other | NTCDS4AG503HC4NT |
3
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NTCDS3SG104HC4NT
TDK
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1 | NTC Elements, Nominal Resistance=100.0k? at 25?, Glass encapsulated Axial lead, Ammo Pack Taping | Other | NTCDS3SG104HC4NT |
3
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R5F21324CDSP#U0
Renesas Electronics
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1 | The R8C/32C Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/32C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow | Small Outline Packages | R5F21324CDSP#U0 |
3
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NTCDS3UG942HC3NT
TDK
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1 | NTC Elements, Nominal Resistance=9.395k? at 25?, Glass encapsulated Axial lead, Ammo Pack Taping | Other | NTCDS3UG942HC3NT |
3
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NTCDS3HG222HC4NB
TDK
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1 | NTC Elements, Nominal Resistance=2.186k? at 25?, Glass encapsulated Axial lead | Other | NTCDS3HG222HC4NB |
3
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R5F21322CDSP#54
Renesas Electronics
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1 | The R8C/32C Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/32C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow | Small Outline Packages | R5F21322CDSP#54 |
3
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CDS-15158-SMT
Same Sky
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1 | 15 mm, Square Frame, 0.3 W, 8 Ohm, Samarium Cobalt Magnet, PET Cone, Speaker | Other | CDS-15158-SMT |
3
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NTCDS3KG492HC4NT
TDK
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1 | NTC Elements, Nominal Resistance=4.961k? at 25?, Glass encapsulated Axial lead, Ammo Pack Taping | Other | NTCDS3KG492HC4NT |
3
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NTCDS3UG942HC4NT
TDK
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1 | NTC Elements, Nominal Resistance=9.395k? at 25?, Glass encapsulated Axial lead, Ammo Pack Taping | Other | NTCDS3UG942HC4NT |
3
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NTCDS4AG493HC4NB
TDK
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1 | NTC Elements, Nominal Resistance=49.20k? at 25?, Glass encapsulated Axial lead | Other | NTCDS4AG493HC4NB |
3
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NTCDS4AG502HC3NT
TDK
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1 | NTC Elements, Nominal Resistance=5.000k? at 25?, Glass encapsulated Axial lead, Ammo Pack Taping | Other | NTCDS4AG502HC3NT |
3
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NTCDS4AG503HC3NB
TDK
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1 | NTC Elements, Nominal Resistance=50.00k? at 25?, Glass encapsulated Axial lead | Other | NTCDS4AG503HC3NB |
3
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NTCDS4AG503HC3NT
TDK
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1 | NTC Elements, Nominal Resistance=50.00k? at 25?, Glass encapsulated Axial lead, Ammo Pack Taping | Other | NTCDS4AG503HC3NT |
3
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254977
TE Connectivity
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1 | ERNI 128 Way 2.54mm Pitch, Type CD Class C2, 4 Row, Straight DIN 41612 Connector, Socket | Other | 254977 |
3
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R5F1016CDSP#V0
Renesas Electronics
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1 | The RL78/G13 microcontrollers balance the industry's lowest level of consumption current (CPU: 66 μA/MHz, standby (STOP): 230 nA) and a high performance of 43.2 DMIPS (32 MHz). They have an on-chip oscillator, data flash, A/D converter, and more. Built-in safety features (function that detects illegal operation of hardware) enable support for the household appliance safety standard (IEC/UL 60730). These microcontrollers can be used in a wide variety of applications from home and consumer appliances to indus | Small Outline Packages | R5F1016CDSP#V0 |
3
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NTCDS3HG103HC4NB
TDK
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1 | NTC Elements, Nominal Resistance=10.00k? at 25?, Glass encapsulated Axial lead | Other | NTCDS3HG103HC4NB |
3
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NTCDS4AG502HC3NB
TDK
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1 | NTC Elements, Nominal Resistance=5.000k? at 25?, Glass encapsulated Axial lead | Other | NTCDS4AG502HC3NB |
3
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R5F21321CDSP#30
Renesas Electronics
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1 | The R8C/32C Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/32C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow | Small Outline Packages | R5F21321CDSP#30 |
3
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