R5F21 Footprint, Symbol and 3D Model search results

Showing 25 of 3061 results

Price & Stock Powered by

Filter by Manufacturer

Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	R5F21334CYFP#V2 Renesas Electronics	1	16-bit Microcontrollers - MCU R8C33C 16+4KB 1.8/5.5V -20~105C 32LQFP	Quad Flat Packages	R5F21334CYFP#V2	3D model available Symbol and footprint available 3	1 Download Model
	R5F21387CNFP#U0 Renesas Electronics	1	16-bit Microcontrollers - MCU R8C38C 48+4KB 1.8/5.5V -20~85C 80LQFP	Quad Flat Packages	R5F21387CNFP#U0	3D model available Symbol and footprint available 3	1 Download Model
	R5F2121CJFP#U0 Renesas Electronics	1	The R8C/21 Group is supported only for customers who have already adopted these products.This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1Mb of address space, it is capable of executing instructions at high speed. This Furthermore, the data flash (1KB x 2 blocks) is embedded in the R8C/21 Group. The difference	Quad Flat Packages	R5F2121CJFP#U0	3D model available Symbol and footprint available 3	1 Download Model
	R5F2134CKDFP#V0 Renesas Electronics	1	The R8C/34K Group is supported only for the customers who have already adopted these products. For new adoption, please consider other products such as RL78/G1C Group.The R8C/34E Group, R8C/34F Group, R8C/34G Group, and R8C/34H Group of single-chip MCUs incorporate the R8C/Tiny Series CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed	Quad Flat Packages	R5F2134CKDFP#V0	3D model available Symbol and footprint available 3	1 Download Model

	R5F212L4SNFP#V2 Renesas Electronics	1	The R8C/2L Group is supported only for customers who have already adopted these products. The RL78/G1F Group is recommended for new designs.The R8C/2K Group and R8C/2L Group of single-chip MCUs incorporates the R8C/Tiny Series CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supp	Quad Flat Packages	R5F212L4SNFP#V2	3D model available Symbol and footprint available 3	1 Download Model
	R5F21194SP#U0 Renesas Electronics	1	The R8C/19 Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded-HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high sp	Small Outline Packages	R5F21194SP#U0	3D model available Symbol and footprint available 3	1 Download Model
	R5F21262SNFP#X6 Renesas Electronics	1	The R8C/26 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu	Quad Flat Packages	R5F21262SNFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F21388SNFP#V0 Renesas Electronics	1	The R8C/38T-A Group of single-chip MCUs incorporates the R8C CPU core, which provides sophisticated instructions for a high level of efficiency.The R8C/38T-A Group of single-chip microcontrollers (MCUs) incorporates the R8C CPU core, which provides sophisticated instructions for a high level of efficiency. With 1Mb of address space, the CPU core is capable of executing instructions at high speed. In addition, it features a multiplier for high-speed arithmetic processing.Power consumption is low, and additio	Quad Flat Packages	R5F21388SNFP#V0	3D model available Symbol and footprint available 3	1 Download Model
	R5F212ACSNFP#V2 Renesas Electronics	1	The R8C/2A Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 20-pin molded-plastic LSSOP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/29 Group has on-chip dat	Quad Flat Packages	R5F212ACSNFP#V2	3D model available Symbol and footprint available 3	1 Download Model
	R5F21388CNFP#30 Renesas Electronics	1	The R8C/38C Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.The R8C/38C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow	Quad Flat Packages	R5F21388CNFP#30	3D model available Symbol and footprint available 3	1 Download Model
	R5F2123CJFP#U0 Renesas Electronics	1	The R8C/23 Group is supported only for customers who have already adopted these products.This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1Mb of address space, it is capable of executing instructions at high speed. This MCU is equipped with one CAN module and suited to in-vehicle or FA networking. Furthermore,	Quad Flat Packages	R5F2123CJFP#U0	3D model available Symbol and footprint available 3	1 Download Model
	R5F21348KDFP#V0 Renesas Electronics	1	The R8C/34K Group is supported only for the customers who have already adopted these products. For new adoption, please consider other products such as RL78/G1C Group.The R8C/34E Group, R8C/34F Group, R8C/34G Group, and R8C/34H Group of single-chip MCUs incorporate the R8C/Tiny Series CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed	Quad Flat Packages	R5F21348KDFP#V0	3D model available Symbol and footprint available 3	1 Download Model
	R5F21262SNFP#V2 Renesas Electronics	1	The R8C/26 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu	Quad Flat Packages	R5F21262SNFP#V2	3D model available Symbol and footprint available 3	1 Download Model
	R5F2135CCDFP#30 Renesas Electronics	1	The R8C/35C Group is supported only for customers who have already adopted these products. The RL78/G14, RL78/G1F Groups are recommended for new designs.The R8C/35C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating	Quad Flat Packages	R5F2135CCDFP#30	3D model available Symbol and footprint available 3	1 Download Model
	R5F211B4SP#U0 Renesas Electronics	1	The R8C/1B Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high	Small Outline Packages	R5F211B4SP#U0	3D model available Symbol and footprint available 3	1 Download Model

	R5F21248SDFP#V2 Renesas Electronics	1	The R8C/24 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1Mb of address space, it is capable of executing instructions at high speed. This MCU is equipped with one CAN module and s	Quad Flat Packages	R5F21248SDFP#V2	3D model available Symbol and footprint available 3	1 Download Model
	R5F21388CNFP#V0 Renesas Electronics	1	The R8C/38C Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.The R8C/38C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow	Quad Flat Packages	R5F21388CNFP#V0	3D model available Symbol and footprint available 3	1 Download Model
	R5F21134FP Renesas Electronics	1	The R8C/13 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.This MCU is built using the high-performance silicon gate CMOS process using a R8C/Tiny Series CPU core and is packaged in a 32-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1Mb of address space, it is capable of executing instructions at high speed. The data flash ROM (2KB X 2 blocks)	Quad Flat Packages	R5F21134FP	3D model available Symbol and footprint available 3	1 Download Model
	R5F21194NP#U0 Renesas Electronics	1	The R8C/19 Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded-HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high sp	Quad Flat No-Lead	R5F21194NP#U0	3D model available Symbol and footprint available 3	1 Download Model
	R5F211B3SP#U0 Renesas Electronics	1	The R8C/1B Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high	Small Outline Packages	R5F211B3SP#U0	3D model available Symbol and footprint available 3	1 Download Model
	R5F21244SNFP#V2 Renesas Electronics	1	The R8C/24 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1Mb of address space, it is capable of executing instructions at high speed. This MCU is equipped with one CAN module and s	Quad Flat Packages	R5F21244SNFP#V2	3D model available Symbol and footprint available 3	1 Download Model
	R5F21264JFP#W4 Renesas Electronics	1	The R8C/26 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu	Quad Flat Packages	R5F21264JFP#W4	3D model available Symbol and footprint available 3	1 Download Model
	R5F21266SNFP#V2 Renesas Electronics	1	The R8C/26 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu	Quad Flat Packages	R5F21266SNFP#V2	3D model available Symbol and footprint available 3	1 Download Model
	R5F2136ACNFP#V0 Renesas Electronics	1	The R8C/36C Group is supported only for customers who have already adopted these products. The RL78/G14, RL78/G1F Groups are recommended for new designs.The R8C/36C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating	Quad Flat Packages	R5F2136ACNFP#V0	3D model available Symbol and footprint available 3	1 Download Model
	R5F21206KFP#U1 Renesas Electronics	1	The R8C/20 Group is supported only for customers who have already adopted these products.These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/1B Group has on-chip d	Quad Flat Packages	R5F21206KFP#U1	3D model not available Symbol and footprint available 2	1 Download Model
5 6 7 8 9 10 11 12 13

Can't find what you're looking for? Request this part

R5F21 Model Download Search Results

Popular Microcontrollers