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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action |
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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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1-1586842-6
TE Connectivity
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1 | Conn Mate N Lock HDR 16 POS 3mm Solder ST SMD 16 Terminal 1 Port Tape | Other | 1-1586842-6 |
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1586893-3
TE Connectivity
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1 | Configuration Features: Number of Positions 3 | Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Power Positions 3 | Contact Features: Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Type Socket | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Retention Within Housing Without | Electrical Characteristics: | Other | 1586893-3 |
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1586515-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 4 | Number of Rows 1 | Number of Positions 4 | PCB Mount Orientation Vertical | Contact Features: Contact Current Rating (Max) 12 AMP | Contact Layout Inline | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 MICIN | Contact Current Rating (Max) 10 AMP | Contact Type Pin | Contact Mating Area Plating Material Thickness 30 MICM | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Mater | Header, Shrouded - Straight PTH Box | 1586515-2 |
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1586869-1
TE Connectivity
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1 | Configuration Features: Number of Positions 3 | PCB Mount Orientation Vertical | Number of Power Positions 3 | Number of Rows 1 | Contact Features: Contact Type Socket | Contact Layout Inline | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Retention Within Housing Without | Contact Current Rating (Max) 12 AMP | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | PCB Contact Termination Ar | Other | 1586869-1 |
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1586892-3
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 3 | Number of Power Positions 3 | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Thickness 150 – 200 MICIN | PCB Contact Termination Area Plating Material Pre-Tin | Multiple Contact Types Without | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Contact Layout Inline | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Current Rating (Max | Other | 1586892-3 |
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1586512-2
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | PCB Mount Orientation Vertical | Number of Power Positions 2 | Number of Positions 2 | Contact Features: Contact Layout Inline | Contact Retention Within Housing Without | Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Thickness 1.18 MICM | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .03 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Dimensions: PCB Thickness | Other | 1586512-2 |
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1586953-1
TE Connectivity
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1 | Configuration Features: Number of Positions 2 | PCB Mount Orientation Vertical | Number of Rows 1 | Number of Power Positions 2 | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | PCB Contact Termination Area Plating Material Pre-Tin | Contact Type Pin | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 12 AMP | Multiple Contact Types Without | Other | 1586953-1 |
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1586627-1
TE Connectivity
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1 | Configuration Features: Number of Power Positions 4 | Number of Positions 4 | Number of Rows 1 | PCB Mount Orientation Vertical | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 12 AMP | PCB Contact Termination Area Plating Material Tin | Contact Layout Inline | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Type Pin | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Dimensions | Other | 1586627-1 |
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7-1546158-6
TE Connectivity
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1 | Body Features: Barrier Strip Style Tri-Barrier | Primary Product Color Black | Product Orientation Vertical | Configuration Features: Number of Levels 1 | Number of Rows 1 | Number of Positions 20 | Contact Features: Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 25 AMP | Contact Base Material Copper Alloy | Dimensions: Wire Size 22 – 12 AWG | Product Length 7.561 INCH | Wire Size .3 – 3 MMSQ | Electrical Characteristics: Operating V | Other | 7-1546158-6 |
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1586610-1
TE Connectivity
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1 | Body Features: Primary Product Color White | Configuration Features: Number of Positions 4 | Number of Rows 2 | PCB Mount Orientation Right Angle | Contact Features: PCB Contact Termination Area Plating Material Tin-Lead | Mating Pin Diameter 1 MM | Contact Type Pin | Contact Mating Area Length .24 INCH | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact Mating Area Plating Material Thickness 3.81 MICM | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact La | Other | 1586610-1 |
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1586530-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 2 | PCB Mount Orientation Vertical | Number of Rows 1 | Number of Positions 2 | Contact Features: Contact Mating Area Plating Material Thickness 1.18 MICM | Contact Mating Area Plating Material Thickness .03 MICIN | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | Contact Layout Inline | Contact Type Pin | Contact Retention Within Housing Without | Contact Current Rating (Max) 12 AMP | Dimensions: Product Length | Other | 1586530-2 |
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1586892-1
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Power Positions 3 | Number of Rows 1 | Number of Positions 3 | Contact Features: Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Type Pin | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Pre-Tin | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Retention Within Housing With | Other | 1586892-1 |
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1586076-1
TE Connectivity
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1 | Configuration Features: Number of Positions 4 | PCB Mount Orientation Vertical | Number of Power Positions 4 | Number of Rows 1 | Contact Features: Contact Type Pin | PCB Contact Termination Area Plating Material Pre-Tin | Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Mating Area Plating Material Tin | Contact Layout Inline | Contact Retention Within Housing Without | Contact Base Material Phosphor Bronze | Contact Mating Area Plating Mater | Other | 1586076-1 |
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O15.8609-JCO14-3-B-LF
Jauch Quartz
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1 | Oscillator, JCO, 5.0 V | Other | O15.8609-JCO14-3-B-LF |
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1-1586042-4
TE Connectivity
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1 | TE Connectivity VAL-U-LOK Series, 4.2mm Pitch 14 Way 2 Row Right Angle PCB Header, Solder, Through Hole Termination, 9A | Other | 1-1586042-4 |
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2311586-4
TE Connectivity
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1 | 15 Position D-Sub, High Density Receptacle, Female Sockets Connector | Other | 2311586-4 |
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1586040-2
TE Connectivity
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1 | Configuration Features: Number of Positions 2 | Number of Power Positions 2 | PCB Mount Orientation Vertical | Number of Rows 2 | Contact Features: Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 9 AMP | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 80 MICIN | Contact Type Pin | Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Layout Inline | Dimensions: Compatible Insula | Other | 1586040-2 |
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1586042-2
TE Connectivity
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1 | Configuration Features: Number of Positions 2 | Number of Power Positions 2 | Number of Rows 2 | PCB Mount Orientation Right Angle | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 9 AMP | Contact Mating Area Plating Material Thickness 80 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Layout Inline | Contact Type Pin | Dimensions: Compatible Ins | Header, Shrouded - Right Angle PTH Box | 1586042-2 |
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2311586-2
TE Connectivity
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1 | Body Features: Connector Profile Standard | Primary Product Color Blue | Configuration Features: Number of Rows 3 | PCB Mount Orientation Right Angle | Number of Positions 15 | Contact Features: Contact Current Rating (Max) 3 AMP | Contact Shape & Form Round | Dimensions: Row-to-Row Spacing .077 INCH | Row-to-Row Spacing 1.98 MM | Housing Features: Centerline (Pitch) .09 INCH | Centerline (Pitch) 2.29 MM | Housing Material PA 9T GF | Mechanical Attachment: Connector Mounting Type Board Mount | PCB Mount Ret | Other | 2311586-2 |
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1586037-8
TE Connectivity
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1 | Configuration Features: Number of Power Positions 8 | PCB Mount Orientation Vertical | Number of Rows 2 | Number of Positions 8 | Contact Features: Contact Layout Matrix | Contact Current Rating (Max) 9 AMP | Contact Layout Inline | Contact Mating Area Plating Material Thickness 80 – 200 MICIN | Contact Mating Area Plating Material Tin | Contact Type Pin | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.03 – | Header, Shrouded - Straight PTH Box | 1586037-8 |
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1586041-4
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Positions 4 | Number of Power Positions 4 | Contact Features: Contact Retention Within Housing Without | Contact Layout Matrix | Contact Mating Area Plating Material Thickness 80 – 200 MICIN | Contact Mating Area Plating Material Thickness 2.03 – 5.08 MICM | Contact Type Pin | Contact Mating Area Plating Material Tin | Contact Layout Inline | Contact Layout Square Grid | PCB Contact Termination Area Plating Material | Header, Shrouded - Right Angle PTH Box | 1586041-4 |
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1586041-2
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Positions 2 | Number of Power Positions 2 | Contact Features: Contact Mating Area Plating Material Thickness 80 – 200 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Mating Area Plating Material Thickness 2.03 – 5.08 MICM | Contact Layout Inline | Contact Mating Area Plating Material Tin | Contact Retention Within Housing Without | Contact Current Rating (Max) 9 AMP | Dimension | Other | 1586041-2 |
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C1586-ALD
COILCRAFT
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1 | Audio Transformers / Signal Transformers C1586 TI LM5070 13uH 12 V 1.08 A | Other | C1586-ALD |
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HWS15860
Bloggs Bits
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1 | 2x40 Pin Female Header Machined .1"Sp | Header, Receptacle - Straight PTH Box | HWS15860 |
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1-1586037-0
TE Connectivity
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1 | Rectangular Power Connectors, Header, Plug, Wire-to-Board, 10 Position, 4.2 mm [.165 in] Centerline, Printed Circuit Board, UL 94V-2 | Other | 1-1586037-0 |
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