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Image Part Number D.S Description Package Category Prices / Stock Model Action
Image Part Number D.S Description Package Category Prices / Stock Model Action
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18105 Murata Power Solutions
1 General Purpose Inductor, 1000uH, 10%, 1 Element 18105 0 Build or Request
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18105 Molex
1 Barrier Strip Terminal Block, 20A, 3.31mm2, 2 Row(s), 1 Deck(s) 18105 0 Build or Request
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18105 HELUKABEL
1 Wire And Cable, 8 Conductor(s), 19AWG, 500V, Communication Cable 18105 0 Build or Request
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18105 C&D Technologies Inc
1 General Purpose Inductor, 0.001uH, 10%, 1 Element 18105 0 Build or Request
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1810544 Phoenix Contact
1 PCB header, nominal cross section: 2.5 mm?, color: green, nominal current: 12 A, contact surface: Tin, type of contact: Female connector, Number of potentials: 12, Number of rows: 1, Number of positions per row: 12, number of connections: 12, product range: ICV 2,5/..-GF-EX, pitch: 5.08 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.6 mm, Stecksystem: CLASSIC COMBICON (EX), Locking: Screw locking, type of packaging: packed in cardboard Other 1810544 1 Download Model
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1810528 Phoenix Contact
1 PCB header, nominal cross section: 2.5 mm?, color: green, nominal current: 12 A, contact surface: Tin, type of contact: Female connector, Number of potentials: 10, Number of rows: 1, Number of positions per row: 10, number of connections: 10, product range: ICV 2,5/..-GF-EX, pitch: 5.08 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.6 mm, Stecksystem: CLASSIC COMBICON (EX), Locking: Screw locking, type of packaging: packed in cardboard Other 1810528 1 Download Model
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1810515 Phoenix Contact
1 PCB header, nominal cross section: 2.5 mm?, color: green, nominal current: 12 A, contact surface: Tin, type of contact: Female connector, Number of potentials: 9, Number of rows: 1, Number of positions per row: 9, number of connections: 9, product range: ICV 2,5/..-GF-EX, pitch: 5.08 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.6 mm, Stecksystem: CLASSIC COMBICON (EX), Locking: Screw locking, type of packaging: packed in cardboard Other 1810515 1 Download Model
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1810531 Phoenix Contact
1 PCB header, nominal cross section: 2.5 mm?, color: green, nominal current: 12 A, contact surface: Tin, type of contact: Female connector, Number of potentials: 11, Number of rows: 1, Number of positions per row: 11, number of connections: 11, product range: ICV 2,5/..-GF-EX, pitch: 5.08 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.6 mm, Stecksystem: CLASSIC COMBICON (EX), Locking: Screw locking, type of packaging: packed in cardboard Other 1810531 1 Download Model
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1810502 Phoenix Contact
1 PCB header, nominal cross section: 2.5 mm?, color: green, nominal current: 12 A, contact surface: Tin, type of contact: Female connector, Number of potentials: 8, Number of rows: 1, Number of positions per row: 8, number of connections: 8, product range: ICV 2,5/..-GF-EX, pitch: 5.08 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.6 mm, Stecksystem: CLASSIC COMBICON (EX), Locking: Screw locking, type of packaging: packed in cardboard Other 1810502 1 Download Model
Part Image Part Image 1 Crystal, 5.00mm x3.20mm,25MHz,18pF,-40-125C Other C5S-25.000-18-1050-X1-R 1 Download Model
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72T18105L4-4BB Renesas Electronics
1 The 72T18105 is a 128K x 18 / 256K x 9 TeraSync 2.5V FIFO memory with clocked read and write controls and a flexible Bus-Matching x18/x9 data flow. Bus-Matching TeraSync FIFOs are particularly appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match busses of unequal sizes. There are two possible timing modes of operation with these devices: IDT Standard mode and First Word Fall Through mode. BGA 72T18105L4-4BB 1 Download Model
Part Image Part Image 1 2.00mm Pitch, Milli-Grid PCB Header, Dual Row, Vertical, Surface Mount, 2.00µm Tin (Sn) Plating, with Peg, without Pick and Place Cap, 6 Circuits, Glow-Wire Capable, Tube Other 1511181056 1 Download Model
Part Image Part Image 1 Low Jitter Differential XO for Standard Frequencies Other SIT9375AI-02P8-1810-50.000000 1 Download Model
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H2181-05 Harwin
1 Hardware: Plug Straight THT Ø1.75mm Terminal Pin 5.35mm high Gold Other H2181-05 1 Download Model
Part Image Part Image 1 Conn Terminal Block 5 POS 2.5mm Solder RA Thru-Hole 4A Box Other 218-105 1 Download Model
Part Image Part Image 1 THR male header, 2-row; 0.8 x 0.8 mm solder pin; straight; 100% protected against mismating; Pin spacing 3.5 mm; 36-pole Other 713-1418/105-000 1 Download Model
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ADM1810-5AKSZ-RL7 Analog Devices
1 Analog Devices ADM1810-5AKSZ-RL7, Processor Supervisor 2.5 → 5 V, 3-Pin SC-70 SOT23 (3-Pin) ADM1810-5AKSZ-RL7 1 Download Model
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72T18105L5BB Renesas Electronics
1 The 72T18105 is a 128K x 18 / 256K x 9 TeraSync 2.5V FIFO memory with clocked read and write controls and a flexible Bus-Matching x18/x9 data flow. Bus-Matching TeraSync FIFOs are particularly appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match busses of unequal sizes. There are two possible timing modes of operation with these devices: IDT Standard mode and First Word Fall Through mode. BGA 72T18105L5BB 1 Download Model
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72T18105L5BBGI Renesas Electronics
1 The 72T18105 is a 128K x 18 / 256K x 9 TeraSync 2.5V FIFO memory with clocked read and write controls and a flexible Bus-Matching x18/x9 data flow. Bus-Matching TeraSync FIFOs are particularly appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match busses of unequal sizes. There are two possible timing modes of operation with these devices: IDT Standard mode and First Word Fall Through mode. BGA 72T18105L5BBGI 1 Download Model
Part Image Part Image 1 Ultra-low Jitter Differential XO for Standard Networking Frequencies Other SIT9501AE-02A2-1810-50.000000 1 Download Model
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72T18105L6-7BB Renesas Electronics
1 The 72T18105 is a 128K x 18 / 256K x 9 TeraSync 2.5V FIFO memory with clocked read and write controls and a flexible Bus-Matching x18/x9 data flow. Bus-Matching TeraSync FIFOs are particularly appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match busses of unequal sizes. There are two possible timing modes of operation with these devices: IDT Standard mode and First Word Fall Through mode. BGA 72T18105L6-7BB 1 Download Model
Part Image Part Image 1 Fiber Optic Connectors COMMERCIAL Other 181-057-126 1 Download Model
Part Image Part Image 1 Conn Terminal Block 5 POS 2.5mm Solder RA Thru-Hole 4A Box Other 218-105/000-012 1 Download Model
Part Image Part Image 1 Conn Terminal Block 5 POS 2.5mm Solder RA Thru-Hole 4A Box Other 218-105/000-604/997-405 1 Download Model
Part Image Part Image 1 THR male header, 2-row; 0.8 x 0.8 mm solder pin; straight; 100% protected against mismating; in tape-and-reel packaging; Pin spacing 3.5 mm; 36-pole Other 713-1418/105-000/997-409 1 Download Model
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