18115 Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	18115 HELUKABEL	1	Wire And Cable, 37 Conductor(s), 24AWG, 500V, Communication Cable		18115	3D model not available Symbol and footprint not available 0	0 Build or Request
	18115 Molex	1	Barrier Strip Terminal Block, 20A, 3.31mm2, 2 Row(s), 1 Deck(s)		18115	3D model not available Symbol and footprint not available 0	0 Build or Request
	1811540000 Weidmüller	1	PCB terminal, 320 V, 24 A, Pitch in mm: 5.00, 2.5 mm², Number of poles: 5, Tension clamp connection with actuator, THT solder connection, 135°, Box	Other	1811540000	3D model available Symbol and footprint available 3	1 Download Model
	1811570000 Weidmüller	1	PCB terminal, 320 V, 24 A, Pitch in mm: 5.00, 2.5 mm², Number of poles: 8, Tension clamp connection with actuator, THT solder connection, 135°, Box	Other	1811570000	3D model available Symbol and footprint available 3	1 Download Model

	1811550000 Weidmüller	1	PCB terminal, 320 V, 24 A, Pitch in mm: 5.00, 2.5 mm², Number of poles: 6, Tension clamp connection with actuator, THT solder connection, 135°, Box	Other	1811550000	3D model available Symbol and footprint available 3	1 Download Model
	1811510000 Weidmüller	1	PCB terminal, 320 V, 24 A, Pitch in mm: 5.00, 2.5 mm², Number of poles: 2, Tension clamp connection with actuator, THT solder connection, 135°, Box	Other	1811510000	3D model available Symbol and footprint available 3	1 Download Model
	1811530000 Weidmüller	1	PCB terminal, 320 V, 24 A, Pitch in mm: 5.00, 2.5 mm², Number of poles: 4, Tension clamp connection with actuator, THT solder connection, 135°, Box	Other	1811530000	3D model available Symbol and footprint available 3	1 Download Model
	1811572 Phoenix Contact	1	MK3DSN 1,5/ 4-5,08 - Printed circuit board terminal, nominal current: 10 A, rated voltage (III/2): 400 V, nominal cross section: 1.5 mm², number of rows: 3, number of positions per row: 4, product range: MK3DSN 1,5, pitch: 5.08 mm, connection method: Screw connection with tension sleeve, screw head form: L Slotted, mounting: Wave soldering, conductor/PCB connection direction: 0 °, color: green, Pin layout: Linear pinning, Solder pin [P]: 3.5 mm, number of solder pins per potential: 1, type of pac	Other	1811572	3D model available Symbol and footprint available 3	1 Download Model
	1811590000 Weidmüller	1	PCB terminal, 320 V, 24 A, Pitch in mm: 5.00, 2.5 mm², Number of poles: 10, Tension clamp connection with actuator, THT solder connection, 135°, Box	Other	1811590000	3D model available Symbol and footprint available 3	1 Download Model
	1811580000 Weidmüller	1	PCB terminal, 320 V, 24 A, Pitch in mm: 5.00, 2.5 mm², Number of poles: 9, Tension clamp connection with actuator, THT solder connection, 135°, Box	Other	1811580000	3D model available Symbol and footprint available 3	1 Download Model
	1811520000 Weidmüller	1	PCB terminal, 320 V, 24 A, Pitch in mm: 5.00, 2.5 mm², Number of poles: 3, Tension clamp connection with actuator, THT solder connection, 135°, Box	Other	1811520000	3D model available Symbol and footprint available 3	1 Download Model
	1811560000 Weidmüller	1	PCB terminal, 320 V, 24 A, Pitch in mm: 5.00, 2.5 mm², Number of poles: 7, Tension clamp connection with actuator, THT solder connection, 135°, Box	Other	1811560000	3D model available Symbol and footprint available 3	1 Download Model
	BZX84J-B18,115 Nexperia	1	Zener Diodes Diode Zener Single 18V 2% 550mW 2-Pin	Small Outline Diode Flat Lead	BZX84J-B18,115	3D model available Symbol and footprint available 3	1 Download Model
	72T18115L4-4BB Renesas Electronics	1	The 72T18115 is a 256K x 18 / 512K x 9 TeraSync 2.5V FIFO memory with clocked read and write controls and a flexible Bus-Matching x18/x9 data flow. Bus-Matching TeraSync FIFOs are particularly appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match busses of unequal sizes. There are two possible timing modes of operation with these devices: IDT Standard mode and First Word Fall Through mode.	BGA	72T18115L4-4BB	3D model available Symbol and footprint available 3	1 Download Model
	72T18115L6-7BB Renesas Electronics	1	The 72T18115 is a 256K x 18 / 512K x 9 TeraSync 2.5V FIFO memory with clocked read and write controls and a flexible Bus-Matching x18/x9 data flow. Bus-Matching TeraSync FIFOs are particularly appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match busses of unequal sizes. There are two possible timing modes of operation with these devices: IDT Standard mode and First Word Fall Through mode.	BGA	72T18115L6-7BB	3D model available Symbol and footprint available 3	1 Download Model

	BZV55-C18,115 Nexperia	1	Zener Diode 18 V 500 mW ±5% Surface Mount LLDS; MiniMelf	Other	BZV55-C18,115	3D model not available Symbol and footprint available 2	1 Download Model
	10-18-1150 Molex	1	Pin & Socket Connectors 093 Shrd Pin Skt Hdrs 15Ckt	Other	10-18-1150	3D model available Symbol and footprint available 3	1 Download Model
	PIC16F18115-E/SN Microchip	1	8-bit Microcontrollers - MCU 14KB Flash, 512B RAM, 128B EEPROM, 12b Diff. ADCC, 2x16-bit dual PWM	Small Outline Packages	PIC16F18115-E/SN	3D model available Symbol and footprint available 3	1 Download Model
	218-115/000-012 Wago	1	PCB terminal block; Locking slides; 0.5 mm²; Pin spacing 2.5 mm; 15-pole; CAGE CLAMP®; 0,50 mm²; gray	Other	218-115/000-012	3D model available Symbol and footprint available Manufacturer Approved Model 3	1 Download Model
	218-115 Wago	1	PCB terminal block; Locking slides; 0.5 mm²; Pin spacing 2.5 mm; 15-pole; CAGE CLAMP®; 0,50 mm²; gray	Other	218-115	3D model available Symbol and footprint available Manufacturer Approved Model 3	1 Download Model
	PIC16F18115-I/P Microchip	1	8-bit Microcontrollers - MCU 14KB Flash, 512B RAM, 128B EEPROM, 12b Diff. ADCC, 2x16-bit dual PWM	Dual-In-Line Packages	PIC16F18115-I/P	3D model available Symbol and footprint available 3	1 Download Model
	BZT52H-B18,115 Nexperia	1	Zener Diodes BZT52H-B18/SOD123F/SOD2	Small Outline Diode Flat Lead	BZT52H-B18,115	3D model available Symbol and footprint available 3	1 Download Model
	PUMH18,115 Nexperia	1	Pre-Biased Bipolar Transistor (BJT) 2 NPN - Pre-Biased (Dual) 50V 100mA 300mW Surface Mount 6-TSSOP	SOT23 (6-Pin)	PUMH18,115	3D model available Symbol and footprint available 3	1 Download Model
	ADM1811-5ARTZ-RL7 Analog Devices	1	Processor Supervisor 4.62V 1 Active Low/Open Drain Automotive 3-Pin SOT-23 T/R	SOT23 (3-Pin)	ADM1811-5ARTZ-RL7	3D model available Symbol and footprint available 3	1 Download Model
	72T18115L5BBI Renesas Electronics	1	The 72T18115 is a 256K x 18 / 512K x 9 TeraSync 2.5V FIFO memory with clocked read and write controls and a flexible Bus-Matching x18/x9 data flow. Bus-Matching TeraSync FIFOs are particularly appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match busses of unequal sizes. There are two possible timing modes of operation with these devices: IDT Standard mode and First Word Fall Through mode.	BGA	72T18115L5BBI	3D model available Symbol and footprint available 3	1 Download Model
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