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2-1445093-2
TE Connectivity
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1 | Configuration Features: Number of Positions 2 | Number of Rows 1 | PCB Mount Orientation Vertical | Number of Power Positions 2 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Multiple Contact Types Without | PCB Contact Termination Area Pla | Other | Check Price & Stock |
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2-1445057-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 2 | PCB Mount Orientation Right Angle | Number of Positions 2 | Number of Rows 1 | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 100 MICIN | Contact Layout Inline | Contact Mating Area Plating Material Tin | Multiple Contact Types Without | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area | Other | Check Price & Stock |
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2-1445056-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 2 | PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Positions 2 | Contact Features: Contact Layout Inline | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness 2.54 MICM | Mul | Other | Check Price & Stock |
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2-1445052-2
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 2 | Number of Rows 1 | Number of Power Positions 2 | Contact Features: Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contac | Other | Check Price & Stock |
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2-1445053-2
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 1 | Number of Power Positions 2 | Number of Positions 2 | Contact Features: Multiple Contact Types Without | Contact Layout Inline | Contact Retention Within Housing Without | Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Contact Mating Area Plating M | Other | Check Price & Stock |
3
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2-1445094-2
TE Connectivity
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1 | Configuration Features: Number of Positions 2 | Number of Power Positions 2 | PCB Mount Orientation Vertical | Number of Rows 1 | Contact Features: Multiple Contact Types Without | Contact Type Pin | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | Contac | Other | Check Price & Stock |
3
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2-1445051-2
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 1 | Number of Power Positions 2 | Number of Positions 2 | Contact Features: Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 100 MICIN | Other | Check Price & Stock |
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2-1445084-2
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Power Positions 2 | PCB Mount Orientation Vertical | Number of Positions 2 | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Without | Contact Mating Area Plating Material Gold | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material T | Other | Check Price & Stock |
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2-1445085-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 2 | Number of Rows 1 | Number of Positions 2 | PCB Mount Orientation Vertical | Contact Features: Contact Retention Within Housing Without | Contact Type Pin | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness .38 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB | Other | Check Price & Stock |
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2-1445051-2
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 1 | Number of Power Positions 2 | Number of Positions 2 | Contact Features: Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 100 MICIN | Other | Check Price & Stock |
3
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Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
2-1445085-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 2 | Number of Rows 1 | Number of Positions 2 | PCB Mount Orientation Vertical | Contact Features: Contact Retention Within Housing Without | Contact Type Pin | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness .38 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB | Other | Check Price & Stock |
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2-1445091-2
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Power Positions 2 | PCB Mount Orientation Right Angle | Number of Positions 2 | Contact Features: Contact Retention Within Housing Without | Contact Type Pin | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .38 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 2.5 | Other | Check Price & Stock |
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2-1445091-2
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Power Positions 2 | PCB Mount Orientation Right Angle | Number of Positions 2 | Contact Features: Contact Retention Within Housing Without | Contact Type Pin | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .38 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 2.5 | Other | Check Price & Stock |
3
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Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
2-1445097-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 2 | Number of Positions 2 | Number of Rows 1 | PCB Mount Orientation Right Angle | Contact Features: Contact Layout Inline | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Type Pin | Multiple Contact Types Without | PCB Contact Termination Ar | Other | Check Price & Stock |
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Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
2-1445052-2
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 2 | Number of Rows 1 | Number of Power Positions 2 | Contact Features: Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contac | Other | Check Price & Stock |
3
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Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
2-1445094-2
TE Connectivity
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1 | Configuration Features: Number of Positions 2 | Number of Power Positions 2 | PCB Mount Orientation Vertical | Number of Rows 1 | Contact Features: Multiple Contact Types Without | Contact Type Pin | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | Contac | Other | Check Price & Stock |
3
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Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
2-1445098-2
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Power Positions 2 | Number of Positions 2 | Contact Features: Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Retenti | Other | Check Price & Stock |
3
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Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
2-1445093-2
TE Connectivity
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1 | Configuration Features: Number of Positions 2 | Number of Rows 1 | PCB Mount Orientation Vertical | Number of Power Positions 2 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Multiple Contact Types Without | PCB Contact Termination Area Pla | Other | Check Price & Stock |
3
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Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
2-1445098-2
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Power Positions 2 | Number of Positions 2 | Contact Features: Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Retenti | Other | Check Price & Stock |
3
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Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
2-1445084-2
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Power Positions 2 | PCB Mount Orientation Vertical | Number of Positions 2 | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Without | Contact Mating Area Plating Material Gold | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material T | Other | Check Price & Stock |
3
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Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
2-1445055-2
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Power Positions 2 | Number of Positions 2 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 2.54 MICM | C | Other | Check Price & Stock |
3
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Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
2-1445056-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 2 | PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Positions 2 | Contact Features: Contact Layout Inline | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness 2.54 MICM | Mul | Other | Check Price & Stock |
3
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Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
2-1445053-2
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 1 | Number of Power Positions 2 | Number of Positions 2 | Contact Features: Multiple Contact Types Without | Contact Layout Inline | Contact Retention Within Housing Without | Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Contact Mating Area Plating M | Other | Check Price & Stock |
3
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Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
2-1445088-2
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Power Positions 2 | Number of Positions 2 | PCB Mount Orientation Right Angle | Contact Features: Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Type Pin | Multiple Contact Types Without | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plati | Other | Check Price & Stock |
3
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Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
2-1445050-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 2 | PCB Mount Orientation Vertical | Number of Rows 1 | Number of Positions 2 | Contact Features: Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Type Pin | Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Are | Other | Check Price & Stock |
3
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Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||