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2-1445057-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 2 | PCB Mount Orientation Right Angle | Number of Positions 2 | Number of Rows 1 | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 100 MICIN | Contact Layout Inline | Contact Mating Area Plating Material Tin | Multiple Contact Types Without | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area | Other | Check Price & Stock |
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2-1445055-2
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Power Positions 2 | Number of Positions 2 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 2.54 MICM | C | Other | Check Price & Stock |
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2-1445088-2
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Power Positions 2 | Number of Positions 2 | PCB Mount Orientation Right Angle | Contact Features: Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Type Pin | Multiple Contact Types Without | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plati | Other | Check Price & Stock |
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2-1445050-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 2 | PCB Mount Orientation Vertical | Number of Rows 1 | Number of Positions 2 | Contact Features: Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Type Pin | Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Are | Other | Check Price & Stock |
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2-1445054-2
TE Connectivity
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1 | Configuration Features: Number of Positions 2 | Number of Power Positions 2 | Number of Rows 1 | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Tin | Contact Type Pin | PCB Contac | Other | Check Price & Stock |
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2-1445054-2
TE Connectivity
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1 | Configuration Features: Number of Positions 2 | Number of Power Positions 2 | Number of Rows 1 | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Tin | Contact Type Pin | PCB Contac | Other | Check Price & Stock |
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2-1445097-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 2 | Number of Positions 2 | Number of Rows 1 | PCB Mount Orientation Right Angle | Contact Features: Contact Layout Inline | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Type Pin | Multiple Contact Types Without | PCB Contact Termination Ar | Other | Check Price & Stock |
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2-1445057-7
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Positions 7 | Number of Power Positions 7 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Retention Within Housing Without | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material | Other | Check Price & Stock |
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2-1445054-4
TE Connectivity
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1 | Configuration Features: Number of Power Positions 4 | Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Positions 4 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Contact Layout Inline | Other | Check Price & Stock |
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2-1445086-3
TE Connectivity
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1 | Micro MATE-N-LOK, Rectangular Power Connectors, Header, Plug, Wire-to-Board, 3 Position, 3mm [.118in] Centerline, Printed Circuit Board, UL 94V-0 | Other | Check Price & Stock |
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2-1445050-7
TE Connectivity
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1 | MICRO MNL HDR ASSY S/ROW LF | Other | Check Price & Stock |
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2-1445055-6
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Power Positions 6 | Number of Positions 6 | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact M | Other | Check Price & Stock |
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2-1445093-5
TE Connectivity
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1 | Configuration Features: Number of Positions 5 | Number of Rows 1 | Number of Power Positions 5 | PCB Mount Orientation Vertical | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Type Pin | Contact Mating Area Plating Material Thickness 30 MICIN | Cont | Other | Check Price & Stock |
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2-1445054-4
TE Connectivity
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1 | Configuration Features: Number of Power Positions 4 | Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Positions 4 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Contact Layout Inline | Other | Check Price & Stock |
3
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2-1445057-5
TE Connectivity
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1 | Configuration Features: Number of Power Positions 5 | PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Positions 5 | Contact Features: Contact Mating Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Are | Other | Check Price & Stock |
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2-1445050-9
TE Connectivity
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1 | Configuration Features: Number of Power Positions 9 | PCB Mount Orientation Vertical | Number of Rows 1 | Number of Positions 9 | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 100 – 3 | Other | Check Price & Stock |
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2-1445050-8
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Power Positions 8 | PCB Mount Orientation Vertical | Number of Positions 8 | Contact Features: PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Layout Inline | Contact Mating Area Plating Material Th | Other | Check Price & Stock |
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2-1445100-5
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Signal Positions 0 | PCB Mount Orientation Right Angle | Number of Power Positions 5 | Number of Positions 5 | Contact Features: PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Type Pin | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Contact Retention Within Housi | Other | Check Price & Stock |
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2-1445055-5
TE Connectivity
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1 | Configuration Features: Number of Positions 5 | PCB Mount Orientation Right Angle | Number of Power Positions 5 | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 100 MICIN | Contact Type Pin | Contact Retention W | Other | Check Price & Stock |
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2-1445093-6
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | PCB Mount Orientation Vertical | Number of Positions 6 | Number of Power Positions 6 | Contact Features: Contact Mating Area Plating Material Gold | Contact Layout Inline | Contact Mating Area Plating Material Thickness 30 MICIN | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Conta | Other | Check Price & Stock |
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2-1445057-4
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Power Positions 4 | Number of Positions 4 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Layout Inline | Multiple Contact Types Without | Contact Mating Area Plating Material Tin | Contact Type Pin | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Ar | Other | Check Price & Stock |
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2-1445054-6
TE Connectivity
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1 | Configuration Features: Number of Positions 6 | Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Power Positions 6 | Contact Features: Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Mating Area Plating Material Thickness 2.54 MICM | | Other | Check Price & Stock |
3
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Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
2-1445054-8
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 8 | Number of Power Positions 8 | Number of Rows 1 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Type Pin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Contact Layout Inline | Contact Mating Area Plating Material Thickne | Other | Check Price & Stock |
3
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Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
2-1445094-4
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Power Positions 4 | PCB Mount Orientation Vertical | Number of Positions 4 | Contact Features: Contact Mating Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 2.54 MICM | Contac | Other | Check Price & Stock |
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Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
2-1445087-6
TE Connectivity
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1 | Configuration Features: Number of Power Positions 6 | Number of Rows 1 | Number of Positions 6 | PCB Mount Orientation Vertical | Contact Features: Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .38 MICM | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Mater | Other | Check Price & Stock |
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Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||