2-167 Model Download Search Results
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2-1670615-1
TE Connectivity
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1 | Vertical, Wire-to-Board, 36 Position, 4 Rows, 4mm [.157in] Centerline, Tin (Sn), Printed Circuit Board, Power & Signal, AMP MCP Connector System | Other | 2-1670615-1 |
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2-1676913-7
TE Connectivity
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1 | YR1 0.1% 1M0 | Resistors, Axial Diameter Horizontal Mounting | 2-1676913-7 |
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2-1670615-2
TE Connectivity
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1 | Vertical, Wire-to-Board, 25 Position, 3 Rows, 4mm / 5mm [.157in / .197in] Centerline, Tin (Sn), Printed Circuit Board, AMP MCP Connector System | Other | 2-1670615-2 |
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216700-0409
Molex
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1 | Mezzanine Connector, Receptacle, 0.35 mm, 2 Rows, 40 Contacts, Surface Mount Straight | Other | 216700-0409 |
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232-167/047-000
Wago
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1 | THT female header; straight; Pin spacing 5.08 mm; 7-pole; Spacer flange; 0.6 x 1.0 mm solder pin | Other | 232-167/047-000 |
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232-167/039-000
Wago
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1 | THT female header; straight; Pin spacing 5.08 mm; 7-pole; Locking lever; 0.6 x 1.0 mm solder pin | Other | 232-167/039-000 |
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52852-1670
Molex
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1 | Molex 52852 Series 1mm Pitch 16 Way 1 Row Right Angle FPC Connector, Tin Bismuth over Nickel Plated Contacts | Other | 52852-1670 |
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SSM2167-1RM-R2
Analog Devices
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1 | SSM2167 variable compression mic SMT amp | Small Outline Packages | SSM2167-1RM-R2 |
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CY62167ELL-45ZXI
Infineon
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1 | SRAM 16Mb (2Mx8 or 1Mx16) Low Power SRAM, TSSOP-48, .5mm pitch, 20 bit address. | Small Outline Packages | CY62167ELL-45ZXI |
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SSM2167-1RMZ
Analog Devices
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1 | ANALOG DEVICES - SSM2167-1RMZ - Low Voltage Microphone Preampiflier with Variable Compression, 2.5V to 5.5V, MSOP, 10 | Small Outline Packages | SSM2167-1RMZ |
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R5F72167ADFA#V0
Renesas Electronics
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1 | RISC Microcontroller, 32-Bit, FLASH, SH-2A CPU, 200MHz, CMOS, PQFP176 | Quad Flat Packages | R5F72167ADFA#V0 |
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CY62167GN-45ZXI
Infineon
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1 | SRAM MICROPOWER SRAMS | Small Outline Packages | CY62167GN-45ZXI |
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216700-0209
Molex
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1 | FFC & FPC Connectors 0.35 B/B Rec Assy 20Ckt EmbsTp PKG GEN 20 Position | Other | 216700-0209 |
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CY62167ELL-45ZXIT
Infineon
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1 | SRAM 16Mb 1M x16 Low Power SRAM | Small Outline Packages | CY62167ELL-45ZXIT |
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CY62167DV30LL-70BVI
Infineon
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1 | Cypress Semiconductor CY62167DV30LL-70BVI SRAM Memory, 16Mbit, 2.2 → 3.6 V, 70ns 48-Pin FBGA | BGA | CY62167DV30LL-70BVI |
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CY62167GE30-45BV1XI
Infineon
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1 | SRAM Micropower SRAMs | BGA | CY62167GE30-45BV1XI |
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216701-0549
Molex
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1 | SlimStack Board-to-Board Plug, 0.35mm Pitch, ACB6+ Series, 0.60mm Mated Height, 1.90mm Mated Width, 54 Circuits | Other | 216701-0549 |
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CY62167GE30-45ZXI
Infineon
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1 | 16-Mbit low-power CMOS SRAM with embedded ECC, configurable as 1M×16 or 2M×8. It supports 45 ns access time, 2.2–3.6 V operation, 1.5 µA standby current (typ), and ECC for single-bit error correction with an ERR output (GE30 only). Packaged in 48-pin TSOP I or 48-ball VFBGA, with TTL-compatible I/Os, byte control (BLE/BHE), and byte power-down mode for low power standby. | Small Outline Packages | CY62167GE30-45ZXI |
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CY62167EV30LL-45BVXI
Infineon
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1 | Cypress Semiconductor SRAM, CY62167EV30LL-45BVXI- 16Mbit | BGA | CY62167EV30LL-45BVXI |
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R5F72167GDFP#V1
Renesas Electronics
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1 | The SH7216 Series with 32-bit SH-2A CPU core offers a maximum operating frequency of 200 MHz, representing a 1.25-fold improvement in performance over the 160 MHz of Renesas Electronics's existing the SH7211. They also include large-capacity high-speed flash memory and RAM through the use of cutting-edge flash memory technology. Featuring an on-chip power supply step-down circuit, these microcontrollers are designed to achieve lower current dissipation by suppressing the increase in current dissipation asso | Quad Flat Packages | R5F72167GDFP#V1 |
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R5F72167ADBG#U1
Renesas Electronics
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1 | The SH7216 Series with 32-bit SH-2A CPU core offers a maximum operating frequency of 200 MHz, representing a 1.25-fold improvement in performance over the 160 MHz of Renesas Electronics's existing the SH7211. They also include large-capacity high-speed flash memory and RAM through the use of cutting-edge flash memory technology. Featuring an on-chip power supply step-down circuit, these microcontrollers are designed to achieve lower current dissipation by suppressing the increase in current dissipation asso | BGA | R5F72167ADBG#U1 |
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2167010409
Molex
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1 | SlimStack Board-to-Board Plug, 0.35mm Pitch, ACB6+ Series, 0.60mm Mated Height, 1.90mm Mated Width, 40 Circuits | Other | 2167010409 |
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GRM2167U1H103JA01D
Murata Electronics
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1 | Chip Capacitor value 103 | Capacitor Chip Non-polarised | GRM2167U1H103JA01D |
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09652216701
HARTING
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1 | D-Sub 15pin male straight, stamped, w/o board locks, M3, PL2 | Other | 09652216701 |
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GRM2167U1H123JA01J
Murata Electronics
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1 | Chip Capacitor value 123 | Capacitor Chip Non-polarised | GRM2167U1H123JA01J |
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