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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action |
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2-1705300-8
TE Connectivity
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1 | Body Features: Primary Product Color Black | Ejector Type Push-Pull | Configuration Features: Card Insertion Style Normal Insertion | Number of Positions 6 | Card Detection Switch Without | Number of Loaded Positions 6 | Contact Features: Contact Base Material Copper Alloy | Contact Mating Retention Without | Contact Current Rating (Max) .5 AMP | Dimensions: Profile Height from PCB .106 INCH | Profile Height from PCB 2.7 MM | Electrical Characteristics: Current Rating (Max) .5 AMP | Voltage Rating 30 VAC | | Other | 2-1705300-8 |
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STPS2170AFN
STMicroelectronics
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1 | 170 V, 2 A Power Schottky rectifier | Small Outline Diode Flat Lead | STPS2170AFN |
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STPS2170AF
STMicroelectronics
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1 | 170 V, 2 A power Schottky rectifier | Small Outline Diode Flat Lead | STPS2170AF |
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217063-0025
Molex
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1 | Connector Shrouded Header 2 Position 2mm Solder Straight Surface Mount Emboss T/R | Other | 217063-0025 |
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2170806-1
TE Connectivity
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1 | QSFP28/56, Cage Assembly, Signal, Operating Temperature Range -40 – 85 °C [-40 – 185 °F], Data Rate (Max) 28 Gb/s, 2 Ports | Other | 2170806-1 |
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2170806-4
TE Connectivity
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1 | QSFP28/56, Cage Assembly, Signal, Operating Temperature Range -40 – 85 °C [-40 – 185 °F], Data Rate (Max) 28 Gb/s, 2 Ports | Other | 2170806-4 |
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2170409-5
TE Connectivity
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1 | Configuration Features: Port Matrix Configuration 2 x 1 | Number of Ports 2 | Number of Positions 40 | Contact Features: Tail Plating Material Tin | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Centerline (Pitch) .032 INCH | Cent | Other | 2170409-5 |
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2170806-5
TE Connectivity
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1 | Body Features: Heat Sink Style Pin | Heat Sink Height Class SAN | Heat Sink Height .256 INCH | Heat Sink Finish Anodized Black | Configuration Features: Number of Rear EONs per Port Column 0 | Number of Ports 2 | Port Matrix Configuration 1 x 2 | Contact Features: PCB Contact Termination Area Plating Material Tin | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thickness (Recommended) .062 INCH | Electrical Characteristics: Data Rate (Max) 28 GBS | Housing Features: Cage Material Nickel Silver | Indu | Other | 2170806-5 |
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2170286-1
TE Connectivity
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1 | Configuration Features: Number of Positions 160 | Number of Ports 8 | Port Matrix Configuration 2 x 4 | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 4 GBS | Housing Features: Centerline (Pitch) .8 MM | Cage Material Nickel Silver | Centerline | Other | 2170286-1 |
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5442170
Phoenix Contact
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1 | BC-500X10- 2 GN - Printed circuit board terminal, nominal current: 13.5 A, rated voltage (III/2): 400 V, nominal cross section: 1.5 mm2, number of potentials: 2, number of rows: 1, number of positions per row: 2, product range: BC-X10, pitch: 5 mm, connection method: Screw connection with tension sleeve, screw head form: H1L Slotted Phillips recess, mounting: Wave soldering, conductor/PCB connection direction: 0 °, color: pastel green, Pin layout: Linear pinning, Solder pin [P]: 3.5 mm, number of | Other | 5442170 |
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2-2170705-1
TE Connectivity
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1 | Body Features: Heat Sink Height .165 INCH | Heat Sink Style Pin | Heat Sink Height Class PCI | Heat Sink Finish Anodized Black | Configuration Features: Number of Rear EONs per Port Column 2 | Number of Ports 1 | Port Matrix Configuration 1 x 1 | Contact Features: PCB Contact Termination Area Plating Material Tin | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thickness (Recommended) .062 INCH | Electrical Characteristics: Data Rate (Max) 28 GBS | Housing Features: Cage Material Nickel Silver | Indu | Other | 2-2170705-1 |
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2170668-1
TE Connectivity
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1 | Body Features: Modular Jack Latch Orientation Inverted - Latch Up | Shield Material Copper Alloy | Connector Profile Standard | Configuration Features: Number of Panel Ground Tabs 2 | Port Matrix Configuration 1 x 1 | Panel Ground Location Top | Number of Positions 8 | Number of Loaded Positions 8 | PCB Mount Orientation Right Angle | Status Light Type Not Illuminated | Port Configuration Single Port | Number of PCB Ground Tabs 2 | Connector Contact Density Standard | Contact Features: PCB Contact Terminati | Other | 2170668-1 |
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2170640021
Molex
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1 | Micro-One Wire-to-Board Header, Right-Angle, 2.00mm Pitch, Single Row, Glow-Wire Capable, Surface Mount, 2 Circuits, Tin-Bismuth Plating, Black | Other | 2170640021 |
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2170630027
Molex
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1 | Micro-One Wire-to-Board Header, Vertical, 2.00mm Pitch, Single Row, Glow-Wire Capable, Surface Mount, 2 Circuits, Tin-Bismuth Plating, Black, with Potting Capability, with Cover Tape | Other | 2170630027 |
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2-2170705-2
TE Connectivity
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1 | Body Features: Heat Sink Finish Anodized Black | Heat Sink Style Pin | Heat Sink Height .256 INCH | Heat Sink Height Class SAN | Configuration Features: Port Matrix Configuration 1 x 1 | Number of Ports 1 | Number of Rear EONs per Port Column 2 | Contact Features: PCB Contact Termination Area Plating Material Tin | Dimensions: PCB Thickness (Recommended) .062 INCH | PCB Thickness (Recommended) 1.57 MM | Electrical Characteristics: Data Rate (Max) 28 GBS | Housing Features: Cage Material Nickel Silver | Indu | Other | 2-2170705-2 |
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2170129-1
TE Connectivity
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1 | Body Features: Modular Jack Latch Orientation Standard - Latch Down | Configuration Features: EMI Finger Location Sides | EMI Finger Location Bottom | Number of Loaded Positions 8 | Status Light Type Lightpipe | Port Configuration Multiple Ports | Multiple Port Configuration Ganged | Number of Positions 8 | Port Matrix Configuration 1 x 2 | PCB Mount Orientation Right Angle | Connector Contact Density High | Contact Features: Contact Current Rating (Max) 1 AMP | Contact Current Rating (Max) .02 AMP | Housin | Other | 2170129-1 |
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232-170/047-000
Wago
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1 | THT female header; straight; Pin spacing 5.08 mm; 10-pole; Spacer flange; 0.6 x 1.0 mm solder pin | Other | 232-170/047-000 |
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232-170
Wago
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1 | THT female header; straight; Pin spacing 5.08 mm; 10-pole; 0.6 x 1.0 mm solder pin | Other | 232-170 |
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250-217/000-012
Wago
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1 | PCB terminal block; push-button; 1.5 mm²; Pin spacing 3.5 mm; 17-pole; Push-in CAGE CLAMP® | Other | 250-217/000-012 |
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32.21.7.024.2300
FINDER
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1 | General Purpose Relay, 32 Series, Power, SPST-NO, 24 VDC, 6 A RoHS Compliant: Yes | Other | 32.21.7.024.2300 |
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32.21.7.005.2300
FINDER
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1 | MINI RELAY SPST-NO 6A 5V DC | Other | 32.21.7.005.2300 |
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GW CSSRM3.PM-N6N8-A232-1-700-R18
ams OSRAM
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1 | High Power LEDs - White OSLON Square 70 CRI 5700K 330 - 360 lm | Other | GW CSSRM3.PM-N6N8-A232-1-700-R18 |
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2170231-2
TE Connectivity
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1 | Standard Card Edge Connectors Hybrid Card Edge Power Connect | Other | 2170231-2 |
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232-170/039-000
Wago
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1 | THT female header; straight; Pin spacing 5.08 mm; 10-pole; Locking lever; 0.6 x 1.0 mm solder pin | Other | 232-170/039-000 |
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TPS62170DSGT
Texas Instruments
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1 | 3–17V 0.5A Step-Down Converter with DCS-Control in 2x2 QFN package | Small Outline No-lead | TPS62170DSGT |
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