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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	W25M512JVFIQ/TUBE Winbond	1	Winbond W25M512JVFIQ/TUBE, SPI 512Mbit Flash Memory Chip, 16-Pin SOIC	Small Outline Packages	W25M512JVFIQ/TUBE	3D model available Symbol and footprint available 3	1 Download Model
	KTJ251B225M55BFT00 Chemi-Con	1	Multilayer Ceramic Capacitors MLCC - SMD/SMT 2.2uF 250 Volt	Capacitor Chip Non-polarised	KTJ251B225M55BFT00	3D model available Symbol and footprint available 3	1 Download Model
	CKG57NX7T2W225M500JH TDK	1	Multilayer Ceramic Capacitors MLCC - SMD/SMT CKG 2220 450V 2.2uF X7T 20% T: 5mm	Capacitor Chip Non-polarised	CKG57NX7T2W225M500JH	3D model available Symbol and footprint available 3	1 Download Model
	C1206C225M5RACTM Yageo Group	1	SMD Comm X7R, Ceramic, 2.2 uF, 20%, 50 VDC, 125 VDC, 125°C, -55°C, X7R, SMD, MLCC, Temperature Stable, Class II, 10 % , 45.5 MOhms, 41 mg, 1206, 3.2mm, 1.6mm, 1.6mm, 0.5mm, 2000, 78 Weeks, 80	Other	C1206C225M5RACTM	3D model available Symbol and footprint available 3	1 Download Model

	C1210F225M5RACAUTO Yageo Group	1	SMD, MLCC, Open Mode, Automotive Grade	Other	C1210F225M5RACAUTO	3D model available Symbol and footprint available 3	1 Download Model
	C2225C225M5UACTU Yageo Group	1	SMD, MLCC, General Purpose, Class III	Other	C2225C225M5UACTU	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JVEAQ Winbond	1	512Mb Serial NOR Flash 104MHz SON8 2.7V - 3.6V -40℃ ~ 85℃ / -40℃ ~ 105℃ / -40℃ ~ 125℃	Small Outline No-lead	W25M512JVEAQ	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JWCSM Winbond	1	Serial NOR Flash 104MHz	BGA	W25M512JWCSM	3D model available Symbol and footprint available 3	1 Download Model
	C1825C125M5UACTU Yageo Group	1	SMD Comm Z5U, Ceramic, 1.2 uF, 20%, 50 VDC, 125 VDC, 85°C, 10°C, Z5U, SMD, MLCC, General Purpose, Class III, 4 % , 83.3 MOhms, 170 mg, 1825, 4.5mm, 6.4mm, 1.1mm, 0.6mm, 1000, 78 Weeks, 20	Other	C1825C125M5UACTU	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JVFSQ Winbond	1	512Mb SpiStack Flash 104MHz SOP16	Small Outline Packages	W25M512JVFSQ	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JWESM Winbond	1	The W25M512JV (2 x 256M-bit) Serial MCP (Multi Chip Package) Flash memory is based on the popularW25Q SpiFlash® series by stacking two individual W25Q256JV die into a standard 8-pin package. It offersthe highest memory density for the low pin-count package, as well as Concurrent Operations in Serial Flashmemory for the first time. The W25M SpiStack® series is ideal for small form factor system designs, andapplications that demand high Program/Erase data throughput.The SpiStack® product series intr	Small Outline No-lead	W25M512JWESM	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JWCAQ Winbond	1	 New Family of SpiFlash® Memories– W25M512JV: 2 x 256M-bit (2 x 32M-Byte)– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– 3 or 4-Byte Addressing Mode– Software Die Select (C2h)– Software & Hardware Reset(1) High Performance Serial Flash– 104MHz Standard/Dual/Quad SPI clocks– 208/416MHz equivalent Dual/Quad SPI– 50MB/s continuous data transfer rate– Min. 100K Program-Erase cycles persector– More than 20-year data retention	BGA	W25M512JWCAQ	3D model available Symbol and footprint available 3	1 Download Model
	TPS325M5167Q-QP7T 3Peak Incorporated	1	ARM® Cortex®M33 w/FPU TPS325M Microcontroller IC 32-Bit 156MHz 1028KB FLASH LQFP-100(14x14)	Quad Flat Packages	TPS325M5167Q-QP7T	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JWBSQ Winbond	1	512Mb Serial NOR Flash 104MHz TFBGA (5X5)24	BGA	W25M512JWBSQ	3D model available Symbol and footprint available 3	1 Download Model
	AVS225M50B12T-F Cornell Dubilier	1	CORNELL DUBILIER - AVS225M50B12T-F - ALUMINUM ELECTROLYTIC CAPACITOR 2.2UF 50V 20%, SMD, FULL REEL	Capacitor Al Electrolytic	AVS225M50B12T-F	3D model available Symbol and footprint available 3	1 Download Model

	C2225C225M5RACTU Yageo Group	1	SMD, MLCC, Temperature Stable, Class II	Other	C2225C225M5RACTU	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JWFIQ Winbond	1	 New Family of SpiFlash® Memories– W25M512JW-IQ: 2 x 256M-bit (2 x 32MByte)– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– 3 or 4-Byte Addressing Mode– Software Die Select (C2h)– Software & Hardware Reset(1) High Performance Serial Flash– 104MHz Standard/Dual/Quad SPI clocks– 208/416MHz equivalent Dual/Quad SPI– 52MB/s continuous data transfer rate– More than 100,000 Program/Erase cycles– More than 20-year data retention	Small Outline Packages	W25M512JWFIQ	3D model available Symbol and footprint available 3	1 Download Model
	C1206C225M5RECAUTO7210 Yageo Group	1	ESD SMD Auto X7R, Ceramic, 2.2 uF, 20%, 50 VDC, 125 VDC, 125°C, -55°C, X7R, SMD, MLCC, Temperature Stable, Electro Static Discharge, Automotive Grade, 2.5 % , 227.3 MOhms, 41 mg, 1206, 3.2mm, 1.6mm, 1.6mm, 0.5mm, 8000, 78 Weeks, 80	Capacitor Chip Non-polarised	C1206C225M5RECAUTO7210	3D model available Symbol and footprint available 3	1 Download Model
	C2225C125M5UACTU Yageo Group	1	SMD Comm Z5U, Ceramic, 1.2 uF, 20%, 50 VDC, 125 VDC, 85°C, 10°C, Z5U, SMD, MLCC, General Purpose, Class III, 4 % , 83.3 MOhms, 210 mg, 2225, 5.6mm, 6.4mm, 1mm, 0.6mm, 1000, 78 Weeks, 20	Other	C2225C125M5UACTU	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JWBSM Winbond	1	Serial NOR Flash 104MHz	BGA	W25M512JWBSM	3D model available Symbol and footprint available 3	1 Download Model
	C2225C225M5UACTM Yageo Group	1	SMD Comm Z5U, Ceramic, 2.2 uF, 20%, 50 VDC, 125 VDC, 85°C, 10°C, Z5U, SMD, MLCC, General Purpose, Class III, 4 % , 45.5 MOhms, 350 mg, 2225, 5.6mm, 6.4mm, 1.3mm, 0.6mm, 1000, 78 Weeks, 20	Other	C2225C225M5UACTM	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JVESM Winbond	1	512Mb Serial NOR Flash 104MHz SON8 2.7V - 3.6V -40℃ ~ 85℃ / -40℃ ~ 105℃ / -40℃ ~ 125 WSON8 8X6mm	Small Outline No-lead	W25M512JVESM	3D model available Symbol and footprint available 3	1 Download Model
	TPS325M5165Q-QP7T 3Peak Incorporated	1	ARM® Cortex®M33 w/FPU TPS325M Microcontroller IC 32-Bit 156MHz 1024KB FLASH LQFP-100(14x14)	Quad Flat Packages	TPS325M5165Q-QP7T	3D model available Symbol and footprint available 3	1 Download Model
	C1210C225M5RAC7210 Yageo Group	1	SMD, MLCC, Temperature Stable, Class II	Other	C1210C225M5RAC7210	3D model available Symbol and footprint available 3	1 Download Model
	TPS325M5156I-FSDR 3Peak Incorporated	1	Mixed-Signal Microcontrollers 156 MHz, based on ARM Core, TPSensor, rich analog, 512KB, Flash, 208KB RAM	Quad Flat No-Lead	TPS325M5156I-FSDR	3D model available Symbol and footprint available 3	1 Download Model
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