20076 Model Download Search Results
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20076
HELUKABEL
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1 | Wire And Cable, 44 Conductor(s), 22AWG, 500V, Flexible Cord And Fixture Wire | 20076 |
0
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2007660111
Molex
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1 | Conn Micro SD/Nano SIM Combo Connector SKT 12/14 POS Solder RA SMD 0.5A/Contact T/R | Other | 2007660111 |
3
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2007637-8
TE Connectivity
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1 | Configuration Features: Port Matrix Configuration 2 x 2 | Number of Positions 80 | Number of Ports 4 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Tail Plating Material Tin | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Centerline (Pitch) .8 MM | Centerli | Other | 2007637-8 |
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2007637-7
TE Connectivity
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1 | Configuration Features: Port Matrix Configuration 2 x 2 | Number of Positions 80 | Number of Ports 4 | Contact Features: Tail Plating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Centerline (Pitch) .8 MM | Cage Material Nickel Silver | Centerli | Other | 2007637-7 |
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2007637-5
TE Connectivity
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1 | Configuration Features: Number of Ports 4 | Port Matrix Configuration 2 x 2 | Number of Positions 80 | Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Tail Plating Material Tin | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Centerline (Pitch) .032 INCH | Cent | Other | 2007637-5 |
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2007637-6
TE Connectivity
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1 | Configuration Features: Port Matrix Configuration 2 x 2 | Number of Positions 80 | Number of Ports 4 | Contact Features: Tail Plating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Centerline (Pitch) .032 INCH | Cent | Other | 2007637-6 |
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0901200763
Molex
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1 | 2.54mm Pitch C-Grid III Header, Single Row, Vertical, 3 Circuits, 0.38µm Gold (Au) Selective Plating | Header, Vertical | 0901200763 |
3
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MAX20076BATCB/VY+T
Analog Devices
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1 | Switching Voltage Regulators 36V, 2MHz, 1.2A Mini Buck Converter with 3.5uA Iq | Small Outline No-lead | MAX20076BATCB/VY+T |
3
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MAX20076ATCC/V+
Analog Devices
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1 | 36V, 600mA/1.2A Mini Buck Converter | Small Outline No-lead | MAX20076ATCC/V+ |
3
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1-2007637-5
TE Connectivity
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1 | SFP, SFP+ & zSFP+, Cage Assembly with Integrated Connector, Data Rate (Max) 16 Gb/s, Internal/External EMI Springs, EMI Enhanced, With Lightpipe | Other | 1-2007637-5 |
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1-2007637-6
TE Connectivity
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1 | TE CONNECTIVITY - 1-2007637-6 - CONNECTOR, SFP+, RECEPTACLE, 80 POSITION, PRESS FIT | Other | 1-2007637-6 |
3
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0901200768
Molex
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1 | 2.54mm Pitch C-Grid III Header, Single Row, Vertical, 8 Circuits, 0.38µm Gold (Au) Selective Plating | Header, Vertical | 0901200768 |
3
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90120-0764
Molex
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1 | Molex C-GRID III 90120, 2.54mm Pitch, 4 Way, 1 Row, Straight Pin Header, Through Hole | Header, Vertical | 90120-0764 |
3
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90120-0767
Molex
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1 | Molex C-GRID III Series, Series Number 90120, 2.54mm Pitch 7 Way 1 Row Straight PCB Header, Solder Termination, 3A | Header, Vertical | 90120-0767 |
3
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90120-0762
Molex
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1 | 2 way single row straight header Molex C-GRID III Series, Series Number 90120, 2.54mm Pitch 2 Way 1 Row Straight PCB Header, Solder Termination, 3A | Header, Vertical | 90120-0762 |
3
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MAX20076ATCB/V+T
Analog Devices
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1 | Switching Voltage Regulators 36V,2MHz, 1.2A Mini Buck Converter with 3.5uA Iq | Small Outline No-lead | MAX20076ATCB/V+T |
3
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0901200762
Molex
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1 | 2.54mm Pitch C-Grid III Header, Single Row, Vertical, 2 Circuits, 0.38µm Gold (Au) Selective Plating | Header, Vertical | 0901200762 |
3
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MAX20076DATCA/V+T
Analog Devices
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1 | Switching Voltage Regulators 36V, 1.2A, 2.2MHz Mini Buck Converter with 5uA Iq | Small Outline No-lead | MAX20076DATCA/V+T |
3
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MAX20076BATCB/VY+
Analog Devices
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1 | Switching Voltage Regulators 36V, 2MHz, 1.2A Mini Buck Converter with 3.5uA Iq | Small Outline No-lead | MAX20076BATCB/VY+ |
3
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MAX20076DATCA/VY+T
Analog Devices
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1 | 36V, 600mA/1.2A Mini Buck Converter | Small Outline No-lead | MAX20076DATCA/VY+T |
3
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MAX20076ATCC/V+T
Analog Devices
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1 | Switching Voltage Regulators 36V,2MHz, 1.2A Mini Buck Converter with 3.5uA Iq | Small Outline No-lead | MAX20076ATCC/V+T |
3
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0901200761
Molex
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1 | 2.54mm Pitch C-Grid III Header, Single Row, Vertical, 1 Circuits, Gold (Au) Plating | Other | 0901200761 |
3
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1-2007637-8
TE Connectivity
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1 | Configuration Features: Number of Positions 80 | Number of Ports 4 | Port Matrix Configuration 2 x 2 | Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Tail Plating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Centerline (Pitch) .8 MM | Centerli | Other | 1-2007637-8 |
3
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Download Model | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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90120-0768
Molex
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1 | 8 way single row straight header Molex C-GRID III Series, Series Number 90120, 2.54mm Pitch 8 Way 1 Row Straight Pin Header, Through Hole | Header, Vertical | 90120-0768 |
3
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MAX20076DATCA/VY+
Analog Devices
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1 | 36V, 600mA/1.2A Mini Buck Converter TD1233Y+3C | Small Outline No-lead | MAX20076DATCA/VY+ |
3
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Download Model | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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