21292 Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	2129260-1 TE Connectivity	1	Body Features: Shell Base Material Stainless Steel \| Configuration Features: PCB Mount Orientation Right Angle \| Number of Rows 3 \| Number of Signal Positions 40 \| Number of Power Positions 0 \| Number of Positions 40 \| Contact Features: Contact Current Rating (Max) 1 AMP \| Number of Utility Contacts 0 \| Contact Base Material Copper Alloy \| Contact Mating Area Plating Material Thickness .38 MICM \| Contact Mating Area Plating Material Gold \| Contact Current Rating (Max) .5 AMP \| Housing Features: Housing Colo	Other	2129260-1	3D model available Symbol and footprint available 3	1 Download Model
	2129261-1 TE Connectivity	1	Body Features: Shell Base Material Stainless Steel \| Configuration Features: Number of Power Positions 0 \| Number of Positions 40 \| Number of Rows 3 \| Number of Signal Positions 40 \| PCB Mount Orientation Vertical \| Contact Features: Contact Current Rating (Max) 1 AMP \| Number of Utility Contacts 0 \| Contact Mating Area Plating Material Gold \| Contact Current Rating (Max) .5 AMP \| Contact Base Material Copper Alloy \| Contact Mating Area Plating Material Thickness .38 MICM \| Housing Features: Centerline (Pit	Other	2129261-1	3D model available Symbol and footprint available 3	1 Download Model
	R5F21292SDSP#U0 Renesas Electronics	1	The R8C/29 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 20-pin molded-plastic LSSOP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/29 Group has on-chip dat	Small Outline Packages	R5F21292SDSP#U0	3D model available Symbol and footprint available 3	1 Download Model
	R5F21292SNSP#U0 Renesas Electronics	1	The R8C/29 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 20-pin molded-plastic LSSOP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/29 Group has on-chip dat	Small Outline Packages	R5F21292SNSP#U0	3D model available Symbol and footprint available 3	1 Download Model

	830202129201 Würth Elektronik	1	WE-SPXO Crystal Oscillator CFPS-72; 7.0 x 5.0mm; 8.0 MHz; Tol = IN; Stab = Â±50 ppm; HCMOS/TTL; Temp Range: -40 to 85 Â°C; Vsupply = 5 V	Other	830202129201	3D model available Symbol and footprint available 3	1 Download Model
	R5F21292SDSP#W4 Renesas Electronics	1	The R8C/29 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 20-pin molded-plastic LSSOP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/29 Group has on-chip dat	Small Outline Packages	R5F21292SDSP#W4	3D model available Symbol and footprint available 3	1 Download Model
	LFSPXO021292BULK IQD	1	Standard Clock Oscillators 8.0MHz 7.0 x 5.0 x 1.4mm	Other	LFSPXO021292BULK	3D model available Symbol and footprint available 3	1 Download Model
	R5F21292SNSP#W4 Renesas Electronics	1	The R8C/29 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 20-pin molded-plastic LSSOP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/29 Group has on-chip dat	Small Outline Packages	R5F21292SNSP#W4	3D model available Symbol and footprint available 3	1 Download Model
	2129295-1 TE Connectivity	1	USB Connector		2129295-1	3D model not available Symbol and footprint not available 0	0 Build or Request
	2129260-2 TE Connectivity	1	Body Features: Shell Base Material Stainless Steel \| Configuration Features: Number of Rows 3 \| Number of Power Positions 0 \| Number of Positions 40 \| Number of Signal Positions 40 \| PCB Mount Orientation Right Angle \| Contact Features: Contact Mating Area Plating Material Thickness .38 MICM \| Contact Mating Area Plating Material Gold \| Number of Utility Contacts 0 \| Contact Current Rating (Max) 1 AMP \| Contact Current Rating (Max) .5 AMP \| Contact Base Material Copper Alloy \| Housing Features: Housing Mate		2129260-2	3D model available Symbol and footprint not available 1	1 Download Model
	2129276-1 TE Connectivity	1	Telecom and Datacom Connector, 40 Contact(s), Male, Straight, Solder Terminal, Plug		2129276-1	3D model not available Symbol and footprint not available 0	0 Build or Request
	2129276-1 TE Connectivity	1	Body Features: Shell Base Material Stainless Steel \| Configuration Features: Number of Power Positions 0 \| Number of Rows 3 \| Number of Positions 40 \| Number of Signal Positions 40 \| PCB Mount Orientation Vertical \| Contact Features: Contact Mating Area Plating Material Gold \| Number of Utility Contacts 0 \| Contact Current Rating (Max) .5 AMP \| Contact Base Material Copper Alloy \| Contact Current Rating (Max) 1 AMP \| Housing Features: Centerline (Pitch) .024 INCH \| Centerline (Pitch) .6 MM \| Industry Standa		2129276-1	3D model available Symbol and footprint not available 1	1 Download Model
	2129283-1 TE Connectivity	1	Body Features: Shell Base Material Copper Alloy \| Configuration Features: PCB Mount Orientation Vertical \| Number of Positions 40 \| Number of Power Positions 0 \| Number of Signal Positions 40 \| Number of Rows 3 \| Contact Features: Contact Mating Area Plating Material Thickness 8 MICIN \| Number of Utility Contacts 0 \| Contact Current Rating (Max) 1 AMP \| Contact Mating Area Plating Material Gold \| Contact Current Rating (Max) .5 AMP \| Contact Base Material Copper Alloy \| Housing Features: Centerline (Pitch)		2129283-1	3D model available Symbol and footprint not available 1	1 Download Model
	2129295-2 TE Connectivity	1	USB Connector		2129295-2	3D model not available Symbol and footprint not available 0	0 Build or Request
	2129261-1 TE Connectivity	1	Telecom and Datacom Connector, 40 Contact(s), Male, Straight, Solder and Surface Mount Terminal, Plug		2129261-1	3D model not available Symbol and footprint not available 0	0 Build or Request

	2129260-2 TE Connectivity	1	Telecom and Datacom Connector, 40 Contact(s), Female, Right Angle, Solder and Surface Mount Terminal, Locking, Receptacle		2129260-2	3D model not available Symbol and footprint not available 0	0 Build or Request
	2129281-2 TE Connectivity	1	Configuration Features: Number of Rows 3 \| Number of Signal Positions 40 \| Number of Power Positions 0 \| Number of Positions 40 \| PCB Mount Orientation Right Angle \| Contact Features: Contact Current Rating (Max) 1 AMP \| Contact Current Rating (Max) .5 AMP \| Number of Utility Contacts 0 \| Housing Features: Centerline (Pitch) .6 MM \| Centerline (Pitch) .024 INCH \| Mechanical Attachment: PCB Mount Retention Without \| PCB Mount Retention Type Hold-Down Post \| Connector Mounting Type Board Mount \| Operation/App		2129281-2	3D model available Symbol and footprint not available 1	1 Download Model
	2129273-1 TE Connectivity	1	Telecom and Datacom Connector, 40 Contact(s), Female, Right Angle, Solder and Surface Mount Terminal, Receptacle		2129273-1	3D model not available Symbol and footprint not available 0	0 Build or Request
	2129256-1 TE Connectivity	1	PCB Connector		2129256-1	3D model not available Symbol and footprint not available 0	0 Build or Request
	2129260-1 TE Connectivity	1	Telecom and Datacom Connector, 40 Contact(s), Female, Right Angle, Solder and Surface Mount Terminal, Receptacle		2129260-1	3D model not available Symbol and footprint not available 0	0 Build or Request
	934062129215 Nexperia	1	Zener Diode, 6.2V V(Z), 2%, 0.3W, Silicon, Unidirectional, TO-236AB		934062129215	3D model not available Symbol and footprint not available 0	0 Build or Request
	BLU2512-1292-CB5W RCD Components Inc	1	Fixed Resistor, Thin Film, 1W, 12900ohm, 200V, 0.25% +/-Tol, 5ppm/Cel, 2512,		BLU2512-1292-CB5W	3D model not available Symbol and footprint not available 0	0 Build or Request
	GUS-SS7B-02-1292-D TT Electronics Resistors	1	Array/Network Resistor, Bussed, Tantalum Nitride/nickel Chrome, 0.7W, 12900ohm, 100V, 0.5% +/-Tol, 50ppm/Cel, Surface Mount, 1534, SOIC-14		GUS-SS7B-02-1292-D	3D model not available Symbol and footprint not available 0	0 Build or Request
	DIP1989SD021292DF TT Electronics Resistors	1	Array/Network Resistor, Isolated, 0.2W, 12900ohm, 100V, 0.5% +/-Tol, -50,50ppm/Cel, 7025,		DIP1989SD021292DF	3D model not available Symbol and footprint not available 0	0 Build or Request
	GUS-SS8BLF-02-1292-BB TT Electronics Resistors	1	Array/Network Resistor, Bussed, Tantalum Nitride/nickel Chrome, 0.05W, 12900ohm, 100V, 0.1% +/-Tol, -50,50ppm/Cel, 3915,		GUS-SS8BLF-02-1292-BB	3D model not available Symbol and footprint not available 0	0 Build or Request
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