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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	228-1277-39-0602J 3M	1	IC & Component Sockets RECPT FOR DIP SOCKET 28 Contact Qty.	Other	228-1277-39-0602J	3D model available Symbol and footprint available 3	1 Download Model
	228-1290-09-0602J 3M	1	3M 2281290 1.78mm Pitch Straight 28 Way, Through Hole Closed Frame ZIF IC Dip Socket, 1A	Other	228-1290-09-0602J	3D model available Symbol and footprint available 3	1 Download Model
	228-1371-00-0602J 3M	1	Conn DIP Socket SKT 28 POS 2.54mm Solder ST Thru-Hole	Other	228-1371-00-0602J	3D model available Symbol and footprint available 3	1 Download Model
	ADUM2281ARIZ-RL Analog Devices	1	High isolation voltage: 5000 V rms► Up to 100 Mbps data rate► Low propagation delay: 24 ns maximum► Low dynamic power consumption► Bidirectional communication► 3 V to 5 V level translation► High temperature operation: 125°C► High common-mode transient immunity: >25 kV/μs► Default high output: ADuM2280/ADuM2281► Default low output: ADuM2285/ADuM2286► 16-lead SOIC wide body enhanced creepage package► Safety and regulatory approvals► UL recognition: 5000 V rms for 1 minute per UL 1577	Small Outline Packages	ADUM2281ARIZ-RL	3D model available Symbol and footprint available 3	1 Download Model

	643228-1 TE Connectivity	1	Configuration Features: Number of Power Positions 3 \| Number of Positions 3 \| PCB Mount Orientation Right Angle \| Number of Rows 1 \| Contact Features: Contact Mating Area Plating Material Thickness 3.81 â€“ 5.08 MICM \| Multiple Contact Types Without \| Contact Retention Within Housing Without \| Contact Mating Area Plating Material Thickness 150 â€“ 200 MICIN \| Contact Type Socket \| PCB Contact Termination Area Plating Material Tin \| Contact Mating Area Plating Material Tin \| Contact Current Rating (Max) 12 A	Other	643228-1	3D model available Symbol and footprint available 3	1 Download Model
	ADUM2281CRIZ Analog Devices	1	High isolation voltage: 5000 V rms► Up to 100 Mbps data rate► Low propagation delay: 24 ns maximum► Low dynamic power consumption► Bidirectional communication► 3 V to 5 V level translation► High temperature operation: 125°C► High common-mode transient immunity: >25 kV/μs► Default high output: ADuM2280/ADuM2281► Default low output: ADuM2285/ADuM2286► 16-lead SOIC wide body enhanced creepage package► Safety and regulatory approvals► UL recognition: 5000 V rms for 1 minute per UL 1577	Small Outline Packages	ADUM2281CRIZ	3D model available Symbol and footprint available 3	1 Download Model
	776228-1 TE Connectivity	1	Body Features: Connector & Keying Code 1 \| Primary Product Color Black \| Configuration Features: PCB Mount Orientation Vertical \| Number of Rows 3 \| Number of Positions 23 \| Contact Features: Contact Type Pin \| Contact Current Rating (Max) 8 AMP \| Contact Mating Area Plating Material Tin \| Housing Features: Centerline (Pitch) 4 MM \| Centerline (Pitch) .157 INCH \| Industry Standards: UL Flammability Rating UL 94V-0 \| Mechanical Attachment: Mating Alignment With \| Connector Mounting Type Board Mount \| PCB Mou	Other	776228-1	3D model available Symbol and footprint available 3	1 Download Model
	ADUM2281BRIZ Analog Devices	1	High isolation voltage: 5000 V rms► Up to 100 Mbps data rate► Low propagation delay: 24 ns maximum► Low dynamic power consumption► Bidirectional communication► 3 V to 5 V level translation► High temperature operation: 125°C► High common-mode transient immunity: >25 kV/μs► Default high output: ADuM2280/ADuM2281► Default low output: ADuM2285/ADuM2286► 16-lead SOIC wide body enhanced creepage package► Safety and regulatory approvals► UL recognition: 5000 V rms for 1 minute per UL 1577	Small Outline Packages	ADUM2281BRIZ	3D model available Symbol and footprint available 3	1 Download Model
	ADUM2281ARIZ Analog Devices	1	► High isolation voltage: 5000 V rms► Up to 100 Mbps data rate► Low propagation delay: 24 ns maximum► Low dynamic power consumption► Bidirectional communication► 3 V to 5 V level translation► High temperature operation: 125°C► High common-mode transient immunity: >25 kV/μs► Default high output: ADuM2280/ADuM2281► Default low output: ADuM2285/ADuM2286► 16-lead SOIC wide body enhanced creepage package► Safety and regulatory approvals► UL recognition: 5000 V rms for 1 minute per UL 1577	Small Outline Packages	ADUM2281ARIZ	3D model available Symbol and footprint available 3	1 Download Model
	0228113 RS Pro	0	RS Pro 1 μH Ferrite Leaded Inductor, 3.3A Idc APIE0309	Inductors, Axial Diameter Horizontal Mounting	0228113	3D model available Symbol and footprint available 3	1 Download Model
	SIT3521AI-2C2281GB148.500000 SiTime	1	1 to 340 MHz Elite Platform I2C/SPI Programmable Oscillator, 5 x 3.2mm Package	Other	SIT3521AI-2C2281GB148.500000	3D model available Symbol and footprint available 3	1 Download Model
	AHER2281 Panasonic	1	Power Relays ( Over 2 A ) HE-R RELAYS ,2 Form A 1 Form B , 12 vdc .	Other	AHER2281	3D model available Symbol and footprint available 3	1 Download Model
	TPS22810DRVR Texas Instruments	1	18V, 3A, 79mΩ Load Switch with Adjustable Rise Time, Adj. Quick Output Discharge, & Thermal Shutdown	Small Outline No-lead	TPS22810DRVR	3D model available Symbol and footprint available 3	1 Download Model
	RSP-122811-01 SAMTEC	1	SAMTEC - RSP-122811-01 - RF COAX, I-PEX MHF I JACK, 50 OHM, PCB	Other	RSP-122811-01	3D model available Symbol and footprint available 3	1 Download Model
	FPF2281BUCX_F130 onsemi	1	Power Switch 1-OUT 4.5A 0.03Ohm 12-Pin WLCSP T/R	BGA	FPF2281BUCX_F130	3D model available Symbol and footprint available 3	1 Download Model

	BY228-15TAP Vishay	1	Rectifiers 3.0 Amp 1500 Volt 50 Amp IFSM	Other	BY228-15TAP	3D model not available Symbol and footprint available 2	1 Download Model
	22-28-1020 Molex	1	Headers & Wire Housings HEADER R/A 2P	Other	22-28-1020	3D model available Symbol and footprint available 3	1 Download Model
	BY228-13TAP Vishay	1	Rectifier Diode Switching 1KV 3A 20000ns 2-Pin SOD-64 Ammo	Diodes, Axial Diameter Horizontal Mounting	BY228-13TAP	3D model available Symbol and footprint available 3	1 Download Model
	72281L10PFG Renesas Electronics	1	The 72281 is a 64K x 9 SuperSync FIFO memory with clocked read and write controls. The Frequency Select pin (FS) has been removed, thus it is no longer necessary to select which of the two clock inputs, RCLK or WCLK, is running at the higher frequency. The period required by the retransmit operation and the first word data latency period is now fixed and short. (The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated on this SuperS	Quad Flat Packages	72281L10PFG	3D model available Symbol and footprint available 3	1 Download Model
	72281L20TF Renesas Electronics	1	The 72281 is a 64K x 9 SuperSync FIFO memory with clocked read and write controls. The Frequency Select pin (FS) has been removed, thus it is no longer necessary to select which of the two clock inputs, RCLK or WCLK, is running at the higher frequency. The period required by the retransmit operation and the first word data latency period is now fixed and short. (The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated on this SuperS	Quad Flat Packages	72281L20TF	3D model available Symbol and footprint available 3	1 Download Model
	AP2281-1FMG-7 Diodes Incorporated	1	Power Switch ICs - Power Distribution PROGRAM LOAD SWITCH 1.5V-6.0V INTERFACE	Small Outline No-lead	AP2281-1FMG-7	3D model available Symbol and footprint available 3	1 Download Model
	2132281011 Molex	1	1.50mm Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Dual Row, Surface Mount, Right-Angle, 0.10µm Gold (Au) Plating, 10 Circuits, Black	Other	2132281011	3D model available Symbol and footprint available 3	1 Download Model
	72281L15TF8 Renesas Electronics	1	The 72281 is a 64K x 9 SuperSync FIFO memory with clocked read and write controls. The Frequency Select pin (FS) has been removed, thus it is no longer necessary to select which of the two clock inputs, RCLK or WCLK, is running at the higher frequency. The period required by the retransmit operation and the first word data latency period is now fixed and short. (The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated on this SuperS	Quad Flat Packages	72281L15TF8	3D model available Symbol and footprint available 3	1 Download Model
	2132281131 Molex	1	1.50mm Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Dual Row, Surface Mount, Right-Angle, 11 Circuits, Natural	Other	2132281131	3D model not available Symbol and footprint available 2	1 Download Model
	2132281130 Molex	1	1.50mm Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Dual Row, Surface Mount, Right-Angle, 11 Circuits, Natural	Other	2132281130	3D model not available Symbol and footprint available 2	1 Download Model
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