292-3 Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	292-3.4K-RC Xicon	1	Thick Film Resistors - SMD 1/8WATT 3.4KOHMS	Resistor Chip	292-3.4K-RC	3D model available Symbol and footprint available 3	1 Download Model
	292331-3 TE Connectivity	1	Configuration Features: PCB Mount Orientation Right Angle \| Number of Positions 3 \| Contact Features: Contact Current Rating (Max) 2 AMP \| Contact Mating Area Plating Material Gold \| Contact Underplating Material Nickel \| PCB Contact Termination Area Plating Material Tin-Lead \| Housing Features: Centerline (Pitch) 1.6 MM \| Centerline (Pitch) .063 INCH \| Mechanical Attachment: Connector Mounting Type Board Mount \| PCB Mount Retention Without \| Operation/Application: Circuit Application Signal \| Product Type	Other	292331-3	3D model available Symbol and footprint available 3	1 Download Model
	902-9235 Amphenol	1	RF Connectors / Coaxial Connectors MicroSwitch PCB Strt Jack Surf Mnt 50 ohm	Other	902-9235	3D model available Symbol and footprint available 3	1 Download Model
	VER2923-333KL COILCRAFT	1	COILCRAFT - VER2923-333KL - INDUCTOR, 33UH, 26A, PWR, 7.5MHZ	Other	VER2923-333KL	3D model available Symbol and footprint available 3	1 Download Model

	B32923C3154K TDK	1	Safety Capacitors 0.15uF 305volts 10% X2	Other	B32923C3154K	3D model available Symbol and footprint available 3	1 Download Model
	B32923H3474M TDK	1	Safety Capacitors 0.47uF 305Vac X2 LS= 22.5mm Hi Humidity	Other	B32923H3474M	3D model available Symbol and footprint available 3	1 Download Model
	B32923H3155M000 TDK	1	EMI Suppression Capacitors, 1.5uF, 305Vrms AC, 14.5m(W) x 29.5m(H) x 26.5m(L)	Other	B32923H3155M000	3D model available Symbol and footprint available 3	1 Download Model
	B32923C3105K003 TDK	1	EMI Suppression Capacitors, 1uF, 305Vrms AC, 11m(W) x 20.5m(H) x 26.5m(L)	Other	B32923C3105K003	3D model available Symbol and footprint available 3	1 Download Model
	B32923P3224K289 TDK	1	EMI Suppression Capacitors	Other	B32923P3224K289	3D model available Symbol and footprint available 3	1 Download Model
	B32923J3334M003 TDK	1	EMI Suppression Capacitors, 0.33μF, 305Vrms AC, 8.5m(W) x 16.5m(H) x 26.5m(L)	Other	B32923J3334M003	3D model available Symbol and footprint available 3	1 Download Model
	B32923C3105K003 TDK	1	EMI Suppression Capacitors, 1uF, 305Vrms AC, 11m(W) x 20.5m(H) x 26.5m(L)	Other	B32923C3105K003	3D model available Symbol and footprint available 3	1 Download Model
	292303-6 TE Connectivity	1	Body Features: Shell Plating Finish Bright \| Connector Profile Standard \| Shell Plating Material Tin \| Configuration Features: Number of Mounting Legs 2 \| Number of Positions 4 \| Number of Ports 1 \| Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel \| Contact Mating Area Plating Material Thickness .76 MICM \| Contact Mating Area Plating Material Thickness 29.92 MICIN \| Contact Current Rating (Max) 1 AMP \| Dimensions: PCB Thickness (Recommended) .062 INCH \| PCB Thi	Other	292303-6	3D model available Symbol and footprint available 3	1 Download Model
	ESQ-129-23-H-D SAMTEC	1	58 Position, Elevated Socket Strip, 0.100" Pitch	Other	ESQ-129-23-H-D	3D model available Symbol and footprint available 3	1 Download Model
	292317-4 TE Connectivity	1	Body Features: Connector Profile Standard \| Shell Plating Finish Matte \| Shell Plating Material Nickel \| Offset 0 MM \| Configuration Features: Number of Ports 1 \| Number of Positions 4 \| Contact Features: Contact Mating Area Plating Material Gold Flash over Palladium Nickel \| Contact Current Rating (Max) 1 AMP \| Contact Mating Area Plating Material Thickness 29.92 MICIN \| Contact Mating Area Plating Material Thickness .76 MICM \| Dimensions: PCB Thickness (Recommended) .062 INCH \| PCB Thickness (Recommended)	Other	292317-4	3D model available Symbol and footprint available 3	1 Download Model
	TSW-129-23-G-S SAMTEC	1	29 Position, Single Row, Classic PCB Header Strips, 0.100" pitch	Other	TSW-129-23-G-S	3D model not available Symbol and footprint available 2	1 Download Model

	TSW-129-23-L-S SAMTEC	1	29 Position, Single Row, Classic PCB Header Strips, 0.100" pitch	Other	TSW-129-23-L-S	3D model not available Symbol and footprint available 2	1 Download Model
	B32923C3684M000 TDK	1	EMI Suppression Capacitors, 0.68uF, 305Vrms AC, 10.5m(W) x 16.5m(H) x 26.5m(L)	Other	B32923C3684M000	3D model available Symbol and footprint available 3	1 Download Model
	292303-3 TE Connectivity	1	Body Features: Connector Profile Standard \| Shell Plating Material Tin \| Shell Plating Finish Bright \| Configuration Features: Number of Mounting Legs 2 \| Number of Positions 4 \| Number of Ports 1 \| Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel \| Contact Mating Area Plating Material Thickness 29.92 MICIN \| Contact Current Rating (Max) 1 AMP \| Contact Mating Area Plating Material Thickness .76 MICM \| Dimensions: PCB Thickness (Recommended) 1.57 MM \| PCB Thick	Other	292303-3	3D model available Symbol and footprint available 3	1 Download Model
	B32923P3474M003 TDK	1	EMI Suppression Capacitors	Other	B32923P3474M003	3D model available Symbol and footprint available 3	1 Download Model
	TFM-129-23-SM-D SAMTEC	1	High-Reliability Tiger Eye™ Terminal Strips, .050" Pitch	Other	TFM-129-23-SM-D	3D model not available Symbol and footprint available 2	1 Download Model
	B32923H3224M003 TDK	1	EMI Suppression Capacitors, 0.22uF, 305Vrms AC, 7m(W) x 16m(H) x 26.5m(L)	Other	B32923H3224M003	3D model available Symbol and footprint available 3	1 Download Model
	SSW-129-23-F-S SAMTEC	1	29 Position, .100" Tiger Buy™ Socket Strip	Other	SSW-129-23-F-S	3D model not available Symbol and footprint available 2	1 Download Model
	292303-1 TE Connectivity	1	Body Features: Connector Profile Standard \| Shell Plating Finish Bright \| Shell Plating Material Tin \| Configuration Features: Number of Positions 4 \| Number of Ports 1 \| Number of Mounting Legs 2 \| Contact Features: Contact Mating Area Plating Material Thickness .76 MICM \| Contact Mating Area Plating Material Thickness 29.92 MICIN \| Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel \| Contact Current Rating (Max) 1 AMP \| Dimensions: PCB Thickness (Recommended) .062 INCH \| PCB Thi	Other	292303-1	3D model available Symbol and footprint available 3	1 Download Model
	B32923H3224M289 TDK	1	EMI Suppression Capacitors, 0.22uF, 305Vrms AC, 7m(W) x 16m(H) x 26.5m(L)	Other	B32923H3224M289	3D model available Symbol and footprint available 3	1 Download Model
	B32923Q3334M189 TDK	1	EMI Suppression Capacitors	Other	B32923Q3334M189	3D model available Symbol and footprint available 3	1 Download Model
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