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Image Part Number D.S Description Package Category Prices / Stock Model Action
Image Part Number D.S Description Package Category Prices / Stock Model Action
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292-3.0 Xicon Passive Components
1 Fixed Resistor, Metal Film, 0.1W, 3ohm, 150V, 1% +/-Tol, -400,400ppm/Cel, 0805, 292-3.0 0 Build or Request
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292303-4 TE Connectivity
1 Body Features: Connector Profile Standard | Shell Plating Finish Bright | Shell Plating Material Tin | Configuration Features: Number of Ports 1 | Number of Positions 4 | Number of Mounting Legs 2 | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Current Rating (Max) 1 AMP | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thick Other 292303-4 1 Download Model
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292303-1 TE Connectivity
1 Body Features: Connector Profile Standard | Shell Plating Finish Bright | Shell Plating Material Tin | Configuration Features: Number of Positions 4 | Number of Ports 1 | Number of Mounting Legs 2 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Current Rating (Max) 1 AMP | Dimensions: PCB Thickness (Recommended) .062 INCH | PCB Thi Other 292303-1 1 Download Model
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292303-5 TE Connectivity
1 Body Features: Connector Profile Standard | Shell Plating Material Tin | Shell Plating Finish Bright | Configuration Features: Number of Ports 1 | Number of Positions 4 | Number of Mounting Legs 2 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Current Rating (Max) 1 AMP | Contact Mating Area Plating Material Thickness 29.92 MICIN | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thick Other 292303-5 1 Download Model
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292303-6 TE Connectivity
1 Body Features: Shell Plating Finish Bright | Connector Profile Standard | Shell Plating Material Tin | Configuration Features: Number of Mounting Legs 2 | Number of Positions 4 | Number of Ports 1 | Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Current Rating (Max) 1 AMP | Dimensions: PCB Thickness (Recommended) .062 INCH | PCB Thi Other 292303-6 1 Download Model
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292303-3 TE Connectivity
1 Body Features: Connector Profile Standard | Shell Plating Material Tin | Shell Plating Finish Bright | Configuration Features: Number of Mounting Legs 2 | Number of Positions 4 | Number of Ports 1 | Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Current Rating (Max) 1 AMP | Contact Mating Area Plating Material Thickness .76 MICM | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thick Other 292303-3 1 Download Model
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292304-1 TE Connectivity
1 Body Features: Shell Plating Material Tin | Offset 0 MM | Connector Profile Standard | Shell Plating Finish Bright | Configuration Features: Number of Ports 1 | Number of Positions 4 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Current Rating (Max) 1 AMP | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thickness (Recommen Other 292304-1 1 Download Model
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292303-9 TE Connectivity
1 Body Features: Shell Plating Finish Bright | Shell Plating Material Tin | Offset 4.13 MM | Connector Profile Standard | Configuration Features: Number of Positions 4 | Number of Ports 1 | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Current Rating (Max) 1 AMP | Contact Mating Area Plating Material Thickness .76 MICM | Dimensions: PCB Thickness (Recommended) .047 INCH | PCB Thickness (Rec Other 292303-9 1 Download Model
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292304-2 TE Connectivity
1 Body Features: Offset 0 MM | Shell Plating Finish Bright | Connector Profile Standard | Shell Plating Material Tin | Configuration Features: Number of Ports 1 | Number of Positions 4 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Current Rating (Max) 1 AMP | Dimensions: PCB Thickness (Recommended) .062 INCH | PCB Thickness (Recomm Other 292304-2 1 Download Model
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292303-8 TE Connectivity
1 A, 2.0, Standard Profile, Receptacle, 1 Port, Top, Right Angle, Box & Tray / Tube, Flush, Through Hole - Solder, Cable-to-Board, USB Connectors Other 292303-8 1 Download Model
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292303-7 TE Connectivity
1 Body Features: Shell Plating Finish Bright | Offset 4.13 MM | Shell Plating Material Tin | Connector Profile Standard | Configuration Features: Number of Mounting Legs 2 | Number of Ports 1 | Number of Positions 4 | Contact Features: Contact Current Rating (Max) 1 AMP | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) 1. Other 292303-7 1 Download Model
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292304-3 TE Connectivity
1 Body Features: Connector Profile Standard | Shell Plating Finish Bright | Shell Plating Material Tin | Offset 0 MM | Configuration Features: Number of Positions 4 | Number of Ports 1 | Contact Features: Contact Current Rating (Max) 1 AMP | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness 29.92 MICIN | Dimensions: PCB Thickness (Recommended) .062 INCH | PCB Thickness (Recomm Other 292304-3 1 Download Model
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1-292303-7 TE Connectivity
1 RECEPTACLE ASSEMBLY RIGHT ANGLE POSITION T/H SMT USB VERSION Other 1-292303-7 1 Download Model
Part Image Part Image 1 Conn Ejector Header HDR 26 POS 2.54mm Solder ST Thru-Hole Other N3429-2302RB 1 Download Model
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1-292303-6 TE Connectivity
1 USB-A (USB TYPE-A) USB 2.0 Receptacle Connector 4 Position Surface Mount, Right Angle Other 1-292303-6 1 Download Model
Part Image Part Image 1 DIN 3R female angled, 30pin, PL2 Other 09292306801 1 Download Model
Part Image Part Image 1 Nano-Fit Vertical Header, Surface Mount, 2.50mm Pitch, Dual Row, 4 Circuits, 0.76µm Gold (Au) Plating, Natural, Glow-Wire Capable Other 1054292304 1 Download Model
Part Image Part Image 1 Nano-Fit Vertical Header, Surface Mount, 2.50mm Pitch, Dual Row, 6 Circuits, 0.76µm Gold (Au) Plating, Natural, Glow-Wire Capable Other 1054292306 1 Download Model
Part Image Part Image 1 Nano-Fit Vertical Header, Surface Mount, 2.50mm Pitch, Dual Row, 8 Circuits, 0.76µm Gold (Au) Plating, Natural, Glow-Wire Capable Other 1054292308 1 Download Model
Part Image Part Image 1 DIN 3R female angled, 30pin, PL2, SMC/THR, (comes on reel of 150pieces) Other 09292306804791 1 Download Model
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292-3.0K-RC Xicon Passive Components
1 Fixed Resistor, Metal Film, 0.1W, 3000ohm, 150V, 1% +/-Tol, -200,200ppm/Cel, 0805, 292-3.0K-RC 0 Build or Request
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292-3.09-RC Xicon Passive Components
1 Fixed Resistor, Metal Film, 0.1W, 3.09ohm, 150V, 1% +/-Tol, -400,400ppm/Cel, 0805, 292-3.09-RC 0 Build or Request
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292-3.01M Xicon Passive Components
1 Fixed Resistor, Metal Film, 0.1W, 3010000ohm, 150V, 1% +/-Tol, -200,200ppm/Cel, 0805, 292-3.01M 0 Build or Request
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292-3.09M-RC Xicon Passive Components
1 Fixed Resistor, Metal Film, 0.1W, 3090000ohm, 150V, 1% +/-Tol, -200,200ppm/Cel, 0805, 292-3.09M-RC 0 Build or Request
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292-3.0M-RC Xicon Passive Components
1 Fixed Resistor, Metal Film, 0.1W, 3000000ohm, 150V, 1% +/-Tol, -200,200ppm/Cel, 0805, 292-3.0M-RC 0 Build or Request
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