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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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3-794638-4
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Vertical | Number of Power Positions 4 | Number of Positions 4 | Contact Features: Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 MICM | Multiple Contact Types Without | Contact Current Rating (Max) 5 A | Other | 3-794638-4 |
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LTM4638EY#PBF
Analog Devices
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1 | 20VIN, 15A Step-Down DC/DC µModule Regulator | BGA | LTM4638EY#PBF |
3
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78446-3822
Molex
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1 | High Speed / Modular Connectors Impact Pwr5Pr VT Hdr PF 0.76AuLF 4Ckt | Other | 78446-3822 |
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LTM4638IY
Analog Devices
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1 | 20VIN, 15A Step-Down DC/DC µModule Regulator | BGA | LTM4638IY |
3
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5-794638-0
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 20 | Number of Rows 2 | Number of Power Positions 20 | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 MICM | Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Dimensions: Wire S | Other | 5-794638-0 |
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MAX4638EUE+T
Analog Devices
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1 | 3.5Ω, Single 8:1 and Dual 4:1, Low-Voltage Analog Multiplexers | Small Outline Packages | MAX4638EUE+T |
3
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8046382
RS Pro
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1 | RS Pro Thick Film Surface Mount Resistor 0805 Case 220Ω ±1% 0.125W ±100ppm/°C | Resistor Chip | 8046382 |
3
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1146380000
Weidmüller
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1 | PCB connector (board connection), 320 V, 24 A, Pitch in mm: 5.08, Number of poles: 4, THT solder connection, Box | Header, Shrouded - Straight PTH Box | 1146380000 |
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4-794638-4
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Power Positions 14 | PCB Mount Orientation Vertical | Number of Positions 14 | Contact Features: PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Type Pin | Contact Mating Area Plating Material Gold | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Thicknes | Other | 4-794638-4 |
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MAX4638ETE+T
Analog Devices
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1 | 3.5Ω, Single 8:1 and Dual 4:1, Low-Voltage Analog Multiplexers,-40°C to +85°C +1.8V to +5.5V | Quad Flat No-Lead | MAX4638ETE+T |
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4-794638-0
TE Connectivity
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1 | Configuration Features: Number of Positions 10 | PCB Mount Orientation Vertical | Number of Power Positions 10 | Number of Rows 2 | Contact Features: PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material Thickness 150 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Mating Area P | Other | 4-794638-0 |
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1846386
Phoenix Contact
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1 | MDSTB 2,5/ 4-G - PCB headers, nominal cross section: 2.5 mm2, color: green, nominal current: 10 A, rated voltage (III/2): 320 V, contact surface: Sn, contact connection type: Pin, number of potentials: 8, number of rows: 2, number of positions: 4, number of connections: 8, product range: MDSTB 2,5/..-G, pitch: 5 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.23 mm, number of solder pins per potential: 1, plug-in system: COMBICON MSTB 2,5, Pin connector pattern alignme | Other | 1846386 |
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TSOP94638
Vishay
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1 | Remote Receiver Sensor 38.0kHz 35m Through Hole | Other | TSOP94638 |
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TSOP14638
Vishay
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1 | Infrared Receivers Mold AGC6 38kHz 2.5-5.5V | Other | TSOP14638 |
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MAX4638ESE+T
Analog Devices
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1 | 3.5Ω, Single 8:1 and Dual 4:1, Low-Voltage Analog Multiplexers | Small Outline Packages | MAX4638ESE+T |
3
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MAX4638ETE+
Analog Devices
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1 | 3.5Ω, Single 8:1 and Dual 4:1, Low-Voltage Analog Multiplexers | Quad Flat No-Lead | MAX4638ETE+ |
3
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45984-6383
Molex
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1 | 1.27mm, 12.00mm Pitch, EXTreme LPHPower Receptacle Header, Right-Angle, 6 Power Contacts, 40 Signal Contacts, Select Gold (Au) Plating, for 1.57mm Thick PC Board, with Press-fit Plastic Pegs | Other | 45984-6383 |
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MAX4638EUE+
Analog Devices
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1 | 3.5Ω, Single 8:1 and Dual 4:1, Low-Voltage Analog Multiplexers | Small Outline Packages | MAX4638EUE+ |
3
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4-794638-6
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Power Positions 16 | PCB Mount Orientation Vertical | Number of Positions 16 | Contact Features: PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Type Pin | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Retention Within Housing Without | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | PCB Contact Termination Area Plating Material Tin | Contact Current Ratin | Other | 4-794638-6 |
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45984-6382
Molex
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1 | 1.27mm, 12.00mm Pitch, EXTreme LPHPower Receptacle Header, Right-Angle, 6 Power Contacts, 40 Signal Contacts, Select Gold (Au) Plating, for 2.36mm Thick PC Board, with Press-fit Plastic Pegs | Other | 45984-6382 |
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3-794638-8
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Vertical | Number of Positions 8 | Number of Power Positions 8 | Contact Features: Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Type Pin | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating M | Other | 3-794638-8 |
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5-794638-4
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Positions 24 | PCB Mount Orientation Vertical | Number of Power Positions 24 | Contact Features: PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | Contact Type Pin | Contact Mating Area Plating Material Thickness 30 MICIN | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | Cont | Other | 5-794638-4 |
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1-794638-0
TE Connectivity
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1 | Pin & Socket Connectors HDR ASSY 10 POS 30AU VERT SMT | Other | 1-794638-0 |
3
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ADA4638-1ACPZ-R7
Analog Devices
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1 | 30V Auto-zero, Rail-to-Rail Output Precision Amplifier | Small Outline No-lead | ADA4638-1ACPZ-R7 |
3
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LTM4638IY#PBF
Analog Devices
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1 | 20VIN, 15A Step-Down DC/DC µModule Regulator Wide Input Voltage Range: 3.1V to 20V 0.6V to 5.5V Output Voltage | BGA | LTM4638IY#PBF |
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