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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action |
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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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THS4509RGTRG4
Texas Instruments
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1 | SP Amp DIFF AMP Single ±2.625V/5.25V 16-Pin VQFN EP T/R | Quad Flat No-Lead | THS4509RGTRG4 |
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2-1445093-5
TE Connectivity
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1 | Configuration Features: Number of Positions 5 | Number of Rows 1 | Number of Power Positions 5 | PCB Mount Orientation Vertical | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Type Pin | Contact Mating Area Plating Material Thickness 30 MICIN | Cont | Other | 2-1445093-5 |
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TSW-145-09-G-S
SAMTEC
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1 | 45 Position, Single Row, Classic PCB Header Strips, 0.100" pitch | Other | TSW-145-09-G-S |
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TSW-145-09-LM-D
SAMTEC
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1 | 90 Position, Classic PCB Header Strips, 0.100" pitch | Other | TSW-145-09-LM-D |
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TSW-145-09-TM-D
SAMTEC
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1 | 90 Position, Classic PCB Header Strips, 0.100" pitch | Other | TSW-145-09-TM-D |
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0430450925
Molex
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1 | Micro-Fit 3.0 Vertical Header, 3.00mm Pitch, Dual Row, 8 Circuits, with PCB Polarizing Peg, 1.52µm Matte Tin Plating, Glow-Wire Capable, Black, Tape and Reel, with Pick and Place Cap | Other | 0430450925 |
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TSW-145-09-SM-S
SAMTEC
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1 | 45 Position, Single Row, Classic PCB Header Strips, 0.100" pitch | Other | TSW-145-09-SM-S |
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THS4509RGTT
Texas Instruments
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1 | 1.9-GHz, Wideband, Low-Noise, Low-Distortion, Fully-Differential Amplifier | Quad Flat No-Lead | THS4509RGTT |
3
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5045-09A
Molex
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1 | Molex 5045, 2.5mm Pitch, 9 Way, 1 Row, Straight PCB Header, Through Hole | Other | 5045-09A |
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234-509
Wago
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1 | PCB terminal block; push-button; 0.5 mm²; Pin spacing 2.54 mm; 9-pole; CAGE CLAMP® | Other | 234-509 |
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2-1445098-8
TE Connectivity
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1 | Connector Header Through Hole, Right Angle 8 position 0.118" (3.00mm) | Other | 2-1445098-8 |
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2-1445099-3
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Positions 3 | Number of Power Positions 3 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness .76 MI | Other | 2-1445099-3 |
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TSW-145-09-TL-S
SAMTEC
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1 | 45 Position, Single Row, Classic PCB Header Strips, 0.100" pitch | Other | TSW-145-09-TL-S |
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TSW-145-09-TM-S
SAMTEC
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1 | 45 Position, Single Row, Classic PCB Header Strips, 0.100" pitch | Other | TSW-145-09-TM-S |
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2-1445099-4
TE Connectivity
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1 | Configuration Features: Number of Positions 4 | Number of Rows 1 | Number of Power Positions 4 | PCB Mount Orientation Right Angle | Contact Features: Contact Retention Within Housing Without | Contact Type Pin | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plati | Other | 2-1445099-4 |
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2-1445093-8
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Positions 8 | PCB Mount Orientation Vertical | Number of Power Positions 8 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold | Contact Layout Inline | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Ter | Other | 2-1445093-8 |
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TSW-145-09-F-D
SAMTEC
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1 | 90 Position, Classic PCB Header Strips, 0.100" pitch | Other | TSW-145-09-F-D |
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2-1445091-2
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Power Positions 2 | PCB Mount Orientation Right Angle | Number of Positions 2 | Contact Features: Contact Retention Within Housing Without | Contact Type Pin | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .38 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 2.5 | Other | 2-1445091-2 |
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2-1445093-3
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Positions 3 | PCB Mount Orientation Vertical | Number of Power Positions 3 | Contact Features: Contact Mating Area Plating Material Gold | Contact Retention Within Housing Without | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 30 MICIN | Contact | Other | 2-1445093-3 |
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2-1445098-3
TE Connectivity
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1 | Configuration Features: Number of Power Positions 3 | PCB Mount Orientation Right Angle | Number of Positions 3 | Number of Rows 1 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Multiple Contact Types Without | Contact Mating Area Plating Material Gold | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Type P | Other | 2-1445098-3 |
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0541045096
Molex
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1 | Easy-On FFC/FPC Connector, 0.50mm Pitch, Slider Series, Right-Angle, Top Contact, 2.00mm Height, 50 Circuits, Tin-Bismuth Plating | Other | 0541045096 |
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734-509
Wago
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1 | THT female header; straight; Pin spacing 3.81 mm; 9-pole; 100% protected against mismating; 0.9 x 0.9 mm solder pin | Other | 734-509 |
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TSW-145-09-H-D
SAMTEC
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1 | 90 Position, Classic PCB Header Strips, 0.100" pitch | Other | TSW-145-09-H-D |
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2-1445096-6
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 6 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Gold (Au), Surface Mount, Power, Micro MATE-N-LOK | Other | 2-1445096-6 |
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2-1445091-3
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Power Positions 3 | Number of Positions 3 | Number of Rows 1 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Type Pin | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .38 MICM | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thic | Other | 2-1445091-3 |
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