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SKY85747-11
Skyworks
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1 | Skyworks 5 GHz High-Power WLAN LGA, 24-pin | Other | SKY85747-11 |
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1757475
Phoenix Contact
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1 | MSTBA 2,5/ 2-G - PCB headers, nominal cross section: 2.5 mm2, color: green, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Sn, contact connection type: Pin, number of potentials: 2, number of rows: 1, number of positions: 2, number of connections: 2, product range: MSTBA 2,5/..-G, pitch: 5 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.23 mm, number of solder pins per potential: 1, plug-in system: COMBICON MSTB 2,5, Pin connector pattern alignme | Other | 1757475 |
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235-747
Wago
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1 | Stackable PCB terminal block; 2.5 mm²; Pin spacing 5/5.08 mm; 1-pole; PUSH WIRE® | Other | 235-747 |
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257-474
Wago
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1 | PCB terminal block; push-button; 2.5 mm²; Pin spacing 5/5.08 mm; 24-pole; CAGE CLAMP®; commoning option | Other | 257-474 |
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235-747/331-000
Wago
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1 | Stackable PCB terminal block; push-button; 1.5 mm²; Pin spacing 5/5.08 mm; 1-pole; Push-in CAGE CLAMP® | Other | 235-747/331-000 |
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1-5747871-6
TE Connectivity
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1 | TE Connectivity AMPLIMITE HD-20 Series 2.743mm Pitch 9 Way Straight PCB D-sub Connector, Plug | Other | 1-5747871-6 |
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MAL219357471E3
Vishay
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1 | 470 µF 450 V Aluminum Electrolytic Capacitors Radial, Can - Snap-In 180mOhm @ 100Hz 5000 Hrs , -40°C ~ 105°C | Other | MAL219357471E3 |
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255-747
Wago
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1 | Stackable PCB terminal block; push-button; 2.5 mm²; Pin spacing 5/5.08 mm; 1-pole; CAGE CLAMP®; commoning option | Other | 255-747 |
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MAL215957471E3
Vishay
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1 | Vishay 470μF ±20% 210mΩ 450 V dc Through Hole Snap-In Aluminium Electrolytic Capacitor | Other | MAL215957471E3 |
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MAL205157472E3
Vishay
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1 | 4700 µF 40 V Aluminum Electrolytic Capacitors Radial, Can - 3 Lead 62mOhm @ 100Hz 12000 Hrs @ 85°C | Other | MAL205157472E3 |
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5747840-3
TE Connectivity
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1 | Body Features: Connector Profile Standard | Assembly Process Feature Material Copper Alloy | Primary Product Color Black | Insert Material Zinc | Shell Plating Material Tin | Mating Retention Feature Material Zinc | Configuration Features: Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Positions 9 | Contact Features: Contact Base Material Brass | Contact Current Rating (Max) 6 AMP | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold Flash | | Other | 5747840-3 |
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5747847-6
TE Connectivity
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1 | Body Features: Mating Feature Material Zinc | Assembly Process Feature Material Copper Alloy | Shell Plating Material Tin over Copper | Connector Profile Standard | Primary Product Color Black | Mating Feature Plating Material Clear Chromate | Configuration Features: Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Positions 37 | Contact Features: Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | Contact Base Material Phosphor Bronze | Contact Ma | Other | 5747847-6 |
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5747846-6
TE Connectivity
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1 | Body Features: Shell Plating Material Tin | Insert Material Zinc | Connector Profile Standard | Primary Product Color Black | Mating Feature Material Zinc | Mating Feature Plating Material Clear Chromate | Assembly Process Feature Material Brass | Configuration Features: Number of Positions 25 | Number of Rows 2 | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Gold | Contact Shape & Form Round | PCB Contact Termination Area Plating Material Tin | Contact Base Mate | Other | 5747846-6 |
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1825747
Phoenix Contact
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1 | ICV 2,5/ 7-GF-5,08 - PCB headers, nominal cross section: 2.5 mm2, color: green, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Sn, contact connection type: Socket, number of potentials: 7, number of rows: 1, number of positions: 7, number of connections: 7, product range: ICV 2,5/..-GF, pitch: 5.08 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.6 mm, number of solder pins per potential: 2, plug-in system: COMBICON MSTB 2,5, Pin connector pattern | Other | 1825747 |
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5747846-5
TE Connectivity
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1 | Body Features: Shell Plating Material Tin | Insert Material Zinc | Mating Feature Material Zinc | Assembly Process Feature Material Brass | Connector Profile Standard | Primary Product Color Black | Mating Feature Plating Material Clear Chromate | Configuration Features: Number of Rows 2 | Number of Positions 25 | PCB Mount Orientation Right Angle | Contact Features: Contact Current Rating (Max) 6 AMP | Contact Shape & Form Round | PCB Contact Termination Area Plating Material Tin | Contact Base Material Ph | Other | 5747846-5 |
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5747150-7
TE Connectivity
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1 | Body Features: Shell Plating Material Tin | Mating Retention Feature Material Brass | Insert Material Brass | Primary Product Color Black | Connector Profile Standard | Configuration Features: Number of Rows 2 | PCB Mount Orientation Vertical | Number of Positions 9 | Contact Features: Contact Shape & Form Round | Contact Current Rating (Max) 6 AMP | Contact Mating Area Plating Material Gold Flash | Contact Underplating Material Nickel | PCB Contact Termination Area Plating Material Tin | Contact Base Mater | Other | 5747150-7 |
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5747250-4
TE Connectivity
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1 | Body Features: Mating Retention Feature Material Zinc | Shell Plating Material Tin over Copper | Connector Profile Standard | Primary Product Color Black | Configuration Features: Number of Positions 9 | PCB Mount Orientation Right Angle | Number of Rows 2 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold | Contact Base Material Brass | Contact Current Rating (Max) 6 AMP | Contact Underplating Material Nickel | Contact Mating Area Plating Mater | Other | 5747250-4 |
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B57471V2333J062
TDK
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1 | Chip NTC Thermistors (Sensor), Resistance (at 25?C)=33k?, Resistance Tolerance (at 25?C)=?3% | Thermistors Chip | B57471V2333J062 |
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5747871-2
TE Connectivity
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1 | Body Features: Primary Product Color Black | Connector Profile Standard | Shell Plating Material Tin | Configuration Features: Number of Positions 9 | PCB Mount Orientation Vertical | Number of Rows 2 | Contact Features: Contact Base Material Brass | Contact Shape & Form Round | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 6 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold | Di | Other | 5747871-2 |
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5747252-4
TE Connectivity
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1 | Body Features: Primary Product Color Black | Mating Retention Feature Material Zinc | Shell Plating Material Tin over Copper | Connector Profile Standard | Insert Material Zinc | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 2 | Number of Positions 37 | Contact Features: Contact Shape & Form Round | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold | Contact Underplating Material Nickel | Contact Base Material Brass | Contact Cur | Other | 5747252-4 |
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5747841-4
TE Connectivity
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1 | Body Features: Mating Retention Feature Material Zinc | Primary Product Color Black | Insert Material Zinc | Assembly Process Feature Material Copper Alloy | Shell Plating Material Tin | Connector Profile Standard | Configuration Features: Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Positions 15 | Contact Features: Contact Shape & Form Round | PCB Contact Termination Area Plating Material Tin | Contact Base Material Brass | Contact Underplating Material Palladium Nickel | Contact Mating | Other | 5747841-4 |
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5747845-3
TE Connectivity
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1 | Body Features: Connector Profile Standard | Mating Retention Feature Material Zinc | Assembly Process Feature Material Copper Alloy | Primary Product Color Black | Insert Material Zinc | Shell Plating Material Tin | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 2 | Number of Positions 15 | Contact Features: Contact Mating Area Plating Material Gold Flash | Contact Current Rating (Max) 6 AMP | PCB Contact Termination Area Plating Material Tin | Contact Shape & Form Round | Contac | Other | 5747845-3 |
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5747845-4
TE Connectivity
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1 | Body Features: Shell Plating Material Tin | Mating Retention Feature Material Zinc | Connector Profile Standard | Assembly Process Feature Material Copper Alloy | Insert Material Zinc | Primary Product Color Black | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 15 | Number of Rows 2 | Contact Features: Contact Shape & Form Round | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 6 AMP | Other | 5747845-4 |
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5747834-6
TE Connectivity
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1 | Body Features: Insert Material Zinc | Connector Profile Standard | Mating Retention Feature Material Zinc | Assembly Process Feature Material Copper Alloy | Primary Product Color Black | Shell Plating Material Tin | Configuration Features: Number of Rows 2 | Number of Positions 25 | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 6 AMP | Contact | Other | 5747834-6 |
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5747833-6
TE Connectivity
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1 | Body Features: Insert Material Zinc | Mating Feature Plating Material Clear Chromate | Primary Product Color Black | Assembly Process Feature Material Copper Alloy | Shell Plating Material Tin | Mating Feature Material Zinc | Connector Profile Standard | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 2 | Number of Positions 15 | Contact Features: Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Shape & Form Rou | Other | 5747833-6 |
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