627-8 Model Download Search Results
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TD62783APG
Toshiba
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1 | 8 ch High-Voltage Source Driver | Other | TD62783APG |
2
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TBD62783AFNG(Z)
Toshiba
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1 | Toshiba TBD62783AFNG(Z) 8 Power Switch IC 18-Pin, SSOP | Small Outline Packages | TBD62783AFNG(Z) |
3
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TBD62789APG
Toshiba
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1 | • Built-in 8 circuits• High output voltage : VOUT = 50 V (max)• High output current : IOUT = 500 mA/ch (max)• Package : DIP20-P-300-2.54A | Dual-In-Line Packages | TBD62789APG |
3
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TBD62785AFWG(Z,EHZ
Toshiba
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1 | Peripheral Driver, 50 V /-0.5 A out, 8 Outputs, PSOP, -40 °C to 85 °C | Small Outline Packages | TBD62785AFWG(Z,EHZ |
3
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3-794627-8
TE Connectivity
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1 | Configuration Features: Number of Positions 8 | Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Power Positions 8 | Contact Features: Multiple Contact Types Without | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | | Other | 3-794627-8 |
3
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TBD62785AFWG
Toshiba
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1 | 8 circuits built-in• High output voltage: VOUT = 50 V (max)• Large output current: IOUT = -500 mA (max, per 1 ch)• Input voltage (Output on): 0 to VCC-3.5 V• Input voltage (Output off): VCC-0.4 V to VCC• Package: PG type P-DIP18-300-2.54-001 FWG type P-SOP18-0812-1.27-001 | Small Outline Packages | TBD62785AFWG |
3
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TBD62783AFNG,EL
Toshiba
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1 | Gate Drivers DMOS Transistor Array 7-CH, 50V/0.5A | Small Outline Packages | TBD62783AFNG,EL |
3
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TBD62783AFWG(Z,EHZ
Toshiba
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1 | TBD62783AFWG(Z,EHZ,DMOS Transistor Array | Small Outline Packages | TBD62783AFWG(Z,EHZ |
3
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TD62783AF(S)
Toshiba
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1 | IC DRIVER DARL SOURCE 8CH 18-SOP | Small Outline Packages | TD62783AF(S) |
3
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TBD62781AFWG,EL
Toshiba
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1 | Gate Drivers DMOS Transistor Array 8-CH 50V -0.5A | Small Outline Packages | TBD62781AFWG,EL |
3
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IK62783DT
IKSEMICON
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1 | 50V 500mA SOP-18-300mil Bipolar Transistor Arrays RoHS | Small Outline Packages | IK62783DT |
3
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TBD62783AFWG,EL
Toshiba
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1 | Gate Drivers DMOS Transistor Array 8-CH, 50V/0.5A | Small Outline Packages | TBD62783AFWG,EL |
3
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09661627811
HARTING
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1 | D-Sub 9pin male angled 2.54mm pitch, turned, with board locks, M3, PL3 | Other | 09661627811 |
3
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09654627812
HARTING
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1 | D-Sub 37pin male angled 2.54mm pitch, stamped, with board locks, 4-40UNC, PL3 | Other | 09654627812 |
3
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09652627812
HARTING
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1 | D-Sub 15pin male angled 2.54mm pitch, stamped, with board locks, 4-40UNC, PL3 | Other | 09652627812 |
3
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09653627816
HARTING
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1 | D-Sub 25pin male low profile angled, 2.54mm pitch, stamped, with board locks, 4-40UNC, PL3 | Other | 09653627816 |
3
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09563627813
HARTING
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1 | High Density D-Sub 44pin angled male with board locks, PL3, 4-40UNC screw lock | Other | 09563627813 |
3
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B41888C6278M003
TDK
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1 | Aluminum electrolytic capacitor, Single-ended, Long Useful Life - 105 °C,2700uF,50v | Capacitor, Polarized Radial Diameter | B41888C6278M003 |
3
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SLY8SMD06278G
Fischer Elektronik GmbH & Co. KG
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1 | Dual Row, SMD, Male, Pitch 2 x 2mm, 78 Position | Other | SLY8SMD06278G |
3
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B41897A6278M004
TDK
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1 | Aluminum electrolytic capacitor, Single-ended, Low ESR, ultra compact - 135 °C,2700uF,50V | Capacitor, Polarized Radial Diameter | B41897A6278M004 |
3
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09663627811
HARTING
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1 | D-Sub 25pin male angled 2.54mm pitch, turned, with board locks, M3, PL3 | Other | 09663627811 |
3
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09664627815
HARTING
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1 | D-Sub 37pin male low profile angled, 2.54mm pitch, turned, with board locks, M3, PL3 | Other | 09664627815 |
3
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B41252A6278M062
TDK
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1 | Snap-in Capacitors, 2700??F/50VDC, 22mm dia x 30mm length | Other | B41252A6278M062 |
3
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09663627812
HARTING
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1 | D-Sub 25pin male angled 2.54mm pitch, turned, with board locks, 4-40UNC, PL3 | Other | 09663627812 |
3
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Download Model | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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5-146278-3
TE Connectivity
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1 | Body Features: Connector Profile Standard | Primary Product Color Black | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 1 | Board-to-Board Configuration Parallel | Number of Positions 3 | Connector Contact Load Condition Fully Loaded | Contact Features: Contact Mating Area Plating Material Thickness 100 – 200 MICIN | PCB Contact Termination Area Plating Material Thickness 100 – 200 MICIN | Contact Mating Area Plating Material Thickness 2.54 – 5.08 MICM | Contact Mating Area P | Other | 5-146278-3 |
3
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![Part Image](["//media.rs-online.com/t_large/F7965311-01.tif",null,"//content.supplyframe.com/images/process/fit-in/100x100/p/dip_18.jpg"])
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![Part Image](["https://toshiba.semicon-storage.com/content/dam/toshiba-ss-v3/master/en/semiconductor/design-development/package-detail/Pkg_img/DIP20.png","https://toshiba.semicon-storage.com/content/dam/toshiba-ss-v3/master/en/semiconductor/design-development/package-detail/Pkg_img/DIP20.png",null])
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