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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action |
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1 | THR PCB terminal block; 2.5 mm²; Pin spacing 5 mm; 5-pole; CAGE CLAMP®; in tape-and-reel packaging; commoning option | Other | 236-405/334-604/997-406 |
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236-405/334-604
Wago
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1 | THR PCB terminal block; 2.5 mm²; Pin spacing 5 mm; 5-pole; CAGE CLAMP®; commoning option | Other | 236-405/334-604 |
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640506-3
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 36 | Number of Columns 4 | Number of Rows 9 | Number of Signal Positions 36 | Number of Power Positions 0 | Contact Features: Contact Layout Inline | Contact Retention Within Housing With | Contact Mating Area Plating Material Thickness 79 MICIN | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 2 MICM | PCB Contact Termination Area Plating Material Tin | | Other | 640506-3 |
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1864053
Phoenix Contact
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1 | SDC 2,5/ 4-PV-5,0-ZB - PCB direct plug, nominal cross section: 2.5 mm2, color: green, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Sn, number of potentials: 4, number of rows: 1, number of positions: 4, number of connections: 4, product range: SDC 2,5/..-PV, pitch: 5 mm, connection method: Push-in spring connection, mounting: SKEDD - Direct plug-in technology, conductor/PCB connection direction: 90 °, pin layout: Zigzag pinning W, solder pin [P]: 5 mm, plug-in system: SKE | Other | 1864053 |
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640503-1
TE Connectivity
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1 | Configuration Features: Number of Power Positions 0 | Number of Positions 15 | Number of Columns 3 | Number of Rows 5 | Number of Signal Positions 15 | PCB Mount Orientation Vertical | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 2 MICM | Contact Mating Area Plating Material Tin | Contact Retention Within Housing With | Contact Layout Inline | Contact Type Pin | Contact Mating Area Plating Material Thickness 79 MICIN | PCB Contact Termination Area Pla | Other | 640503-1 |
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640506-1
TE Connectivity
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1 | Configuration Features: Number of Positions 36 | PCB Mount Orientation Vertical | Number of Power Positions 0 | Number of Rows 9 | Number of Columns 4 | Number of Signal Positions 36 | Contact Features: Contact Retention Within Housing With | Contact Mating Area Plating Material Thickness 2 MICM | Contact Mating Area Plating Material Thickness 79 MICIN | Contact Current Rating (Max) 5 AMP | Contact Layout Inline | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Pla | Other | 640506-1 |
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1836405
Phoenix Contact
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1 | CCA 2,5/ 8-G P20 THR - PCB headers, nominal cross section: 2.5 mm2, color: black, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Sn, contact connection type: Pin, number of potentials: 8, number of rows: 1, number of positions: 8, number of connections: 8, product range: CCA 2,5/..-G, pitch: 5 mm, mounting: THR soldering / wave soldering, pin layout: Linear pinning, solder pin [P]: 2 mm, number of solder pins per potential: 1, plug-in system: COMBICON MSTB 2,5, Pin connecto | Other | 1836405 |
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640502-1
TE Connectivity
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1 | Configuration Features: Number of Columns 3 | Number of Signal Positions 12 | PCB Mount Orientation Vertical | Number of Positions 12 | Number of Rows 4 | Number of Power Positions 0 | Contact Features: Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2 MICM | Contact Type Pin | Contact Retention Within Housing With | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 79 MICIN | Cont | Other | 640502-1 |
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2-640502-4
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 4 | Number of Power Positions 0 | Number of Columns 3 | Number of Positions 12 | Number of Signal Positions 12 | Contact Features: PCB Contact Termination Area Plating Material Thickness 30 MICIN | Contact Underplating Material Thickness 1.27 MICM | Contact Retention Within Housing With | Contact Type Pin | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thick | Other | 2-640502-4 |
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256-405
Wago
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1 | PCB terminal block; push-button; 2.5 mm²; Pin spacing 5/5.08 mm; 5-pole; CAGE CLAMP®; commoning option | Other | 256-405 |
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1 | PCB terminal block; push-button; 2.5 mm²; Pin spacing 5/5.08 mm; 5-pole; suitable for Ex-e applications; CAGE CLAMP®; commoning option; Solder pin length 5.5 mm | Other | 256-405/332-009/999-950 |
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256-405/333-000
Wago
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1 | PCB terminal block; finger-operated levers; 2.5 mm²; Pin spacing 5/5.08 mm; 5-pole; CAGE CLAMP®; commoning option | Other | 256-405/333-000 |
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1 | PCB terminal block; push-button; 2.5 mm²; Pin spacing 5/5.08 mm; 5-pole; suitable for Ex-e applications; CAGE CLAMP®; commoning option | Other | 256-405/000-009/999-950 |
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DMC-264050R
Panasonic
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1 | DMC264050R, Dual Digital Transistor, NPN 100 MA 50 V Ratio Of 10 kΩ, Common Base, 6-Pin Mini6 G4 B | SOT23 (6-Pin) | DMC-264050R |
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BAR64-05WH6327
Infineon
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1 | Silicon PIN Diode 150V SOT323 Infineon BAR64-05WH6327 Dual Common Cathode PIN Diode, 100mA, 150V, 3-Pin SOT-323 | SOT23 (3-Pin) | BAR64-05WH6327 |
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DMA-264050R
Panasonic
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1 | DMA264050R, Dual Digital Transistor, PNP -100 mA -50 V Ratio Of 10 kΩ, 6-Pin Mini6 G4 B | SOT23 (6-Pin) | DMA-264050R |
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435640-5
TE Connectivity
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1 | DIP Switches / SIP Switches 8 POS TOP RCKR UNSLD | Other | 435640-5 |
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68016-405HLF
Amphenol
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1 | BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single Row, Positions, 2.54 mm (0.100) Pitch. | Other | 68016-405HLF |
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B32669S6405K504
TDK
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1 | Metallized Polypropylene Film Capacitors (MKP) | Capacitors, Polarized Axial Diameter Horizontal Mounting | B32669S6405K504 |
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640500-1
TE Connectivity
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1 | Configuration Features: Number of Columns 2 | Number of Positions 6 | PCB Mount Orientation Vertical | Number of Rows 3 | Number of Signal Positions 6 | Number of Power Positions 0 | Contact Features: Contact Current Rating (Max) 6 AMP | Contact Layout Inline | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Retention Within Housing With | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 79 MICIN | Contact Mating Area Plating Material T | Other | 640500-1 |
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B32669S6405J504
TDK
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1 | Metallized Polypropylene Film Capacitors (MKP) | Capacitors, Polarized Axial Diameter Horizontal Mounting | B32669S6405J504 |
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B32669B6405K000
TDK
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1 | Metallized Polypropylene Film Capacitors (MKP) | Capacitors, Polarized Axial Diameter Horizontal Mounting | B32669B6405K000 |
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LTC6405IMS8E#PBF
Analog Devices
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1 | LINEAR TECHNOLOGY - LTC6405IMS8E#PBF - Differential Amplifier, Low Noise, 1 Amplifiers, 6 mV, 1 dB, 2.7 GHz, -40 °C, 85 °C | Small Outline Packages | LTC6405IMS8E#PBF |
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BAR6405WE6327XT
Infineon
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1 | RF Diode PIN - 1 Pair Common Cathode 150V 100 mA 250 mW SOT-323 | SOT23 (3-Pin) | BAR6405WE6327XT |
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LTC6405CMS8E#TRPBF
Analog Devices
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1 | High Speed Operational Amplifiers 2.7GHz, 5V Low Noise, Rail-to-Rail Input Differential Amp/Driver | Small Outline Packages | LTC6405CMS8E#TRPBF |
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