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1-178313-2
TE Connectivity
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1 | Header vert 3 way TAB 3.81mm X key D-3 | Other | 1-178313-2 |
3
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TLV2783IDGSG4
Texas Instruments
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1 | TLV2783IDGSG4 Texas Instruments, Op Amp, 8MHz, 3 V, 10-Pin MSOP | Small Outline Packages | TLV2783IDGSG4 |
3
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P783F-Q24-S9-S
CUI Inc.
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1 | Non-Isolated DC/DC Converters 9 Vdc, 3 A, 27 W, 13~36 Vdc Input Range | Other | P783F-Q24-S9-S |
3
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MSP430F4783IPZR
Texas Instruments
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1 | 16-Bit Ultra-Low-Power Microcontroller, 48KB Flash, 2KB RAM, 3 Sigma-Delta ADCs, LCD Driver | Quad Flat Packages | MSP430F4783IPZR |
3
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10018783-10200TLF
Amphenol
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1 | PCI Express / PCI Connectors PCI Express GEN 3 Card Edge conn Vertical Through Hole 36 Positions 100mm Pitch | Other | 10018783-10200TLF |
2
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P783F-Q24-S3-S
CUI Inc.
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1 | Non-Isolated DC/DC Converters 3.3 Vdc, 3 A, 10 W, 8 36 Vdc Input Range | Other | P783F-Q24-S3-S |
3
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P783-Q24-S12-S
CUI Inc.
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1 | Non-Isolated DC/DC Converters dc-dc non-isolated, 3 A, 16 36 Vdc input, 12 Vdc output, SIP | Other | P783-Q24-S12-S |
3
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P783-Q24-S5-S
CUI Inc.
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1 | Non-Isolated DC/DC Converters 5 Vdc, 3 A, 15 W, 8~36 Vdc Input Range | Other | P783-Q24-S5-S |
3
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LTC3783EDHD#PBF
Analog Devices
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1 | Linear Technology LTC3783EDHD#PBF, LED Display Driver, 3 → 36 V, 16-Pin DFN | Small Outline No-lead | LTC3783EDHD#PBF |
3
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10018783-11210TLF
Amphenol Communications Solutions
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1 | PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Through Hole, x1, 36 Positions, 1.00mm (0.039in) Pitch | Other | 10018783-11210TLF |
3
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10018783-10111TLF
Amphenol
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1 | PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Through Hole, x4, 64 Positions, 1.00mm (0.039in) Pitch | Other | 10018783-10111TLF |
3
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P783-Q24-S3-S
CUI Inc.
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1 | Non-Isolated DC/DC Converters dc-dc non-isolated, 3 A, 8~36 Vdc input, 3.3 Vdc output, SIP NON-ISOLATED SWITCHING REGULATOR | Other | P783-Q24-S3-S |
3
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10018783-10101TLF
Amphenol
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1 | PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Through Hole, x4, 64 Positions, 1.00mm (0.039in) Pitch | Other | 10018783-10101TLF |
2
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NLAS4783BMN1R2G
onsemi
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1 | ON SEMICONDUCTOR - NLAS4783BMN1R2G - Analogue Switch, 3 Channels, SPDT, 1.2 ohm, 1.65V to 4.5V, QFN, 16 Pins | Quad Flat No-Lead | NLAS4783BMN1R2G |
3
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10018783-10000TLF
Amphenol
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1 | PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Through Hole, x1, 36 Positions, 1.00mm (0.039in) Pitch | Other | 10018783-10000TLF |
3
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10018783-10212TLF
Amphenol
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1 | PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Through Hole, x8, 98 Positions, 1.00mm (0.039in) Pitch | Other | 10018783-10212TLF |
2
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10018783-10011TLF
Amphenol Communications Solutions
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1 | PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Through Hole, x4, 64 Positions, 1.00mm (0.039in) Pitch | Other | 10018783-10011TLF |
3
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P783F-Q24-S12-S
CUI Inc.
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1 | Non-Isolated DC/DC Converters dc-dc non-isolated, 3 A, 16 36 Vdc input, 12 Vdc output, SIP, open frame | Other | P783F-Q24-S12-S |
3
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P783F-Q24-S5-S
CUI Inc.
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1 | Non-Isolated DC/DC Converters dc-dc non-isolated, 3 A, 8 36 Vdc input, 5 Vdc output, SIP, open frame | Other | P783F-Q24-S5-S |
3
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10018783-10200TLF
Amphenol Communications Solutions
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1 | PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Through Hole, x1, 36 Positions, 1.00mm (0.039in) Pitch | Other | 10018783-10200TLF |
3
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10018783-10002MLF
Amphenol Communications Solutions
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1 | PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Through Hole, x8, 98 Positions, 1.00mm (0.039in) Pitch | Other | 10018783-10002MLF |
3
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2342078-3
TE Connectivity
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1 | Header, Wire-to-Board, 3 Position, 3.81 mm [.15 in] Centerline, 1 Row, Operating Voltage 300 VAC, Printed Circuit Board, PCB Terminal Blocks | Other | 2342078-3 |
3
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MAX14783EATA+T
Analog Devices
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1 | MAXIM INTEGRATED PRODUCTS - MAX14783EATA+T - Transceiver, RS422, RS485, Half Duplex, 42Mbp, 1 Driver, 3 V to 5.5 V Supply, TDFN-8 | Small Outline No-lead | MAX14783EATA+T |
3
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2-178313-3
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Rows 1 | Number of Positions 3 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 MICM | Contact Type Pin | Housing Features: Centerline (Pitch) .15 INCH | Centerline (Pitch) 3.81 MM | Housing Material Polyester GF | Industry Standards: UL | Other | 2-178313-3 |
3
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10018783-10002MLF
Amphenol
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1 | PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Through Hole, x8, 98 Positions, 1.00mm (0.039in) Pitch | Other | 10018783-10002MLF |
2
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![Part Image](["https://componentsearchengine.com/Images/9/1-178313-2.jpg",null,null])
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