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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action |
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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MBRM140T3
Rochester Electronics
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1 | • Small Footprint − Footprint Area of 8.45 mm2 | Other | MBRM140T3 |
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BRM1553D
SITAL TECHNOLOGY
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1 | HARDWARE KEY LICENSE, SOT23 | SOT23 (3-Pin) | BRM1553D |
2
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MBRM120LT3G
onsemi
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1 | NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; Low Profile - Maximum Height of 1.1 mm; Small Footprint - Footprint Area of 8.45 mm2; Low VF Provides Higher Efficiency and Extends Battery Life; Supplied in 12 mm Tape and Reel; Low Thermal Resistance with Direct Thermal Path of Die on Exposed Cathode Heat Sink Mechanical Characteristics:; Powermite is JEDEC Registered as DO-216AA; Case: Molded Epoxy; Powermite is JEDEC Registered as DO-216AA; Weight: 6 | Other | MBRM120LT3G |
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MBRM130LT3G
onsemi
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1 | Low Profile - Maximum Height of 1.1 mm; Small Footprint - Footprint Area of 8.45 mm2; Low VF Provides Higher Efficiency and Extends battery Life; Supplied in 12 mm Tape and Reel; Low Thermal Resistance with Direct Thermal Path of Die on Exposed Cathode Heat Sink Mechanical Characteristics:; Powermite is JEDEC Registered as DO-216AA; Case: Molded Epoxy; Epoxy Meets UL94V-0 at 1/8"; Weight: 62 mg (approximately); Device Marking: BCG; Lead and Mounting Surface Temperature for Soldering Purposes. 260°C Maximum | Other | MBRM130LT3G |
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MBRM140T1G
onsemi
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1 | Low Profile - Maximum Height of 1.1 mm; Small Footprint - Footprint Area of 8.45 mm2; Low VF Provides Higher Efficiency and Extends Battery Life; Supplied in 12 mm Tape and Reel; Low Thermal Resistance with Direct Thermal Path of Die on Exposed Cathode Heat Sink Mechanical Characteristics:; Powermite is JEDEC Registered as DO-216AA; Case: Molded Epoxy; Epoxy Meets UL94V-0 at 1/8"; Weight: 62 mg (approximately); Device Marking: BCJ; Lead and Mounting Surface Temperature for Soldering Purposes. 260°C Maximum | Other | MBRM140T1G |
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MBRM120LT1G
onsemi
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1 | NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; Low Profile - Maximum Height of 1.1 mm; Small Footprint - Footprint Area of 8.45 mm2; Low VF Provides Higher Efficiency and Extends Battery Life; Supplied in 12 mm Tape and Reel; Low Thermal Resistance with Direct Thermal Path of Die on Exposed Cathode Heat Sink Mechanical Characteristics:; Powermite is JEDEC Registered as DO-216AA; Case: Molded Epoxy; Powermite is JEDEC Registered as DO-216AA; Weight: 6 | Other | MBRM120LT1G |
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MUSBRM1C1M0
Amphenol
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1 | Rugged USB Type C, Input Output Connector, IP67, Right Angle, Metric Thread, no dust cover | Other | MUSBRM1C1M0 |
3
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MBRM110ET3G
onsemi
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1 | Obsolete - 1.0 A, 10 V, Schottky Power Rectifier, Surface Mount | Other | MBRM110ET3G |
3
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MBRM120ET3G
onsemi
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1 | Low Profile - Maximum Height of 1.1 mm; Small Footprint - Footprint Area of 8.45 mm2; Low VF Provides Higher Efficiency and Extends Battery Life; Supplied in 12 mm Tape and Reel; Low Thermal Resistance with Direct Thermal Path of Die on Exposed Cathode Heat Sink Mechanical Characteristics:; Powermite is JEDEC Registered as DO-216AA; Case: Molded Epoxy; Epoxy Meets UL94V-0 at 1/8"; Weight: 62 mg (approximately); Device Marking: BCV; Lead and Mounting Surface Temperature for Soldering Purposes. 260°C Maximum | Other | MBRM120ET3G |
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MBRM120ET1G
onsemi
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1 | Low Profile - Maximum Height of 1.1 mm; Small Footprint - Footprint Area of 8.45 mm2; Low VF Provides Higher Efficiency and Extends Battery Life; Supplied in 12 mm Tape and Reel; Low Thermal Resistance with Direct Thermal Path of Die on Exposed Cathode Heat Sink Mechanical Characteristics:; Powermite is JEDEC Registered as DO-216AA; Case: Molded Epoxy; Epoxy Meets UL94V-0 at 1/8"; Weight: 62 mg (approximately); Device Marking: BCV; Lead and Mounting Surface Temperature for Soldering Purposes. 260°C Maximum | Other | MBRM120ET1G |
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MBRM110LT1G
onsemi
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1 | Ultra Low VF; 1st in Marketplace with a 10 VR Schottky Rectifier; Low Profile - Maximum Height of 1.1 mm; Small Footprint - Footprint Area of 8.45 mm2; Low Thermal Resistance with Direct Thermal Path of Die on Exposed Cathode Heat Sink; ESD Protection: Human Body Model >4000 V (Class 3) Machine Model >400 V (Class C) Mechanical Characteristics:; Powermite is JEDEC Registered as D0?216AA; Case: Molded Epoxy; Epoxy Meets UL 94V-O at 1/8 inch; Weight: 62 mg (approximately); Lead and Mounting Surface Temperatur | Other | MBRM110LT1G |
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MBRM130LT3
onsemi
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1 | Diode Schottky 30V 1A 2-Pin(1+Tab) Power Mite T/R - Tape and Reel | Other | MBRM130LT3 |
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MBRM140T3
onsemi
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1 | Obsolete - Schottky Barrier Rectifier | Other | MBRM140T3 |
2
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MUSBRM1C1M06
Amphenol
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1 | USB Connectors Gen 2, Type C, RA | Other | MUSBRM1C1M06 |
3
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MUSBRM1CBQ0
Amphenol
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1 | USB Connectors Gen2 Rugged USB Type C Dual screw locking Receptacle, IP67, | Other | MUSBRM1CBQ0 |
3
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MBRM140T3G
onsemi
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1 | Low Profile - Maximum Height of 1.1 mm; Small Footprint - Footprint Area of 8.45 mm2; Low VF Provides Higher Efficiency and Extends Battery Life; Supplied in 12 mm Tape and Reel; Low Thermal Resistance with Direct Thermal Path of Die on Exposed Cathode Heat Sink Mechanical Characteristics:; Powermite is JEDEC Registered as DO-216AA; Case: Molded Epoxy; Epoxy Meets UL94V-0 at 1/8"; Weight: 62 mg (approximately); Device Marking: BCJ; Lead and Mounting Surface Temperature for Soldering Purposes. 260°C Maximum | Other | MBRM140T3G |
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MBRM120LT3
onsemi
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1 | Obsolete - 1.0 A, 30 V, Schottky Power Rectifier, Surface Mount | Other | MBRM120LT3 |
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MBRM110ET1G
onsemi
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1 | Low IR Extends Battery Life; Low Profile - Maximum Height of 1.1 mm; Small Footprint - Footprint Area of 8.45 mm2; 150°C Operating Junction Temperature; Low Thermal Resistance with Direct Thermal Path of Die on Exposed Cathode Heat Sink Mechanical Characteristics:; Powermite is JEDEC Registered as D0-216AA; Case: Molded Epoxy; Epoxy Meets UL 94V-O at 1/8 inch; Weight: 62 mg (approximately); Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Maximum for 10 Seconds; Pb-Free Packages are Avail | Other | MBRM110ET1G |
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MUSBRM1C130
Amphenol Communications Solutions
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1 | Rugged USB Type C, Input Output Connector, IP67, Right Angle, Unified Thread, no dust cover | Other | MUSBRM1C130 |
3
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Download Model | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MBRM130LT1G
onsemi
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1 | Low Profile - Maximum Height of 1.1 mm; Small Footprint - Footprint Area of 8.45 mm2; Low VF Provides Higher Efficiency and Extends battery Life; Supplied in 12 mm Tape and Reel; Low Thermal Resistance with Direct Thermal Path of Die on Exposed Cathode Heat Sink Mechanical Characteristics:; Powermite is JEDEC Registered as DO-216AA; Case: Molded Epoxy; Epoxy Meets UL94V-0 at 1/8"; Weight: 62 mg (approximately); Device Marking: BCG; Lead and Mounting Surface Temperature for Soldering Purposes. 260°C Maximum | Other | MBRM130LT1G |
3
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Download Model | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MBRM1H100T3G
onsemi
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1 | Low Profile - Maximum Height of 1.1 mm; Small Footprint - Footprint Area of 8.45 mm2; Low VF Provides Higher Efficiency and Extends Battery Life; Supplied in 12 mm Tape and Reel; Low Thermal Resistance with Direct Thermal Path of Die on Exposed Cathode Heat Sink Mechanical Characteristics:; Powermite® is JEDEC Registered as DO-216AA; Case: Molded Epoxy; Epoxy Meets UL94V-0 at 0.125 in; Weight: 16.3 mg (approximately); Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Maximum for 10 Seconds | Other | MBRM1H100T3G |
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BRM-1022-NS
American Bright Optoelectronics
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1 | Logic IC Output Optocoupler, 1-Channel, 1-Element | BRM-1022-NS |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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BRM-1420-3
American Bright Optoelectronics
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1 | Logic Output Photo IC | BRM-1420-3 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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BRM-1420-NS
American Bright Optoelectronics
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1 | Logic Output Photo IC | BRM-1420-NS |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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BRM-1020-NS
American Bright Optoelectronics
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1 | Logic IC Output Optocoupler, 1-Channel, 1-Element | BRM-1020-NS |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||