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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	SPW-405-D Premier Magnetics	0	Power Transformer	Other	SPW-405-D	3D model available Symbol and footprint available 3	1 Download Model
	R5F2M122ADSP#W4 Renesas Electronics	1	16-bit Microcontrollers - MCU R8CM12A 8+2K 1.8/5.5V -40/85C 20SSOP T&R	Small Outline Packages	R5F2M122ADSP#W4	3D model available Symbol and footprint available 3	1 Download Model
	R5F212H2SNSP#W4 Renesas Electronics	1	The R8C/2H Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/2G Group of single-chip MCUs incorporates the R8C/Tiny Series CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating m	Small Outline Packages	R5F212H2SNSP#W4	3D model available Symbol and footprint available 3	1 Download Model
	R5F21324CNSP#W4 Renesas Electronics	1	The R8C/32C Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/32C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow	Small Outline Packages	R5F21324CNSP#W4	3D model available Symbol and footprint available 3	1 Download Model

	R5F21292SNSP#W4 Renesas Electronics	1	The R8C/29 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 20-pin molded-plastic LSSOP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/29 Group has on-chip dat	Small Outline Packages	R5F21292SNSP#W4	3D model available Symbol and footprint available 3	1 Download Model
	SPW47N60C3 Infineon	1	N-channel MOSFET,SPW47N60C3 47A 650V	Transistor Outline, Vertical	SPW47N60C3	3D model available Symbol and footprint available 3	1 Download Model
	R5F213G1CNSP#W4 Renesas Electronics	1	The R8C/3GC Group is supported only for customers who have already adopted these products. The RL78/G1F, RL78/G13 Groups are recommended for new designs.The R8C/3GC Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating	Small Outline Packages	R5F213G1CNSP#W4	3D model available Symbol and footprint available 3	1 Download Model
	R5F2M120ANSP#W4 Renesas Electronics	1	The R8C/M13B Group is supported only for customers who have already adopted these products. The RL78/G1F, RL78/G1G Groups are recommended for new designs.The R8C/M11A Group and R8C/M12A Group of single-chip microcontrollers (MCUs) incorporate the R8C CPU core, which provides sophisticated instructions for a high level of efficiency. With 1Mb of address space, the CPU core is capable of executing instructions at high speed. In addition, it features a multiplier for high-speed arithmetic processing.Power cons	Small Outline Packages	R5F2M120ANSP#W4	3D model available Symbol and footprint available 3	1 Download Model
	R5F211B4SP#W4 Renesas Electronics	1	The R8C/1B Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high	Small Outline Packages	R5F211B4SP#W4	3D model available Symbol and footprint available 3	1 Download Model
	R5F21192SP#W4 Renesas Electronics	1	The R8C/19 Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded-HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high sp	Small Outline Packages	R5F21192SP#W4	3D model available Symbol and footprint available 3	1 Download Model
	R5F211B4DSP#W4 Renesas Electronics	1	The R8C/1B Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high	Small Outline Packages	R5F211B4DSP#W4	3D model available Symbol and footprint available 3	1 Download Model
	R5F212H1SNSP#W4 Renesas Electronics	1	The R8C/2H Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/2G Group of single-chip MCUs incorporates the R8C/Tiny Series CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating m	Small Outline Packages	R5F212H1SNSP#W4	3D model available Symbol and footprint available 3	1 Download Model
	R5F2M122ANSP#W4 Renesas Electronics	1	The R8C/M13B Group is supported only for customers who have already adopted these products. The RL78/G1F, RL78/G1G Groups are recommended for new designs.The R8C/M11A Group and R8C/M12A Group of single-chip microcontrollers (MCUs) incorporate the R8C CPU core, which provides sophisticated instructions for a high level of efficiency. With 1Mb of address space, the CPU core is capable of executing instructions at high speed. In addition, it features a multiplier for high-speed arithmetic processing.Power cons	Small Outline Packages	R5F2M122ANSP#W4	3D model available Symbol and footprint available 3	1 Download Model
	R5F2M121ANSP#W4 Renesas Electronics	1	The R8C/M13B Group is supported only for customers who have already adopted these products. The RL78/G1F, RL78/G1G Groups are recommended for new designs.The R8C/M11A Group and R8C/M12A Group of single-chip microcontrollers (MCUs) incorporate the R8C CPU core, which provides sophisticated instructions for a high level of efficiency. With 1Mb of address space, the CPU core is capable of executing instructions at high speed. In addition, it features a multiplier for high-speed arithmetic processing.Power cons	Small Outline Packages	R5F2M121ANSP#W4	3D model available Symbol and footprint available 3	1 Download Model
	R5F211B2SP#W4 Renesas Electronics	1	The R8C/1B Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high	Small Outline Packages	R5F211B2SP#W4	3D model available Symbol and footprint available 3	1 Download Model

	R5F213G4CNSP#W4 Renesas Electronics	1	The R8C/3GC Group is supported only for customers who have already adopted these products. The RL78/G1F, RL78/G13 Groups are recommended for new designs.The R8C/3GC Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating	Small Outline Packages	R5F213G4CNSP#W4	3D model available Symbol and footprint available 3	1 Download Model
	R5F213G6CNSP#W4 Renesas Electronics	1	The R8C/3GC Group is supported only for customers who have already adopted these products. The RL78/G1F, RL78/G13 Groups are recommended for new designs.The R8C/3GC Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating	Small Outline Packages	R5F213G6CNSP#W4	3D model available Symbol and footprint available 3	1 Download Model
	R5F21322DNSP#W4 Renesas Electronics	1	The R8C/32D Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/32D Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow	Small Outline Packages	R5F21322DNSP#W4	3D model available Symbol and footprint available 3	1 Download Model
	R5F212J1SNSP#W4 Renesas Electronics	1	The R8C/2J Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/2H Group and R8C/2J Group of single-chip MCUs incorporate the R8C/Tiny Series CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the suppo	Small Outline Packages	R5F212J1SNSP#W4	3D model available Symbol and footprint available 3	1 Download Model
	R5F21284JSP#W4 Renesas Electronics	1	The R8C/28 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data	Small Outline Packages	R5F21284JSP#W4	3D model available Symbol and footprint available 3	1 Download Model
	R5F21142SP#W4 Renesas Electronics	1	16-bit Microcontrollers - MCU MCU 3/5V 8K Pb-Free 20-SSOP T&R	Small Outline Packages	R5F21142SP#W4	3D model available Symbol and footprint available 3	1 Download Model
	R5F2M110ANSP#W4 Renesas Electronics	1	The R8C/M12A Group is supported only for customers who have already adopted these products. The RL78/G12, RL78/G11 Groups are recommended for new designs.The R8C/LA3A Group, R8C/LA5A Group, R8C/LA6A Group, and R8C/LA8A Group of single-chip MCUs incorporate the R8C CPU core, which implements a powerful instruction set for a high level of efficiency and supports a 1Mb address space, allowing execution of instructions at high speed. In addition, the CPU core integrates a multiplier for high-speed operation pro	Small Outline Packages	R5F2M110ANSP#W4	3D model available Symbol and footprint available 3	1 Download Model
	R5F212J0SNSP#W4 Renesas Electronics	1	The R8C/2J Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/2H Group and R8C/2J Group of single-chip MCUs incorporate the R8C/Tiny Series CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the suppo	Small Outline Packages	R5F212J0SNSP#W4	3D model available Symbol and footprint available 3	1 Download Model
	R5F21284SDSP#W4 Renesas Electronics	1	The R8C/28 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data	Small Outline Packages	R5F21284SDSP#W4	3D model available Symbol and footprint available 3	1 Download Model
	R5F21294SDSP#W4 Renesas Electronics	1	The R8C/29 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 20-pin molded-plastic LSSOP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/29 Group has on-chip dat	Small Outline Packages	R5F21294SDSP#W4	3D model available Symbol and footprint available 3	1 Download Model
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