Part Image

72V273L10PFG8 - Renesas Electronics

Description: The 72V273 32K x 9/16K x 18 SuperSync II FIFO memory has flexible x9/x18 Bus-Matching on both read and write ports. The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated. SuperSync II FIFOs are appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match buses of unequal sizes.

Download 72V273L10PFG8 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
72V273L10PFG8 - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - PNG80--
click to zoom
3D Models
72V273L10PFG8 - Renesas Electronics  - 3D model - Quad Flat Packages - PNG80--
click to zoom

72V273L10PFG8 Details

  • Manufacturer Part Number:

    72V273L10PFG8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TQFP

  • Pin Count:

    80

  • Manufacturer Package Code:

    PNG80

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    6.5 ns

  • Additional Feature:

    IT CAN ALSO BE CONFIGURED AS 32K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE

  • Cycle Time:

    10 ns

  • JESD-30 Code:

    S-PQFP-G80

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Memory Density:

    294912 bit

  • Memory IC Type:

    OTHER FIFO

  • Memory Width:

    18

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    80

  • Number of Words:

    16384 words

  • Number of Words Code:

    16000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    16KX18

  • Output Enable:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LQFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.6 mm

  • Supply Current-Max:

    0.03 mA

  • Supply Voltage-Max (Vsup):

    3.45 V

  • Supply Voltage-Min (Vsup):

    3.15 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Width:

    14 mm

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

72V273L10PFG8 Overview

Use the download button to access the 72V273L10PFG8 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like 72V27, or try a keyword search, such as FIFOs

Parts related to 72V273L10PFG8

Showing 0 results

72V273L10PFG8 Alternates

Showing results

Image Part Number Model
Part Image 72V273L10PFG Integrated Device Technology Inc

FIFO, 16KX18, 6.5ns, Synchronous, CMOS, PQFP80

Part Image 72V273L10PFG8 Integrated Device Technology Inc

FIFO, 16KX18, 6.5ns, Synchronous, CMOS, PQFP80

Part Image IDT72V273L10PFI9 Integrated Device Technology Inc

FIFO, 16KX18, 6.5ns, Synchronous, CMOS, PQFP80

Part Image 72V273L10PFI Integrated Device Technology Inc

FIFO, 16KX18, 6.5ns, Synchronous, CMOS, PQFP80

Part Image 72V273L10PFI9 Integrated Device Technology Inc

FIFO, 16KX18, 6.5ns, Synchronous, CMOS, PQFP80

For a full list of alternate parts for 72V273L10PFG8, check out Findchips.com