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72V293L7-5PFGI - Renesas Electronics

Description: The 72V293 128K x 9/64K x 18 SuperSync II FIFO memory has flexible x9/x18 Bus-Matching on both read and write ports. The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated. SuperSync II FIFOs are appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match buses of unequal sizes.

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72V293L7-5PFGI Details

  • Manufacturer Part Number:

    72V293L7-5PFGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TQFP

  • Pin Count:

    80

  • Manufacturer Package Code:

    PNG80

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    5

  • Access Time-Max:

    5 ns

  • Additional Feature:

    IT CAN ALSO BE CONFIGURED AS 128K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE

  • Alternate Memory Width:

    9

  • Clock Frequency-Max (fCLK):

    133.3 MHz

  • Cycle Time:

    7.5 ns

  • JESD-30 Code:

    S-PQFP-G80

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Memory Density:

    1179648 bit

  • Memory IC Type:

    OTHER FIFO

  • Memory Width:

    18

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    80

  • Number of Words:

    65536 words

  • Number of Words Code:

    64000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    64KX18

  • Output Enable:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LQFP

  • Package Equivalence Code:

    QFP80,.64SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Standby Current-Max:

    0.015 A

  • Supply Current-Max:

    0.035 mA

  • Supply Voltage-Max (Vsup):

    3.45 V

  • Supply Voltage-Min (Vsup):

    3.15 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

72V293L7-5PFGI Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout in their application note (APN) or design guide, which includes guidelines for thermal vias, copper pours, and component placement to ensure optimal thermal performance.
  • The power-up sequence is critical for this device. Renesas recommends a specific power-up sequence, which is typically outlined in the datasheet or application note. This sequence ensures that the internal voltage regulators and other circuitry are properly initialized.
  • Renesas typically provides recommendations for decoupling capacitors in the datasheet or application note. The recommended capacitors are usually based on the device's power supply requirements and noise sensitivity.
  • Renesas provides troubleshooting guides and FAQs on their website or through their support channels. These resources can help engineers identify and resolve common issues. Additionally, analyzing the device's status registers and error flags can provide valuable insights into the problem.
  • Yes, Renesas provides guidelines for EMI/EMC design considerations in their application notes or datasheets. These guidelines cover topics such as PCB layout, shielding, and filtering to minimize electromagnetic interference and ensure compliance with regulatory standards.

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72V293L7-5PFGI Overview

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